Printed Circuit Design & Fab - August 2008 - (Page W15) SPEA KE R BIOGRA PHIE S TIM COYLE is a principal consultant and owner of Signal Consulting Group LLC, which provides consulting and training for high-speed digital designs. STEVE DEWATERS has over 20 years of marketing, sales, purchasing, technical, business and general operations experience. He has created and led a variety of highly successful sales teams throughout North America in the electronics manufacturing industry. He recently launched Penumbra Strategies Inc. to help sales and marketing organizations throughout the military/ aerospace supply chain develop effective go-to-market strategies. He holds a B.A. from UC-Irvine and is a member of various academic and professional groups such as The Society for Competitive Intelligence Professionals (SCIP) and the National Contract Management Association (NCMA). LOY D’SOUZA is product manager of IC packaging and RF at Mentor Graphics Corp. He has over 10 years experience in RF design. ROBERT EASSON has years of experience in design engineering, technology and engineering management gained with companies engaged in microwave, RF and telecommunications engineering. His independent consulting firm, Analytical Edge, has for the nine years specialized in developing courses in high-speed PCB design and EMC. He has a bachelor’s in physics and a Ph.D. in engineering from the University of Glasgow, and is qualified as a Chartered Engineer and MIET. GARY FERRARI is director of technology for FTG Circuits, a manufacturer of military and high-reliability PCBs. He is the past executive director and cofounder of the IPC Designers Council. He has over 38 years of experience in electronic packaging with an emphasis on PCB design and manufacturing. MARK FINSTAD is principal applications engineer for Minco Products Inc. He has over 24 years of experience designing and manufacturing flexible printed circuits. He serves as the co-chair of IPC-2223 Design Standard for Flexible Printed Boards subcommittee. MICHAEL FITTS is a manager of customer development at Plexus. Fitts has been involved in the design and implementation of advanced technologies since the mid-1990s. His extensive experience comes from years of working for OEMs and EDA companies, and owning his own consulting company. W. JAMES (JIM) HALL is PCB assembly consultant and on the staff of ITM Consulting. His area of responsibility includes working with OEMs and EMS firms to solve assembly problems and optimize facility operations. A pioneer in reflow technology, he has been actively involved in electronic assembly technology for over 28 years. In the late 1970s, he joined HTC, a manufacturer of vapor phase soldering systems. He holds patents for the design of single vapor batch, vapor phase solder leveling (an alternative to HASL for PCB finishes) and inline reflow systems. ROBERT HANSON, MSEE, is president of Americom Seminars. As a digital design engineer at Boeing, Rockwell, Honeywell, and Loral, Hanson designed and analyzed many high-speed designs, including PCBs, for the AWACs, B1-B, 747-400, missiles and ground support test equipment. Hanson now consults and trains on high-speed digital design, EMI/EMC, SMT manufacturing/test and other electronic issues in the US and internationally. RICK HARTLEY is a senior principal engineer and PCB specialist at L-3 Communication, Avionics Systems. His background is in the design of printed circuits for computers, aircraft avionics and telecommunications. Hartley has 42 years of experience in the electronics industry. He is a past member of the editorial review board of Printed Circuit Design and is currently on the IPC Designers Council Executive Board. HAPPY HOLDEN is the senior PCB technologist for Mentor Graphic’s System Design Division in Longmont, CO. Prior to joining Mentor, he was the advanced technology manager at Westwood Associates and Merix Corp. He retired from Hewlett-Packard after over 28 years, where he managed HP’s application organizations in Taiwan and Hong Kong. He holds degrees in chemical engineering and computer science. He is a member of SMTA, IMAPS and IEEE. LARRY KENYON has worked in many facets of the electronics industry, including PCB assembly, test and final assembly. The breadth of background has given him a depth of knowledge of the need for ECAD/MCAD collaboration that can result in saved effort, time and expense in the downstream assembly and test processes. At Mitron in the early 1990s, Kenyon founded CIMB ridge Optimization software, which enabled electronics manufacturers to program and optimize best-in-class, heterogeneous surface-mount assembly equipment. Over his 30-year career, he has also worked for Tektronix, GenRad, Teradyne, Tecnomatix and UGS. He is a graduate of Oregon State University. MICHAEL