Printed Circuit Design & Fab - June 2008 - (Page 33)

FROM thE FiEld ‘Jam-Packed’ Conference The one and one-half day exhibition featured products and services for PCB design and fabrication. Fabricators like Dynamic & Proto Circuits and Sierra Circuits showcased PCB, layout and engineering services. Design tool suppliers including EMA Design Automation, DownStream Technologies, Mentor Graphics and Intercept Technology provided hands-on test-drives for prospective designers. Laminate suppliers Rogers and DuPont featured new products for high-speed, RoHS and embedded capacitance applications. For more information go to pcdandf.com/cms/content/ category/17/217/216/. The PCB East attendees had the opportunity to meet notable authors on the show floor on Tuesday afternoon. Charles Pfeil of Mentor, a conference speaker and columnist for Printed Circuit Design and Fab, distributed signed copies of his recently released book, BGA Breakout and Routing. Ralph Morrison, another speaker at PCB East, presented, Grounding and Shielding – Circuits and Interference, 5th Edition. Clyde F. Coombs talked about updates to the seminal, The Printed Circuits Handbook, 6th Edition. The PCB East conference program was jam-packed with technical content. The five-day program included over 40 topics. The two-day, full day and one-half day courses and workshops where geared toward educating designers in topics like high-speed, EMI and crosstalk, RF/microwave design, PCB layout, HDI techniques and embedded passive design. Over 65% of the program this year was new. Some of the highlights included a half-day seminar titled, Design Principles for BGA, CSP and 3-D Package Technologies, taught by Vern Solberg. Solberg discussed the design and manufacturing changes needed to address new finer-pitch ICs. The seminar compared different commonly used packaging technologies. Because of the density associated with these miniatures IC packages, optimized design layout, land pattern geometry refinement and quality substrate materials are critical to manufacturing efficiency and product reliability. Another timely workshop, Power System Design in High-Speed PCBs, was taught by Rick Hartley, L-3 Communications. Hartley discussed optimization of power system design (PSD) including the major components of the power bus, the power distribution path, medium- and high-frequency decoupling concerns, the importance of IC pin assignments and the performance of power/ground planes. He covered decoupling placement, real performance of capacitors, how much decoupling is enough, why to use one value of capacitor versus another, anti-resonant peaks and the importance of board stack-up in PSD. It all added up to an educationally packed week. If you missed PCB East, you can join us at PCB West, September 14 – 19, 2008, at the Marriot, Santa Clara, CA. Don’t miss the opportunity to network with your peers and learn some new skills. pcd&f The Strong Silent Type Si l Integrity I t Signal I t it Interconnects with Rugged Features t ith R dF t www.samtec.com/ruggedsi JUNE 2008 StrongSilent_PCDM.indd 1 6640 SAM printEd circuit dESign & fAB PM 33 9/19/07 1:09:25 http://pcdandf.com/cms/content/category/17/217/216/ http://pcdandf.com/cms/content/category/17/217/216/ http://www.samtec.com/ruggedsi

Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - June 2008

Printed Circuit Design & Fab - June 2008 Contents Our Line Market Watch Around the World Happenings ROI Tip Jar Interconnect Strategies Final Finish Forum DFA/DFT Signal Integrity From the Field DFA Fab Basics Drill Off the Shelf Marketplace Ad Index BGA Bulletin

Printed Circuit Design & Fab - June 2008

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