Printed Circuit Design & Fab - September 2008 - (Page 10) AROUND thE world CircuitSpace PCB Productivity Energy-Use For Electronic Products (EuP) in Play BANNOCKBURN, IL – The EC Regulatory Committee on Ecodesign and Energy Label- Excel ing has agreed to a draft concerning the standby and off modes of energy-using household and office products. This proposal will be sent to the European Council and European Parliament for review. It should be adopted by the Commission and published by the EU at the beginning of 2009, barring any objections. The first phase will come into effect in 2010. The proposal is already coming under fire from electronics engineers. As one critic noted to a well-known industry email list, “The EU commission groups seem to be very inept when defining scopes, and no two policy making groups seem to learn from the other’s mistakes,” adding that the proposal’s scope is “extremely vague and confusing … the [EU] drops in words like household and office equipment into the scope, possibly with the intention of making it clearer but in reality just making it more obscure.” GREEN RUSh HERNDON, VA – “Environmental legislation is proliferating around the globe, and iNEMI Summit to Coordinate Industry ‘Greening’ harmonization is essential. Equally important is the need for industry to coordinate its technical responses, and that requires a proactive approach.” That’s according to iNEMI vice president of global operations Bob Pfahl, who is helping organize an industry-wide action plan for dealing with the green movement. The two-day program takes place Sept. 22-23, at Motorola’s Galvin Center in Schaumburg, IL. iNEMI expects to use the summit to identify and prioritize areas where the electronics industry can collaborate on proactive environmental programs and to respond to legislators, consumers and civil groups. Enhance your productivity “We are impressed with the productivity gains our designers achieve with CircuitSpace® by DesignAdvance.® TM Now with CircuitProbe, we see the combined solution being utilized by both our designers and engineers and adding value throughout our entire PCB design cycle.” Greg Bodi, Senior Manager NVIDIA Corporation Free CircuitSpace ROI calculator Calculate your potential return on investment using the free CircuitSpace ROI calculator from EMA, a Cadence Channel Partner, online at www.ema-eda.com/roi or call us at 800.813.7288. CircuitSpace and CircuitProbe are PCB productivity tools from DesignAdvance Systems. ©2008 EMA Design Automation, Inc. All rights reserved in the U.S. and other countries. All marks are the property of their respective owners. AT&S Breaks Ground For Second India Plant NANJANGUD, INDIA – AT&S broke ground for its second plant in Nanjangud, India. Investments planned for this plant are €37 million ($57.2 million) in fiscal years 2008/2009 and 2009/2010. The construction is scheduled to be complete in July 2009, with production beginning in the third quarter. The new plant, located adjacent to the existing AT&S plant, will specialize in multilayer PCBs for automotive, medical and industrial applications. The anticipated revenue contribution will be €18 million ($27.8 million) in 2009/2010 and at full capacity, an annual revenue of approximately €37 million ($57.2 million) is expected. In January 1999, AT&S Group started its operations in India by acquiring the largest Indian PCB manufacturer, Indal Electronics. CONSUMER ExPLOSION China Electronics $100B in 2009 NUREMBERG and ARLINGTON, VA – Consumer electronics revenues in China are forecasted to reach $100 billion by 2009, surpassing Western Europe and North America between 2009 and 2010, say market researcher GfK and the Consumer Electronics Association. China attained 19% growth in 2007, with sales of cellphones, flat-screen TVs and PCs. This year, China’s revenues are expected to grow 9.4%. Asia revenue growth is predicted to be 16.5% in 2008, leading the global electronics market. Western Europe and North America will trail with 2.3% and 4.9% growth rates, respectively, say the firms. This growth is attributed to the mounting demand for replacement technologies: laptops, cellphones and flat-screen TVs. Portability is an important factor to consumers, demonstrated by 2007 sales of portable gadgets, which reached more than two billion units, say GfK and the CEA. SEPTEMBER 2008 10 printEd CirCuit dESign & fAB http://www.ema-eda.com/roi?campaignID=147 http://www.ema-eda.com/roi?campaignID=147
Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - September 2008 Printed Circuit Design & Fab - August 2008 Contents Our Line Market Watch Around the World Happenings ROI Positive Plating Off the Shelf Marketplace Ad Index EMC for the Real World Final Finish Forum Design for Green: Laminates A Systematic Approach to Increasing Layer Count The NTI $100 Million Club Printable Nanocomposites BGA Bulletin Printed Circuit Design & Fab - September 2008 Printed Circuit Design & Fab - September 2008 - Printed Circuit Design & Fab - August 2008 (Page Cover1) Printed Circuit Design & Fab - September 2008 - Printed Circuit Design & Fab - August 2008 (Page Cover2) Printed Circuit Design & Fab - September 2008 - Printed Circuit Design & Fab - August 2008 (Page Bellyband1) Printed Circuit Design & Fab - September 2008 - Printed Circuit Design & Fab - August 2008 (Page Bellyband2) Printed Circuit Design & Fab - September 2008 - Printed Circuit Design & Fab - August 2008 (Page 1) Printed Circuit Design & Fab - September 2008 - Contents (Page 2) Printed Circuit Design & Fab - September 2008 - Contents (Page 3) Printed Circuit Design & Fab - September 2008 - Our Line (Page 4) Printed Circuit Design & Fab - September 2008 - Our Line (Page 5) Printed Circuit Design & Fab - September 2008 - Market Watch (Page 6) Printed Circuit Design & Fab - September 2008 - Market Watch (Page 7) Printed Circuit Design & Fab - September 2008 - Market Watch (Page 8) Printed Circuit Design & Fab - September 2008 - Market Watch (Page 9) Printed Circuit Design & Fab - September 2008 - Around the World (Page 10) Printed Circuit Design & Fab - September 2008 - Around the World (Page 11) Printed Circuit Design & Fab - September 2008 - Around the World (Page 12) Printed Circuit Design & Fab - September 2008 - Around the World (Page 13) Printed Circuit Design & Fab - September 2008 - Happenings (Page 14) Printed Circuit Design & Fab - September 2008 - Happenings (Page 15) Printed Circuit Design & Fab - September 2008 - ROI (Page 16) Printed Circuit Design & Fab - September 2008 - ROI (Page 17) Printed Circuit Design & Fab - September 2008 - Positive Plating (Page 18) Printed Circuit Design & Fab - September 2008 - Positive Plating (Page 19) Printed Circuit Design & Fab - September 2008 - EMC for the Real World (Page 20) Printed Circuit Design & Fab - September 2008 - Final Finish Forum (Page 21) Printed Circuit Design & Fab - September 2008 - Design for Green: Laminates (Page 22) Printed Circuit Design & Fab - September 2008 - Design for Green: Laminates (Page 23) Printed Circuit Design & Fab - September 2008 - Design for Green: Laminates (Page 24) Printed Circuit Design & Fab - September 2008 - Design for Green: Laminates (Page 25) Printed Circuit Design & Fab - September 2008 - A Systematic Approach to Increasing Layer Count (Page 26) Printed Circuit Design & Fab - September 2008 - A Systematic Approach to Increasing Layer Count (Page 27) Printed Circuit Design & Fab - September 2008 - The NTI $100 Million Club (Page 28) Printed Circuit Design & Fab - September 2008 - The NTI $100 Million Club (Page 29) Printed Circuit Design & Fab - September 2008 - The NTI $100 Million Club (Page 30) Printed Circuit Design & Fab - September 2008 - The NTI $100 Million Club (Page 31) Printed Circuit Design & Fab - September 2008 - The NTI $100 Million Club (Page 32) Printed Circuit Design & Fab - September 2008 - The NTI $100 Million Club (Page 33) Printed Circuit Design & Fab - September 2008 - The NTI $100 Million Club (Page 34) Printed Circuit Design & Fab - September 2008 - The NTI $100 Million Club (Page 35) Printed Circuit Design & Fab - September 2008 - Printable Nanocomposites (Page 36) Printed Circuit Design & Fab - September 2008 - Printable Nanocomposites (Page 37) Printed Circuit Design & Fab - September 2008 - Printable Nanocomposites (Page 38) Printed Circuit Design & Fab - September 2008 - Printable Nanocomposites (Page 39) Printed Circuit Design & Fab - September 2008 - Printable Nanocomposites (Page 40) Printed Circuit Design & Fab - September 2008 - Printable Nanocomposites (Page 41) Printed Circuit Design & Fab - September 2008 - Printable Nanocomposites (Page 42) Printed Circuit Design & Fab - September 2008 - Off the Shelf (Page 43) Printed Circuit Design & Fab - September 2008 - Marketplace (Page 44) Printed Circuit Design & Fab - September 2008 - Marketplace (Page 45) Printed Circuit Design & Fab - September 2008 - Marketplace (Page 46) Printed Circuit Design & Fab - September 2008 - Ad Index (Page 47) Printed Circuit Design & Fab - September 2008 - BGA Bulletin (Page 48) Printed Circuit Design & Fab - September 2008 - BGA Bulletin (Page Cover3) Printed Circuit Design & Fab - September 2008 - BGA Bulletin (Page Cover4)
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