Printed Circuit Design & Fab - June 2008 - (Page 32)

FROM THE FIELD design process where the product planning first interfaces with system-level conceptual design. He also talked about changes occurring in the EU related to low power design. Dr. How-Siang Yap of Agilent EEsof EDA talked about mixed-technology RF products and tools that will enable co-design of the PCB, package and IC. This approach will offer opportunities to optimize cost, size and performance of electronic systems and is much needed today to meet economic and time-to-market constraints. Josh Moore of Cadence commented that seamless integration is critical in electronics design becuase of the increased complexity. Designs have a higher-level abstraction, requiring advanced automation techniques. Mentor’s John Isaac talked about the need for continuous, incremental improvements to the design process in addition to the occasional major technology leap. To deliver these types of advances, the industry needs to get better at collaborating and breaking down barriers between disciplines. There were more than a few revelations. When asked when simulation tools for ground return modeling would be available, it was revealed the capability exists in a new Agilent / Mentor tool. The session served the dual purpose of enlightening designers on current tools while allowing them to voice opinions about specific immediate needs. Mentor’s John Isaac speaks at the “Next Generation EDA Tools” session. bi-directionally.” It was evident from the discussions that collaboration is certainly at the core of this company’s success. Next-Gen Design Tools During the conference, key PCB design tools vendors talked about the challenges facing designers and potentially disruptive technologies on the horizon. The connecting themes of collaboration, convergence, co-design, communication – the 4 Cs – ran through each presentation. Nikola Kontic of Zuken brought forward the importance of putting 3-D design tools to the front end of the December 2-4, 2008 Orlando Metropolitan Resort Orlando, FL www.pcbshows.com/orlando Interested in exhibiting? An exciting addition to the PCB Shows portfolio of events for designers and fabricators Bringing you the best of our renowned and respected conferences and seminars to Orlando, FL Featuring • 3-day targeted technical conference • 1-day tabletop exhibition • Great networking opportunities Brought to you by 32 PRINTED CIRCUIT DESIGN & FAB JUNE 2008 http://www.pcbshows.com/orlando http://www.orlandometropolitanresort.com/ http://www.pcbshows.com/orlando http://www.pcbshows.com/orlando/exhibition/ http://www.upmediagroup.com

Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - June 2008

Printed Circuit Design & Fab - June 2008 Contents Our Line Market Watch Around the World Happenings ROI Tip Jar Interconnect Strategies Final Finish Forum DFA/DFT Signal Integrity From the Field DFA Fab Basics Drill Off the Shelf Marketplace Ad Index BGA Bulletin

Printed Circuit Design & Fab - June 2008

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