Printed Circuit Design & Fab - August 2008 - (Page W12)

3- DAY TECH N I CA L CONF E RE NCE PROGRA M will include DFX principles; applications and standards; design guidelines for surface-mount technology and microelectronics; surface-mount land pattern development for higher density electronics; PCB materials selection and HDI fabrication methodologies; surface ﬁnish and coatings for PCB substrates; and planning for high-volume automated assembly processing. TUESDAY, SEPT. 16 IT’S FREE TUESDAY! All Tuesday events and technical sessions are FREE to all conference and exhibition attendees. These courses are not part of the 3-Day Technical Conference. 1 pm – 2 pm NEW! F1 – If You Can Make It, They Can Fake It: Counterfeit Parts and China Speaker: David Ackerman, Ackerman-USA According to the International Chamber of Commerce Counterfeiting Intelligence Bureau, counterfeit product represents as much as 7% of total world trade – that translates to more than $550 billion in lost revenues for legitimate companies annually. This free session will focus on what you need to know to minimize this problem for your business; how to detect counterfeit parts, how to conduct in-house testing and how to utilizie third-party testing houses. The session also will give you guidance on how to be a proactive buyer and to know who you’re buying from. You will learn about the efforts being made to overcome this counterfeit problem, and how you can be involved. In short, you will learn how to recognize the problem, minimize risk and become part of the solution! 2 pm – 3 pm NEW! F4 – ECAD/MCAD Collaboration Speaker: Larry Kenyon, Mentor Graphics ECAD/MCAD engineers must communicate regularly to ensure that their designs do not impinge on their counterparts’ requirements or constraints. This is often done through verbal or e-mail communication, complicated when the two organizations are not in the same location, time zone or even country. Occasionally, this inefﬁciency results in missed schedules and problematic design conﬂicts, which in turn, results in increased costs. Technology has been developed to provide an ECAD/MCAD collaboration environment to alleviate this problem. Using this technology, ECAD and MCAD teams can work in their own environments, each with 3-D viewing capabilities, to discuss and analyze proposed changes as they happen, in real time. The ability to iterate cooperatively over small design iterations, rather than the larger iterations that traditionally have caused major re-designs, has the potential to eliminate surprises that result in increased costs and missed schedules. 1:30 pm – 5 pm S4 – Designing with Flex in Mind Speakers: Mark A. Verbrugge and Mark Finstad, Minco Products Flexible circuitry is more than just an electrical interconnect. Since a ﬂexible circuit is required to bend and ﬂex during and after installation, it becomes as much a mechanical device as an electrical device. A robust ﬂexible circuit design goes much deeper than just connecting the nets. Small variations in materials selection, materials stackup, and routing features can dictate whether a ﬂex circuit will function for years or fail within minutes. This half-day seminar will examine the electrical and mechanical features that must be incorporated into the design, and how those features will interact. The course also will cover how to select the proper materials and stack up, routing techniques, termination variety and options to make the product more rugged. Emphasis will be placed on common design errors and cost drivers. We will review the design process from ﬁrst concept to the ﬁnished ﬂex circuit. We also will explore when and where to use a ﬂex circuit, when to choose a rigid-ﬂex over a standard multilayer, all while maximizing value for the lowest total cost of ownership. 3 pm – 4 pm NEW! F5 – The Effect of COTS (Commercial Off-The-Shelf) on Defense Supply Chain Integration Speaker: Steve DeWaters, Penumbra Strategies With the advent of the now famous “Perry Memo” [Speciﬁcations & Standards – A New Way of Doing Business], DTD 29 Jun 94, commercial solutions began entering into military designs. These solutions (COTS) opened up the possibility that integrating commercial and military development/manufacturing facilitates dual-use processes and products, and contributes to an expanded industrial base that is capable of meeting defense needs at lower costs. To date, there have been many successful applications, but many more have failed. Understanding the demands and commercial limits opens a realm of opportunities for commercial suppliers to address. The military/industrial complex is a unique culture with expectations that are often out-of-synch with commercial mentalities. Learning more about the adoption rate of COTS – which applications, which programs – can help commercial suppliers steer their development and marketing efforts. This free session will provide the attendee with a COTS overview; successful applications; unsuccessful applications; and the limitations and opportunities. 