Printed Circuit Design & Fab - June 2008 - (Page 43)

MACHINES MATERIALS TOOLS SYSTEMS SOFTWARE ! ! ! MUSTANG AOI FOR PCB INSPECTION The Mustang line of AOI systems replaces visual inspection by reliably detecting defects in high density PCBs. The system is equipped with a sensitive CCD camera and two illumination systems, one for plated metallic surfaces and one for other solder mask colors. The system provides fast data processing and analysis increasing panel throughput. The system’s image acquisition and processing engine will detect fine defects and micro-cracks. WHO: Camtek WEB: camtek.co.il PLASMA ETCH ADVANTAGE 16E The Advantage 16e system was reportedly designed to help the company stop the counterfeiting of its systems. The scaled-down product has fewer operational controls in order to tailor its price point for the Asian manufacturer. The company states that the product features a horizontal planar electrode configuration, a vacuum pump and booster blower, and a unitary chassis design for quick-turn installation without technical support. WHO: Plama etch WEB: plasmaetch.com HOLE DOCTOR VERIFICATION SYSTEM FOR PCB FABRICATION The Machvision Hole Doctor verification system for PCB fabrication is an in line system for the inspection and verification of hole count, hole diameter, location accuracy and hole quality on rigid, microvia/HDI, and flexible PCBs, and can be used after drilling, desmearing and plating or for final inspection or QC. The system inspects for plugged holes, improper hole diameters, poor drilling accuracy, and other parameters using an XP-based sPC software package. WHO: Christopher Associates Inc. WEB: christopherweb.com OTHERS OF NOTE ELPEMER PHOTOIMAGEABLE SOLDER X-MET5000XRF ANALYzER FOR RESISTS ELEMENT ANALYSIS elpemer sD 2491 sM-TsW and sD 2691 TsW yellowing-stable photoimageable solder resist and marking ink. The whiteopaque photoimageable solder resist and corresponding marking ink meet the requirements of the optoelectronics industry. The products are applied by screen printing and developed in aqueous-alkaline media. The product meets the requirements of IPC-sM-840D, are UL 94 V-0 and halogen-free. WHO: Lackwerke Peters WEB: peters.de LAYER CLEAN NP CLEANER Layer Clean NP is a new acid, nonchelating, nonchloride cleaner that contains no phosphates. The cleaner reportedly removes chromate conversion coating, fingerprints and oxides from copper laminate. When used prior to photo resist lamination, it reduces imaging defects by improving photo resist adhesion. Available in both spray and soak applications, the product provides claimed quick cleaning at low concentrations, is non-etching and suitable for use with very thin copper foils. WHO: RBP Chemical Technology WEB: rbpchemical.com The X-MeT5000 hand-held X-ray fluorescence (XRF) analyzer detects the presence of metals, restricted elements for fast analysis and lower detection limits for elements of interest. The analyzer is IP54 (NeMA 3) has approved for dust and splash protection extended battery life. User programmable software delivers highly accurate results or reliable identification, and will automatically choose the best XRF analysis method. An optional bench-top stand enables hands-free operation. WHO: Oxford Instruments WEB: oxford-instruments.com SIGNAL AND POWER INTEGRITY, AND EMC/EMI SIMULATIONS PCB studio allows the analysis of signal and power integrity, and the simulation of eMC and eMI effects on PCBs. The product integrates of design flows from well known software. PCB studio allows analysis in time and frequency domain in 2D and 3D, skin effect and electric losses in time and frequency domain, interfaces with sPICe equivalent tools, IBIs model import, and Microwave studio for 3D analysis (eMI), 2D BeM (Transmission Line) and 3D PeeC implementation, and cable and PCB cosimulation for eMI analysis. WHO: CsT WEB: cst.com ISPLEVER 7.1 TO OPTIMIzE I/O PLACEMENT The ispLeVeR 7 software allows FPGA .1 designers to analyze and optimize I/O pin placement and output switching characteristics to minimize undesirable noise and ground bounce on a PCB. The design tool claims to deliver up to 30% faster FPGA design compile times and can support multi-processor powered design compilation. Additionally, an included power calculator allows FPGA designers to analyze and optimize power requirements early in the design process block level by the changing of design environment variables. WHO: Lattice semiconductor Corp. WEB: latticesemi.com ST10-LC909 POLYIMIDE The sT10-LC909 polyimide product is a replacement for Thermount and Copper Invar Copper for control the thermal expansion of PCBs. The product closely matches ceramic and flip-chip type low coefficient of thermal expansion (CTe) components. Product claims similar performance compared to polyimide and Copper Invar Copper or Thermount materials when using standard polyimide with sT10-LC909 layers embedded into the PCB. CTe target range is 9ppm/°C to 12ppm/°C, with a low Z-axis expansion. WHO: stablcor WEB: stablcor.com JUNE 2008 printEd circuit dESign & fAB 43 http://www.plasmaetch.com http://www.christopherweb.com http://www.camtek.co.il http://www.peters.de http://www.oxford-instruments.com http://www.rbpchemical.com http://www.stablcor.com http://www.cst.com http://www.latticesemi.com

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Printed Circuit Design & Fab - June 2008 Contents Our Line Market Watch Around the World Happenings ROI Tip Jar Interconnect Strategies Final Finish Forum DFA/DFT Signal Integrity From the Field DFA Fab Basics Drill Off the Shelf Marketplace Ad Index BGA Bulletin

Printed Circuit Design & Fab - June 2008

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