KIRSCHNER is president of Design Chain Associates LLC, a consulting firm focused on helping electronics OEMs comply with RoHS/WEEE requirements, and speeding time-to-market, reducing product cost, and increasing engineering and procurement efficiency through supplier, component and design risk mitigation strategies. He has 24 years of extensive cross-functional experience in all phases of the product lifecycle, from conception through production and end-of-life at both and semiconductor suppliers. KATHY NARGI-TOTH is editor of Printed Circuit Design & Fab. She has held a variety of technical and management roles in the PCB industry over the past 30 years, including director of business development at Technic Inc., and technical marketing manager of PWB metallization for Enthone Co. CHARLES PFEIL is a product marketing director for Mentor Graphics’ Systems Design Division. He is an architect for Expedition PCB and an inventor of XtremePCB. Pfeil has been in the PCB industry over 40 years as a designer and owner of a service bureau, and has worked in marketing and/or engineering management at Racal-Redac, ASI, Cadence, PADS, VeriBest and Mentor Graphics. LEE RITCHEY is founder and president of Speeding Edge. Considered to be an authority on high-speed PCB and system design, he conducts on-site private training courses and teaches courses for UC Berkeley’s extension program. Ritchey is also a consultant to top manufacturers of Internet and server products. Prior to founding Speeding Edge, he worked for 3Com and Maxtor, and was cofounder and vice president of engineering and marketing of Shared Resources. Ritchey holds a BSEE degree from California State University, Sacramento. VERN SOLBERG is an independent consultant specializing in surfacemount and microelectronics design and manufacturing technology. He has over 25 years’ experience in areas related to commercial and aerospace electronics products and is active as an author and educator. Solberg holds several patents for IC packaging innovations and is author of Design Guidelines for Surface Mount and Fine-Pitch Technology, published by McGraw-Hill. He is a member of IPC, SMTA and IMAPS. MARK VERBRUGGE is an applications engineer for Minco Products Inc. He has over 20 years’ experience designing and manufacturing flexible printed circuits. CHRIS URMSON is director of technology for the Urban Challenge Robotics Institute at Carnegie Mellon University. He was previously a robotics research scientist with SAIC. He developed several robotic navigation architectures and software systems currently in use by Carnegie Mellon University, NASA JPL and NASA Ames. He has made significant contributions to robot development with an emphasis on software development and system integration. He has a Ph.D. from Carnegie Mellon and a B.S. in computer engineering from the University of Manitoba. Urmson has earned a variety of corporate and academic awards, including being named a Siebel Scholar, and receiving technology innovation awards from Boeing Phantom Works and SAIC. PER VIKLUND is director of IC packaging and RF at Mentor Graphics. He has over 25 years’ experience in system, RF and package mixed-technology design. SUSY WEBB is a senior PCB designer with 28 years of design experience. She has worked in a variety of fields, including point-to-point microwave network systems, oceanographic oil exploration equipment, and CPC I and ATX computer motherboards. Webb is CID certified and is an active member of the IPC Designers Council, currently working as a member of its national executive board, high-speed and education committees. Early Bird Discount Deadline | Re g i ste r b y Au g u st 1 9 a n d sa v e u p to $ 1 0 0 ! http://www.pcdandf.com
Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - August 2008 Printed Circuit Design & Fab - July 2008 Contents Our Line Market Watch Around the World Happenings ROI Tip Jar Software Performance Interconnect Strategies Final Finish Forum Product Development Challenges in a Global Market Innovative Modeling Supports Co-Design of the Power Supply Chain, Part 2 Low-Loss Fluoropolymer Copper Clad Laminate Qualifying PCBs Outsourced in Asia Copper Plating and Microvia Fill for Advanced PCBs Off the Shelf Marketplace Ad Index BGA Bulletin Printed Circuit Design & Fab - August 2008 Printed Circuit Design & Fab - August 2008 - Printed Circuit Design & Fab - July 2008 (Page Cover1) Printed Circuit Design & Fab - August 2008 - Printed Circuit Design & Fab - July 2008 (Page Cover2) Printed Circuit Design & Fab - August 2008 - Printed Circuit Design & Fab - July 2008 (Page 1) Printed Circuit Design & Fab - August 2008 - Contents (Page 2) Printed Circuit Design & Fab - August 2008 - Contents (Page 3) Printed Circuit Design & Fab - August 2008 - Our