Printed Circuit Design & Fab - August 2008 - (Page W9)

SCH ED UL E -AT-A -GL A NCE 3 pm – 4 pm 10 am – 3 pm FREE TECHNICAL SESSION NEW! F5 – The Effect of COTS (Commercial Off-The-Shelf) on Defense Supply Chain Integration Speaker: Steve DeWaters, Penumbra Strategies EXHIBITS OPEN 10 am – 3 pm NEW! S10 – Global Environmental Regulations: Updates on RoHS and WEEE, and an Intro to REACH Speaker: Michael Kirschner, Design Chain Associates CYBER CAFE, DAY 2 Sponsored by Mentor Graphics 11 am – 1 pm 4 pm – 5 pm FREE TECHNICAL SESSION NEW! F6 – Lead-Free Cost Reductions Speaker: Yash Sutariya, Saturn Electronics Corp. 3-DAY TECHNICAL CONFERENCE COURSES NEW! W8 – Probing Signal Integrity – Measuring High-Speed Circuits Speaker: Robert Easson, Analytical Edge S11 – PCB Layout Guidelines for Signal Integrity, EMI and High Speed Speaker: Susy Webb, Fairﬁeld Industries S12 – Predictive Analysis for ThroughHole to HDI Conversion Speaker: Gary Ferrari, FTG Circuits 5 pm – 7 pm 1:30 pm – 3:30 pm 1:30 pm – 3:30 pm RECEPTION ON EXHIBIT FLOOR 5:30 pm – 7 pm 3-DAY TECHNICAL CONFERENCE COURSES NEW! W9 – Panel Session: Halogen-Free Update Speakers: TBD 3-DAY TECHNICAL CONFERENCE COURSES W12 – Materials for High Speed, High Frequency and Lead Free PCBs Speaker: Rick Hartley, L-3 Communications, Avionics Systems MEET THE AUTHOR AND BOOK SIGNING EVENT In the Exhibit Hall During the Opening Night Reception. Visit www.pcbwest.com for the current list of participating authors. 5:30 pm – 6:30 pm 1:30 pm – 5 pm NEW! W13 – BGA Fanout Patterns Speaker: Charles Pfeil, Mentor Graphics 3-DAY TECHNICAL CONFERENCE COURSES NEW! S7 – Power System Design on High-Speed PCBs Speaker: Rick Hartley, L-3 Communication, Avionics Systems NEW! DD – DESIGNER DECISION 2008 1:30 pm – 5 pm 3-DAY TECHNICAL CONFERENCE COURSES NEW! S13 – A PCB Designer’s Guide to IBIS Models Speaker: Tim Coyle, Signal Consulting Group WEDNESDAY, SEPT. 17 8 am – 4 pm S8 – Vias and Their Effects on HighSpeed Signals Speaker: Robert Hanson, Americom Seminars REGISTRATION OPEN 9 am – 5 pm PROFESSIONAL DEVELOPMENT CERTIFICATE COURSE NEW! DEC 5 – High-Speed Design, Including Simulation Tool Use Speaker: Lee Ritchey, Speeding Edge NEW! S9 – Making the Most of Your Design Time Speaker: Susy Webb, Fairﬁeld Industries S14 – New Test Methods For High-Speed, High-Density PCBs Speaker: Robert Hanson, Americom Seminars S15 – The Fabrication Process: A HandsOn Experience for Designers Speaker: Gary Ferrari, FTG Circuits THURSDAY, SEPT. 18 8 am – 2:30 pm 9 am – 11 am 3-DAY TECHNICAL CONFERENCE COURSES NEW! W5 – Breaking New Ground in PCB RF Design Speakers: Per Viklund and Loy D’Souza, Mentor Graphics REGISTRATION OPEN 9 am – 5 pm FRIDAY, SEPT. 19 8 am – 10 am PROFESSIONAL DEVELOPMENT CERTIFICATE COURSE DEC 5 continued 9 am – 11 am REGISTRATION OPEN 9 am – 5 pm PROFESSIONAL DEVELOPMENT CERTIFICATE COURSES DEC 5 continued T3 – Placement & Routing of Complex PCBs Speaker: Rick Hartley, L-3 Communication, Avionics Systems; and Susy Webb, Fairﬁeld Industries W6 – Designing for Asian Fabrication Speaker: Happy Holden, Mentor Graphics 3-DAY TECHNICAL CONFERENCE COURSES NEW! W10 – Signal Integrity Simulation Crash Course Speaker: Tim Coyle, Signal Consulting Group NEW! W7 – Panel Session: IC-PackagePCB Co-Design Strategies Panelist: Ian Grover, Director of PCB Layout, NBS Corp. 9 am – 12:30 pm NEW! W11 – Bringing Order to the FPGA I/O Planning Madness Speaker: Bruce Riggins, Taray Inc. T4 – All You Need to Know About Bypassing Including BGAs Speaker: Robert Hanson, Americom Seminars 3-DAY TECHNICAL CONFERENCE COURSES S6 – Microelectronics Design, Chipon-Board, Flip Chip and 3D Package Technologies Speaker: Vern Solberg, STC T5 – Basics of DFM Speaker: Gary Ferrari, FTG Circuits 9 am – 12:30 pm 3-DAY TECHNICAL CONFERENCE COURSES 12 pm – 1 pm PROFESSIONAL DEVELOPMENT ATTENDEE LUNCH Early Bird Discount Deadline | R e g i ste r b y Au g u st 1 9 a n d sa v e u p to $ 1 0 0 ! 9 http://www.pcbwest.com

Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - August 2008

Printed Circuit Design & Fab - July 2008 Contents Our Line Market Watch Around the World Happenings ROI Tip Jar Software Performance Interconnect Strategies Final Finish Forum Product Development Challenges in a Global Market Innovative Modeling Supports Co-Design of the Power Supply Chain, Part 2 Low-Loss Fluoropolymer Copper Clad Laminate Qualifying PCBs Outsourced in Asia Copper Plating and Microvia Fill for Advanced PCBs Off the Shelf Marketplace Ad Index BGA Bulletin

Printed Circuit Design & Fab - August 2008

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