1:30 pm – 5 pm NEW! S5 – Signal Integrity, Gb/s Transmission and EMI – Pulling It All Together Speaker: Robert Easson, Analytical Edge Digital design engineers and PCB layout designers conventionally think in terms of signal voltages changing with time, whereas EMC engineers tend to work with currents and frequencies. Furthermore, the move to multiGb/s serial transmission on PCBs has introduced further concepts such as BER (bit error ratio), ISI (inter-symbol interference) and eye patterns, and much more emphasis is on the high-frequency properties of PCB laminates. This half-day seminar aims to relate all these requirements to high-speed PCB layout in a way that is understandable for PCB layout designers and engineers who are not RF (radio frequency) experts. The key that connects these issues is the relationship between signal rise time and circuit bandwidth. Attendees will learn how to relate rise time, bandwidth and clock frequency (without the use of advanced math), and how this provides insight into the complex behavior of capacitance, inductance and resonance in PCBs and components. This is applied directly to key areas of highspeed design to aid in understanding power distribution, inductance in the circuit path, coupling, crosstalk and discontinuities on transmission lines. Applying these concepts to PCB laminate properties shows how ISI develops and degrades eye patterns and BER. Attendees will also gain insight into EMC concerns of differential and common mode impedance and radiation, ground loops and grounding principles. 1 pm – 2 pm NEW! F2 – Becoming a Certiﬁed Military/Aerospace Supplier Speaker: Steve DeWaters, Penumbra Strategies By its very nature, the military/aerospace sector is largely insulated and has highly speciﬁc criteria for any supplier wishing to enter and sustain business within its community. It is critical to understand which programs are viable, which contractors to contact (and how), as well as to understand the criteria for involvement. Military program research from known, credible analyst communities is a rich trove that can provide actionable, immediate information for the business development manager (BDM) to penetrate the marketplace. The “10,000 foot view” of the markets is interesting but insufﬁcient to target, acquire and engage decisionmakers. Similarly, lead lists are only as good as the business intelligence behind them. The name of the game for the BDM is business development, preferably along the smartest, shortest path-to-market. This free session is geared toward identifying credible sources and methods for using market research to expedite the business development process. 2 pm – 3 pm NEW! F3 – Death of a PCB Salesman Speaker: Greg Papandrew, Bare Board Group Domestic PCB salesmen are getting hit by a lot of ﬂak in the today’s global market, and it is not because of China. They are being hit by friendly ﬁre! North American PCB manufacturers have overlooked the importance of maintaining a proper sales force, and in doing so, they are killing their own business. Forget fancy plating tanks, drill machines and new technologies. The PCB business needs to develop better services and marketing plans, and it needs to focus on building stronger customer relationships. Covering topics that are crucial to the circuit board industry, this free session is packed with marketing wisdom that PCB salesmen, sales managers and owners of board manufacturing companies can use to make a lasting impact on their business and on their careers. These are not quick ﬁxes. They are real, longterm solutions to long-term problems. 4 pm – 5 pm NEW! F6 – Lead-Free Cost Reductions Speaker: Yash Sutariya, Saturn Electronics Focusing on the implementation of necessary changes, this presentation supplies immediate results by reducing lead-free costs via the use of recentlyintroduced, proven materials and ﬁnishes. “The transition to lead-free is now all but standard. We’ve all made it. But Saturn, one of the leading voices in that transition, is now ready to share its reﬁned cost-reducing methods,” says Yash Sutariya, VP of Saturn. The presentation will instruct attendees on controlling the process, choosing the right materials and establishing the proper guidelines. PCB W EST 2008 | WWW .PCBWEST. CO M | IN TH E H E AR T OF S I LI C O N VAL L E Y http://www.pcbwest.com

Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - August 2008

Printed Circuit Design & Fab - July 2008 Contents Our Line Market Watch Around the World Happenings ROI Tip Jar Software Performance Interconnect Strategies Final Finish Forum Product Development Challenges in a Global Market Innovative Modeling Supports Co-Design of the Power Supply Chain, Part 2 Low-Loss Fluoropolymer Copper Clad Laminate Qualifying PCBs Outsourced in Asia Copper Plating and Microvia Fill for Advanced PCBs Off the Shelf Marketplace Ad Index BGA Bulletin

Printed Circuit Design & Fab - August 2008

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