Printed Circuit Design & Fab - August 2008 - (Page 43) MACHINES MATERIALS TOOLS SYSTEMS SOFTWARE ! ! CUSTOM LAMINATEd BUS BAR dESIgN gUIdE Circuit Components Inc. (CCI) releases a design guide for custom laminated bus bars. This design guide, written by the Bussco bus bar engineering team of CCI, is intended to provide general guidelines for all those involved in the procurement or design of custom laminated bus bars. It covers design and product construction considerations. It contains useful formulas and data for the typical materials used in the construction of bus bars. who: Circuit Components Inc. wEB: cci-msc.com HORIzONTAL BLACK OxIdE pROCESS EqUIpMENT The hMS ComTech process equipment has a titanium module that can run at higher temperatures associated with the oxide treatment step. According to hMS höllmüller, higher operating temperatures combined with a unique solution application mechanism and special flooding system results in a homogeneous surface treatment and uniform oxide development with improved bonding characteristics. who: hMS höllmüller wEB: hmsweb.de/ AOI INSpECTION ANd REpAIR PerFix Automated optical Repair System (AoR), to automatically check PCBs for shorts and excess copper. The company states that the system is the first of its kind in the bare PCB production industry. According to the company, the use of the new system will greatly reduce the scrapping of PCB panels. The tool uses image acquisition used in orbotech's SIP AoI system. who: orbotech Ltd. wEB: orbotech.com OTHERS OF NOTE FREE dESIgN SOFTWARE TRAIL CADSTAR express is an easy, ready to use, powerful desktop PCB design solution that inlcudes all the latest features of CADSTAR 10.0, with a limit of 300 pins and 50 components. Users can download this tool from Zuken’s website for a free evaluation. It includes a back annotation function, that makes file transfer from PCB into schematic for engineering change orders easier to do. The free download includes the ability to view samples of CADSTAR exchange, a 200,000 component on-line library. who: Zuken wEB zuken.com COppER ANd LEAd TEST KIT CopperCheck and LeadCheck Swabs are for applications in the printed circuit board and electronics industries. The test kits can detect metals such as lead, nickel, cadmium, copper and mercury. The swab is squeezed to activate chemicals and rubbed over a clean dry surface, if a pink/purple color appears, copper is present. In laboratory tests the swabs successfully detected copper levels as low as one microgram. who: hybrivet Systems wEB: leadcheck.com TEST COUpON gENERATOR The Automatic Coupon Generator is said to speed impedance test coupons generation compared to manual or scripted systems. Designed for use with Speedstack PCB or Speedstack Si PCB stackup design and documentation systems. Imports complete stack-up designs directly from Speedstack, and compiles them with the user’s preferred coupon format and chosen test probe style. Automatically produces an RS-274x extended Gerber file and drill file, which can be exported to the CAM system. who: Polar Instruments wEB: polarinstruments.com WORK IN-pROCESS SOFTWARE Data Miner 2.0 data reporting software for manufacturing reportedly streamlines how manufacturing engineers, managers, and corporate executives access manufacturing information and create reports. Users can retrieve, visualize, interrogate, and report on process, quality, production WIP traceability, and performance informa, tion, while providing an interactive way for users to incorporate historical manufacturing data in preconfigured reports without using SQL. who: Ageis wEB: aiscorp.com ROHS COMpLIANT ELECTROLESS NICKEL TechnieNickel AT 5500 is a lead-free and cadmium-free electroless nickel formulation specifically designed for printed circuit board applications. According to the company, proprietary stabilizers in the TechnieNickel process produces a mid-phosphorus deposit that addresses industry issues like skip plating, edge pull back and black pad. In production TechnieNickel AT 5500 has demonstrated improved in-tank stability and eliminated problems including poor electroless nickel coverage. who: Technic Inc. wEB: technic.com INTEgRATEd pARTS dATABASE eMA Design Automation has integrated the Digi-Key engineering and part database into Cadence orCAD. eMA integrated the Digi-Key database into orCAD by creating the eMA Component Information Portal (CIP), to update the Component Information System (CIS) database. With the addition of the interface, new part requests can now come directly from Digi-Key along with related part information. who: eMA Design Automation wEB: ema-eda.com/Digi-Key AUGUST 2008 printEd circuit dEsign & faB 43 http://www.cci-msc.com http://www.hmsweb.de http://www.orbotech.com http://www.leadcheck.com http://www.zuken.com http://www.polarinstruments.com http://www.technic.com http://www.aiscorp.com http://www.ema-eda.com/Digi-Key
Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - August 2008 Printed Circuit Design & Fab - July 2008 Contents Our Line Market Watch Around the World Happenings ROI Tip Jar Software Performance Interconnect Strategies Final Finish Forum Product Development Challenges in a Global Market Innovative Modeling Supports Co-Design of the Power Supply Chain, Part 2 Low-Loss Fluoropolymer Copper Clad Laminate Qualifying PCBs Outsourced in Asia Copper Plating and Microvia Fill for Advanced PCBs Off the Shelf Marketplace Ad Index BGA Bulletin Printed Circuit Design & Fab - August 2008 Printed Circuit Design & Fab - August 2008 - Printed Circuit Design & Fab - July 2008 (Page Cover1) Printed Circuit Design & Fab - August 2008 - Printed Circuit Design & Fab - July 2008 (Page Cover2) Printed Circuit Design & Fab - August 2008 - Printed Circuit Design & Fab - July 2008 (Page 1) Printed Circuit Design & Fab - August 2008 - Contents (Page 2) Printed Circuit Design & Fab - August 2008 - Contents (Page 3) Printed Circuit Design & Fab - August 2008 - Our Line (Page 4) Printed Circuit Design & Fab - August 2008 - Our Line (Page 5) Printed Circuit Design & Fab - August 2008 - Market Watch (Page 6) Printed Circuit Design & Fab - August 2008 - Market Watch (Page 7) Printed Circuit Design & Fab - August 2008 - Around the World (Page 8) Printed Circuit Design & Fab - August 2008 - Around the World (Page 9) Printed Circuit Design & Fab - August 2008 - Around the World (Page 10) Printed Circuit Design & Fab - August 2008 - Around the World (Page 11) Printed Circuit Design & Fab - August 2008 - Happenings (Page 12) Printed Circuit Design & Fab - August 2008 - Happenings (Page 13) Printed Circuit Design & Fab - August 2008 - ROI (Page 14) Printed Circuit Design & Fab - August 2008 - ROI (Page 15) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page 16) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W1) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W2) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W3) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W4) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W5) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W6) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W7) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W8) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W9) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W10) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W11) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W12) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W13) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W14) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W15) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W16) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page 17) Printed Circuit Design & Fab - August 2008 - Software Performance (Page 18) Printed Circuit Design & Fab - August 2008 - Software Performance (Page 19) Printed Circuit Design & Fab - August 2008 - Interconnect Strategies (Page 20) Printed Circuit Design & Fab - August 2008 - Interconnect Strategies (Page 21) Printed Circuit Design & Fab - August 2008 - Interconnect Strategies (Page 22) Printed Circuit Design & Fab - August 2008 - Final Finish Forum (Page 23) Printed Circuit Design & Fab - August 2008 - Product Development Challenges in a Global Market (Page 24) Printed Circuit Design & Fab - August 2008 - Product Development Challenges in a Global Market (Page 25) Printed Circuit Design & Fab - August 2008 - Product Development Challenges in a Global Market (Page 26) Printed Circuit Design & Fab - August 2008 - Product Development Challenges in a Global Market (Page 27) Printed Circuit Design & Fab - August 2008 - Innovative Modeling Supports Co-Design of the Power Supply Chain, Part 2 (Page 28) Printed Circuit Design & Fab - August 2008 - Innovative Modeling Supports Co-Design of the Power Supply Chain, Part 2 (Page 29) Printed Circuit Design & Fab - August 2008 - Innovative Modeling Supports Co-Design of the Power Supply Chain, Part 2 (Page 30) Printed Circuit Design & Fab - August 2008 - Low-Loss Fluoropolymer Copper Clad Laminate (Page 31) Printed Circuit Design & Fab - August 2008 - Low-Loss Fluoropolymer Copper Clad Laminate (Page 32) Printed Circuit Design & Fab - August 2008 - Low-Loss Fluoropolymer Copper Clad Laminate (Page 33) Printed Circuit Design & Fab - August 2008 - Low-Loss Fluoropolymer Copper Clad Laminate (Page 34) Printed Circuit Design & Fab - August 2008 - Low-Loss Fluoropolymer Copper Clad Laminate (Page 35) Printed Circuit Design & Fab - August 2008 - Qualifying PCBs Outsourced in Asia (Page 36) Printed Circuit Design & Fab - August 2008 - Qualifying PCBs Outsourced in Asia (Page 37) Printed Circuit Design & Fab - August 2008 - Qualifying PCBs Outsourced in Asia (Page 38) Printed Circuit Design & Fab - August 2008 - Qualifying PCBs Outsourced in Asia (Page 39) Printed Circuit Design & Fab - August 2008 - Copper Plating and Microvia Fill for Advanced PCBs (Page 40) Printed Circuit Design & Fab - August 2008 - Copper Plating and Microvia Fill for Advanced PCBs (Page 41) Printed Circuit Design & Fab - August 2008 - Copper Plating and Microvia Fill for Advanced PCBs (Page 42) Printed Circuit Design & Fab - August 2008 - Off the Shelf (Page 43) Printed Circuit Design & Fab - August 2008 - Marketplace (Page 44) Printed Circuit Design & Fab - August 2008 - Marketplace (Page 45) Printed Circuit Design & Fab - August 2008 - Marketplace (Page 46) Printed Circuit Design & Fab - August 2008 - Ad Index (Page 47) Printed Circuit Design & Fab - August 2008 - BGA Bulletin (Page 48) Printed Circuit Design & Fab - August 2008 - BGA Bulletin (Page Cover3) Printed Circuit Design & Fab - August 2008 - BGA Bulletin (Page Cover4)
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