Printed Circuit Design & Fab - August 2008 - (Page 39)

outSourcinG rEfErEncES 1 Microvias for Low Cost, high Density Interconnect. John h. Lau, S. W. Ricky Lee. 2 The Progress of the ALIvh Substrate. Daizo A., yoshihiro T., Tadashi N., Fumio e. 3 IPC A-610 Rev D – Acceptability of electronic Assemblies. 4 IPC 7095 – Design and Assembly Process Implementation for BGAs. 5 IPC 9701 – Performance Test Methods and Qualification Requirements of Surface Mount Solder Attachments. 6 “Control and Stability in Lead Free Reflow, SMT. R. Burke, Sept. 2006, vol. ” fiGurE 7. Top three part number defects. 20, No. 9, pp. 24 - 26, 28. analysis data, and corrective action plans were defined. To assist the supplier teams in finding the root causes of defects, specific information was provided, rather than general DPPM bar charts. DPPM data was broken down into the top three defects and top three part numbers where problems occurred to enable the suppliers to first “root cause” the major issues and minimize their impact on production. An example is shown in fiGurES 6 and 7. MuMtaZ y. bora is a principal quality engineer at Kyocera Wireless Corp. and can be reached at mbora@kyocera-wire less.com. The Best of Our Industry is Coming Together for You — One Show … One Place! Conflict Resolution The differences in operations, parts management, chargeback system and language at the CM did result in conflicts concerning scrap charges. In these cases, the OEM had to intervene and ensure that a fair resolution of the chargeback was taking place. The failure analysis was evaluated to ensure that the correct root cause was determined. If it was a supplier fabrication issue, the supplier was charged. If it was a process-induced defect such as uncontrolled rework, the CM was charged. If both parties contributed, the charge was split. Training/Knowledge Base The labor force in the CM factory was primarily a very young group with not a lot of experience or training time. Proper monitoring of training levels is important for good yield and product reliability. This is also essential due to employee turnover. Tight control should be maintained over all process changes, engineering change orders (ECOs), manufacturing change orders (MCOs), etc. OEM-led training sessions in product handling, test, storage and inspection have also improved yields. GET INTERCONNECTED The conference at IPC Midwest was very enlightening and well attended. The sessions were really helpful to questions we face on a daily basis. Mark Orzech, Coretec USA Inc., Round Rock, Texas If you need to see electronics assembly or PCB equipment, you need to be at this show! PRINTED BOARDS ELECTRONICS ASSEMBLY TEST TM Conclusion Outsourcing assembly operations gives OEMs the advantage of high-volume manufacturing capacity, massive database systems and corporate direction. However, it also brings many new challenges in cultural differences, communication barriers and skill levels that we have not experienced with U.S. PCB manufacturing. Clear, concise communication, documentation, patience and teamwork between suppliers and CMs are just a few ways to ensure success. pcd&f Keep up with global changes in technology, standards and customer expectations. Sunday–Thursday, September 21–25, 2008 Renaissance Schaumburg Hotel & Convention Center Schaumburg, Ill www.IPCMidwestShow.org AUGUST 2008 printEd circuit dEsign & faB 39 mbora@kyocera-wireless.com http://www.IPCMidwestShow.org http://www.IPCMidwestShow.org

Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - August 2008

Printed Circuit Design & Fab - July 2008 Contents Our Line Market Watch Around the World Happenings ROI Tip Jar Software Performance Interconnect Strategies Final Finish Forum Product Development Challenges in a Global Market Innovative Modeling Supports Co-Design of the Power Supply Chain, Part 2 Low-Loss Fluoropolymer Copper Clad Laminate Qualifying PCBs Outsourced in Asia Copper Plating and Microvia Fill for Advanced PCBs Off the Shelf Marketplace Ad Index BGA Bulletin

Printed Circuit Design & Fab - August 2008

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