Printed Circuit Design & Fab - August 2008 - (Page W8) SCH ED UL E -AT-A -GL A NCE SUNDAY, SEPT. 14 8 am – 1 pm MONDAY, SEPT. 15 8 am – 5 pm NEW! S5 – Signal Integrity, Gb/s Transmission and EMI – Pulling It All Together Speaker: Robert Easson, Analytical Edge REGISTRATION OPEN 9 am – 5 pm REGISTRATION OPEN 8 am – 7 pm PROFESSIONAL DEVELOPMENT CERTIFICATE COURSES DEC 1 – Control of Signal Integrity, EMI, Crosstalk and Grounding in High-Speed Printed Circuits Speaker: Rick Hartley, L-3 Communications, Avionics Systems PCB TOP GUN HALL OF FAME CONTEST 9 am – 5 pm TUESDAY, SEPT. 16 8 am – 7 pm REGISTRATION OPEN 9 am – 7 pm PROFESSIONAL DEVELOPMENT CERTIFICATE COURSES DEC 1 - DEC 4 continued 9 am – 11 am FREE TUESDAY SESSIONS AND EVENTS 9 am – 11 am NEW! RT – PCB Design, Fab and Assembly Roundtable: Understanding the Dynamics of the Cost/Technology Equation Across the Supply Chain Moderator: Terry Heilman, Sunstone Circuits DEC 2 – PCB Design 101 Speakers: Gary Ferrari, FTG Circuits; and Susy Webb, Fairfield Industries 3-DAY TECHNICAL CONFERENCE COURSES NEW! W1 – Choosing Components for Lead-Free (High-Temperature) Soldering Speaker: Vern Solberg, STC DEC 3 – Design Challenges With HDI/Microvias, Including Hands-On Design Speakers: Happy Holden, Mentor Graphics; and Mike Fitts, Plexus DEC 4 – EMI and EMC for the Design Engineer Speaker: Robert Hanson, Americom Seminars NEW! W2 – Top 10 Flex Circuit Questions (and Answers) Speakers: Mark A. Verbrugge and Mark Finstad, Minco Products 11 am – 12 noon NEW! KA – KEYNOTE ADDRESS Bringing Design to Life Speaker: Dr. Chris Urmson, Carnegie Mellon University 9 am – 12:30 pm NEW! T1 – Design for SMT Manufacturability From an Assembly Point of View Speaker: Jim Hall, ITM Consulting 3-DAY TECHNICAL CONFERENCE COURSES NEW! S1 – Traces as Transmission Lines Speaker: Ralph Morrison, consultant 12 noon – 7 pm EXHIBITS OPEN 12 noon – 7 pm NEW! T2 – Electrical Principles: Digital Circuits and Electrical Systems Speaker: Ralph Morrison, consultant CYBER CAFE, DAY 1 Sponsored by Mentor Graphics NEW! S2 – Designing Out Common Failure Mechanisms Speaker: Jim Hall, ITM Consulting 1 pm – 2 pm FREE TECHNICAL SESSIONS NEW! F1 – If You Can Make It, They Can Fake It: Counterfeit Parts and China Speaker: Dave Ackerman, Ackerman-USA 12 pm – 1 pm PROFESSIONAL DEVELOPMENT ATTENDEE LUNCH 12 pm – 10 pm 12 pm – 1 pm PROFESSIONAL DEVELOPMENT ATTENDEE LUNCH 1:00 pm – 3 pm PCB TOP GUN HALL OF FAME CONTEST 3-DAY TECHNICAL CONFERENCE COURSES NEW! W3 – Which Lead-Free Solder Works Best? Speaker: Jasbir Bath, Flextronics NEW! F2 – Becoming a Certified Military/Aerospace Supplier Speaker: Steve DeWaters, Penumbra Strategies 2 pm – 3 pm FREE TECHNICAL SESSIONS NEW! F3 – Death of a PCB Salesman Speaker: Greg Papandrew, Bare Board Group 1:30 pm – 5 pm 3-DAY TECHNICAL CONFERENCE COURSES NEW! S3 – Design for High Density Surface Mount and Microelectronics Speaker: Vern Solberg, STC NEW! F4 – ECAD/MCAD Collaboration Speaker: Larry Kenyon, Mentor Graphics S4 – Designing with Flex in Mind Speakers: Mark A. Verbrugge and Mark Finstad, Minco Products 8 PCB W EST 2008 | WWW .PCBWES T. CO M | IN TH E H E AR T OF S I LI C O N VAL L E Y http://www.pcbwest.com
Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - August 2008 Printed Circuit Design & Fab - July 2008 Contents Our Line Market Watch Around the World Happenings ROI Tip Jar Software Performance Interconnect Strategies Final Finish Forum Product Development Challenges in a Global Market Innovative Modeling Supports Co-Design of the Power Supply Chain, Part 2 Low-Loss Fluoropolymer Copper Clad Laminate Qualifying PCBs Outsourced in Asia Copper Plating and Microvia Fill for Advanced PCBs Off the Shelf Marketplace Ad Index BGA Bulletin Printed Circuit Design & Fab - August 2008 Printed Circuit Design & Fab - August 2008 - Printed Circuit Design & Fab - July 2008 (Page Cover1) Printed Circuit Design & Fab - August 2008 - Printed Circuit Design & Fab - July 2008 (Page Cover2) Printed Circuit Design & Fab - August 2008 - Printed Circuit Design & Fab - July 2008 (Page 1) Printed Circuit Design & Fab - August 2008 - Contents (Page 2) Printed Circuit Design & Fab - August 2008 - Contents (Page 3) Printed Circuit Design & Fab - August 2008 - Our Line (Page 4) Printed Circuit Design & Fab - August 2008 - Our Line (Page 5) Printed Circuit Design & Fab - August 2008 - Market Watch (Page 6) Printed Circuit Design & Fab - August 2008 - Market Watch (Page 7) Printed Circuit Design & Fab - August 2008 - Around the World (Page 8) Printed Circuit Design & Fab - August 2008 - Around the World (Page 