Printed Circuit Design & Fab - August 2008 - (Page Cover2) Improve Your Circuit Design Productivity NI Multisim interactive circuit design and simulation NI LabVIEW analysis for comparison of real-world and simulated data NI Ultiboard board layout and routing With the integrated NI Multisim, Ultiboard, and LabVIEW platform, you can interactively design, simulate, prototype, and validate your circuit designs. Easily explore circuit behavior with intuitive Multisim simulation, and use NI LabVIEW to integrate real measurements to improve the design model, accurately evaluate performance, and identify errors before prototyping. Finally, export designs to Ultiboard for layout and seamlessly compare simulated and real prototype measurements through tight LabVIEW integration. >> Test-drive Multisim at ni.com/multisim 800 263 5552 ©2008 National Instruments. All rights reserved. LabVIEW, Multisim, National Instruments, NI, ni.com, and Ultiboard are trademarks of National Instruments. Other product and company names listed are trademarks or trade names of their respective companies. 2008-9748-821-101-D http://ni.com/multisim http://ni.com/multisim
Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - August 2008 Printed Circuit Design & Fab - July 2008 Contents Our Line Market Watch Around the World Happenings ROI Tip Jar Software Performance Interconnect Strategies Final Finish Forum Product Development Challenges in a Global Market Innovative Modeling Supports Co-Design of the Power Supply Chain, Part 2 Low-Loss Fluoropolymer Copper Clad Laminate Qualifying PCBs Outsourced in Asia Copper Plating and Microvia Fill for Advanced PCBs Off the Shelf Marketplace Ad Index BGA Bulletin Printed Circuit Design & Fab - August 2008 Printed Circuit Design & Fab - August 2008 - Printed Circuit Design & Fab - July 2008 (Page Cover1) Printed Circuit Design & Fab - August 2008 - Printed Circuit Design & Fab - July 2008 (Page Cover2) Printed Circuit Design & Fab - August 2008 - Printed Circuit Design & Fab - July 2008 (Page 1) Printed Circuit Design & Fab - August 2008 - Contents (Page 2) Printed Circuit Design & Fab - August 2008 - Contents (Page 3) Printed Circuit Design & Fab - August 2008 - Our Line (Page 4) Printed Circuit Design & Fab - August 2008 - Our Line (Page 5) Printed Circuit Design & Fab - August 2008 - Market Watch (Page 6) Printed Circuit Design & Fab - August 2008 - Market Watch (Page 7) Printed Circuit Design & Fab - August 2008 - Around the World (Page 8) Printed Circuit Design & Fab - August 2008 - Around the World (Page 9) Printed Circuit Design & Fab - August 2008 - Around the World (Page 10) Printed Circuit Design & Fab - August 2008 - Around the World (Page 11) Printed Circuit Design & Fab - August 2008 - Happenings (Page 12) Printed Circuit Design & Fab - August 2008 - Happenings (Page 13) Printed Circuit Design & Fab - August 2008 - ROI (Page 14) Printed Circuit Design & Fab - August 2008 - ROI (Page 15) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page 16) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W1) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W2) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W3) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W4) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W5) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W6) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W7) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W8) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W9) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W10) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W11) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W12) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W13) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W14) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W15) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W16) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page 17) Printed Circuit Design & Fab - August 2008 - Software Performance (Page 18) Printed Circuit Design & Fab - August 2008 - Software Performance (Page 19) Printed Circuit Design & Fab - August 2008 - Interconnect Strategies (Page 20) Printed Circuit Design & Fab - August 2008 - Interconnect Strategies (Page 21) Printed Circuit Design & Fab - August 2008 - Interconnect Strategies (Page 22) Printed Circuit Design & Fab - August 2008 - Final Finish Forum (Page 23) Printed Circuit Design & Fab - August 2008 - Product Development Challenges in a Global Market (Page 24) Printed Circuit Design & Fab - August 2008 - Product Development Challenges in a Global Market (Page 25) Printed Circuit Design & Fab - August 2008 - Product Development Challenges in a Global Market (Page 26) Printed Circuit Design & Fab - August 2008 - Product Development Challenges in a Global Market (Page 27) Printed Circuit Design & Fab - August 2008 - Innovative Modeling Supports Co-Design of the Power Supply Chain, Part 2 (Page 28) Printed Circuit Design & Fab - August 2008 - Innovative Modeling Supports Co-Design of the Power Supply Chain, Part 2 (Page 29) Printed Circuit Design & Fab - August 2008 - Innovative Modeling Supports Co-Design of the Power Supply Chain, Part 2 (Page 30) Printed Circuit Design & Fab - August 2008 - Low-Loss Fluoropolymer Copper Clad Laminate (Page 31) Printed Circuit Design & Fab - August 2008 - Low-Loss Fluoropolymer Copper Clad Laminate (Page 32) Printed Circuit Design & Fab - August 2008 - Low-Loss Fluoropolymer Copper Clad Laminate (Page 33) Printed Circuit Design & Fab - August 2008 - Low-Loss Fluoropolymer Copper Clad Laminate (Page 34) Printed Circuit Design & Fab - August 2008 - Low-Loss Fluoropolymer Copper Clad Laminate (Page 35) Printed Circuit Design & Fab - August 2008 - Qualifying PCBs Outsourced in Asia (Page 36) Printed Circuit Design & Fab - August 2008 - Qualifying PCBs Outsourced in Asia (Page 37) Printed Circuit Design & Fab - August 2008 - Qualifying PCBs Outsourced in Asia (Page 38) Printed Circuit Design & Fab - August 2008 - Qualifying PCBs Outsourced in Asia (Page 39) Printed Circuit Design & Fab - August 2008 - Copper Plating and Microvia Fill for Advanced PCBs (Page 40) Printed Circuit Design & Fab - August 2008 - Copper Plating and Microvia Fill for Advanced PCBs (Page 41) Printed Circuit Design & Fab - August 2008 - Copper Plating and Microvia Fill for Advanced PCBs (Page 42) Printed Circuit Design & Fab - August 2008 - Off the Shelf (Page 43) Printed Circuit Design & Fab - August 2008 - Marketplace (Page 44) Printed Circuit Design & Fab - August 2008 - Marketplace (Page 45) Printed Circuit Design & Fab - August 2008 - Marketplace (Page 46) Printed Circuit Design & Fab - August 2008 - Ad Index (Page 47) Printed Circuit Design & Fab - August 2008 - BGA Bulletin (Page 48) Printed Circuit Design & Fab - August 2008 - BGA Bulletin (Page Cover3) Printed Circuit Design & Fab - August 2008 - BGA Bulletin (Page Cover4)
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