Line (Page 4) Printed Circuit Design & Fab - August 2008 - Our Line (Page 5) Printed Circuit Design & Fab - August 2008 - Market Watch (Page 6) Printed Circuit Design & Fab - August 2008 - Market Watch (Page 7) Printed Circuit Design & Fab - August 2008 - Around the World (Page 8) Printed Circuit Design & Fab - August 2008 - Around the World (Page 9) Printed Circuit Design & Fab - August 2008 - Around the World (Page 10) Printed Circuit Design & Fab - August 2008 - Around the World (Page 11) Printed Circuit Design & Fab - August 2008 - Happenings (Page 12) Printed Circuit Design & Fab - August 2008 - Happenings (Page 13) Printed Circuit Design & Fab - August 2008 - ROI (Page 14) Printed Circuit Design & Fab - August 2008 - ROI (Page 15) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page 16) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W1) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W2) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W3) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W4) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W5) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W6) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W7) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W8) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W9) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W10) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W11) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W12) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W13) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W14) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W15) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W16) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page 17) Printed Circuit Design & Fab - August 2008 - Software Performance (Page 18) Printed Circuit Design & Fab - August 2008 - Software Performance (Page 19) Printed Circuit Design & Fab - August 2008 - Interconnect Strategies (Page 20) Printed Circuit Design & Fab - August 2008 - Interconnect Strategies (Page 21) Printed Circuit Design & Fab - August 2008 - Interconnect Strategies (Page 22) Printed Circuit Design & Fab - August 2008 - Final Finish Forum (Page 23) Printed Circuit Design & Fab - August 2008 - Product Development Challenges in a Global Market (Page 24) Printed Circuit Design & Fab - August 2008 - Product Development Challenges in a Global Market (Page 25) Printed Circuit Design & Fab - August 2008 - Product Development Challenges in a Global Market (Page 26) Printed Circuit Design & Fab - August 2008 - Product Development Challenges in a Global Market (Page 27) Printed Circuit Design & Fab - August 2008 - Innovative Modeling Supports Co-Design of the Power Supply Chain, Part 2 (Page 28) Printed Circuit Design & Fab - August 2008 - Innovative Modeling Supports Co-Design of the Power Supply Chain, Part 2 (Page 29) Printed Circuit Design & Fab - August 2008 - Innovative Modeling Supports Co-Design of the Power Supply Chain, Part 2 (Page 30) Printed Circuit Design & Fab - August 2008 - Low-Loss Fluoropolymer Copper Clad Laminate (Page 31) Printed Circuit Design & Fab - August 2008 - Low-Loss Fluoropolymer Copper Clad Laminate (Page 32) Printed Circuit Design & Fab - August 2008 - Low-Loss Fluoropolymer Copper Clad Laminate (Page 33) Printed Circuit Design & Fab - August 2008 - Low-Loss Fluoropolymer Copper Clad Laminate (Page 34) Printed Circuit Design & Fab - August 2008 - Low-Loss Fluoropolymer Copper Clad Laminate (Page 35) Printed Circuit Design & Fab - August 2008 - Qualifying PCBs Outsourced in Asia (Page 36) Printed Circuit Design & Fab - August 2008 - Qualifying PCBs Outsourced in Asia (Page 37) Printed Circuit Design & Fab - August 2008 - Qualifying PCBs Outsourced in Asia (Page 38) Printed Circuit Design & Fab - August 2008 - Qualifying PCBs Outsourced in Asia (Page 39) Printed Circuit Design & Fab - August 2008 - Copper Plating and Microvia Fill for Advanced PCBs (Page 40) Printed Circuit Design & Fab - August 2008 - Copper Plating and Microvia Fill for Advanced PCBs (Page 41) Printed Circuit Design & Fab - August 2008 - Copper Plating and Microvia Fill for Advanced PCBs (Page 42) Printed Circuit Design & Fab - August 2008 - Off the Shelf (Page 43) Printed Circuit Design & Fab - August 2008 - Marketplace (Page 44) Printed Circuit Design & Fab - August 2008 - Marketplace (Page 45) Printed Circuit Design & Fab - August 2008 - Marketplace (Page 46) Printed Circuit Design & Fab - August 2008 - Ad Index (Page 47) Printed Circuit Design & Fab - August 2008 - BGA Bulletin (Page 48) Printed Circuit Design & Fab - August 2008 - BGA Bulletin (Page Cover3) Printed Circuit Design & Fab - August 2008 - BGA Bulletin (Page Cover4)
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