9) Printed Circuit Design & Fab - August 2008 - Around the World (Page 10) Printed Circuit Design & Fab - August 2008 - Around the World (Page 11) Printed Circuit Design & Fab - August 2008 - Happenings (Page 12) Printed Circuit Design & Fab - August 2008 - Happenings (Page 13) Printed Circuit Design & Fab - August 2008 - ROI (Page 14) Printed Circuit Design & Fab - August 2008 - ROI (Page 15) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page 16) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W1) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W2) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W3) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W4) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W5) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W6) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W7) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W8) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W9) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W10) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W11) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W12) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W13) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W14) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W15) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W16) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page 17) Printed Circuit Design & Fab - August 2008 - Software Performance (Page 18) Printed Circuit Design & Fab - August 2008 - Software Performance (Page 19) Printed Circuit Design & Fab - August 2008 - Interconnect Strategies (Page 20) Printed Circuit Design & Fab - August 2008 - Interconnect Strategies (Page 21) Printed Circuit Design & Fab - August 2008 - Interconnect Strategies (Page 22) Printed Circuit Design & Fab - August 2008 - Final Finish Forum (Page 23) Printed Circuit Design & Fab - August 2008 - Product Development Challenges in a Global Market (Page 24) Printed Circuit Design & Fab - August 2008 - Product Development Challenges in a Global Market (Page 25) Printed Circuit Design & Fab - August 2008 - Product Development Challenges in a Global Market (Page 26) Printed Circuit Design & Fab - August 2008 - Product Development Challenges in a Global Market (Page 27) Printed Circuit Design & Fab - August 2008 - Innovative Modeling Supports Co-Design of the Power Supply Chain, Part 2 (Page 28) Printed Circuit Design & Fab - August 2008 - Innovative Modeling Supports Co-Design of the Power Supply Chain, Part 2 (Page 29) Printed Circuit Design & Fab - August 2008 - Innovative Modeling Supports Co-Design of the Power Supply Chain, Part 2 (Page 30) Printed Circuit Design & Fab - August 2008 - Low-Loss Fluoropolymer Copper Clad Laminate (Page 31) Printed Circuit Design & Fab - August 2008 - Low-Loss Fluoropolymer Copper Clad Laminate (Page 32) Printed Circuit Design & Fab - August 2008 - Low-Loss Fluoropolymer Copper Clad Laminate (Page 33) Printed Circuit Design & Fab - August 2008 - Low-Loss Fluoropolymer Copper Clad Laminate (Page 34) Printed Circuit Design & Fab - August 2008 - Low-Loss Fluoropolymer Copper Clad Laminate (Page 35) Printed Circuit Design & Fab - August 2008 - Qualifying PCBs Outsourced in Asia (Page 36) Printed Circuit Design & Fab - August 2008 - Qualifying PCBs Outsourced in Asia (Page 37) Printed Circuit Design & Fab - August 2008 - Qualifying PCBs Outsourced in Asia (Page 38) Printed Circuit Design & Fab - August 2008 - Qualifying PCBs Outsourced in Asia (Page 39) Printed Circuit Design & Fab - August 2008 - Copper Plating and Microvia Fill for Advanced PCBs (Page 40) Printed Circuit Design & Fab - August 2008 - Copper Plating and Microvia Fill for Advanced PCBs (Page 41) Printed Circuit Design & Fab - August 2008 - Copper Plating and Microvia Fill for Advanced PCBs (Page 42) Printed Circuit Design & Fab - August 2008 - Off the Shelf (Page 43) Printed Circuit Design & Fab - August 2008 - Marketplace (Page 44) Printed Circuit Design & Fab - August 2008 - Marketplace (Page 45) Printed Circuit Design & Fab - August 2008 - Marketplace (Page 46) Printed Circuit Design & Fab - August 2008 - Ad Index (Page 47) Printed Circuit Design & Fab - August 2008 - BGA Bulletin (Page 48) Printed Circuit Design & Fab - August 2008 - BGA Bulletin (Page Cover3) Printed Circuit Design & Fab - August 2008 - BGA Bulletin (Page Cover4)
For optimal viewing of this digital publication, please enable JavaScript and then refresh the page. If you would like to try to load the digital publication without using Flash Player detection, please click here.