Printed Circuit Design & Fab - September 2008 - (Page 30) PCB Fab MarkEtS tablE 3. NTI-100, Top PCB-Makers, 2007 (US$M). Country 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 30 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 92 93 94 95 96 97 98 Career Technology* ASE Micro Circuit Systems* Shirai Denshi TPT KCE Thailand Sony Chemical* Hutchinson* Elna MFS* Isu-Petasys CCTC SI Flex* Ruwel Topsearch Würth Electronics APCB Eastern Co Ltd Ellington DDi Sumitomo Metal ED Shindo Denshi* Shinko Mfg Sumitomo Bakelite* Ichia Technology* Kyosha Arrk PCB Group Shye Feng Group Redboard EIT Gultech DAP Yu Fo Cosmotech Tong Jiang Plotech Yamamoto Mfg. Brain Power Fuba Hsing Kuo Ind. Shennan Circuits Sanwa Electronic Ckt Boardtek Sun Wei Circuit Board Jiangsu Suhang Elect Onpress Victory FCI Total Taiwan Taiwan Japan Japan Taiwan Thailand Japan USA Japan Singapore Korea China Korea Germany Hong Kong Germany Taiwan Japan Hong Kong USA Japan Japan Japan Japan Taiwan Japan Japan Taiwan Hong Kong USA Singapore Korea Taiwan Korea Taiwan Taiwan Japan Taiwan Germany Hong Kong China Germany Japan Taiwan Taiwan China Hong Kong Taiwan France 252 240 263 220 117 178 220 200 194 261 160 127 200 205 209 148 177 153 109 148 166 182 149 190 105 122 128 101 100 100 75 97 129 131 80 83 114 90 106 85 65 86 104 92 78 80 88 60 106 254 250 278 225 158 195 230 220 205 264 198 175 210 205 220 175 192 172 128 174 178 180 171 200 120 138 138 105 118 125 111 107 132 137 120 114 130 105 100 100 75 86 105 98 87 92 95 71 127 270 270 260 258 249 244 240 230 226 220 217 216 215 210 207 206 200 195 190 181 180 178 175 170 162 156 153 150 145 145 145 141 140 132 130 127 122 118 116 110 109 109 106 104 101 100 100 100 100 no. entries Japan Japan Taiwan Korea Taiwan Japan Japan Japan Hong Kong Taiwan Japan USA Taiwan Austria Korea Japan Korea Korea Taiwan USA Taiwan Taiwan Hong Kong Japan Taiwan USA USA Japan Japan Taiwan USA Taiwan Taiwan USA Taiwan Japan Taiwan Korea Japan Taiwan Japan USA Taiwan Japan Taiwan Japan Japan Japan Japan 2007 1,444 1,350 930 1,034 839 1,036 728 825 694 466 623 625 606 440 486 397 637 700 365 500 261 350 180 586 454 357 465 345 327 262 460 236 204 244 295 360 328 241 324 280 250 380 210 280 215 245 235 230 226 2006 2005 1,803 1,794 1,471 1,629 1,250 1,510 1,187 1,272 1,099 1,236 1,115 1,215 969 870 760 632 702 695 706 584 574 513 651 580 480 565 400 450 360 520 580 504 507 422 390 302 515 370 367 400 350 370 402 316 326 300 280 400 283 292 283 260 260 243 258 1,017 950 912 841 830 770 670 670 667 630 618 612 610 575 572 550 530 526 509 508 490 424 421 419 415 413 400 390 390 387 386 382 377 360 360 350 342 326 312 300 280 280 272 Ibiden Nippon Mektron* Unimicron Samsung E-M Nanya PCB CMK Shinko Electric NTK KB PCB Group Tripod Fujikura* Multek Compeq AT&S LG Electronics Meiko Daeduck Group Young Poon Group* Gold Circuit TTM Technology HannStar Board Foxconn* Meadville Group Hitachi Chemical Wus M-Flex* Viasystems Group Nitto Denko* Toppan-NEC Chin Poon Sanmina-SCI Unitech Kinsus Merix GBM Panasonic ED PPT Simmtech Kyoden Group Broad Tech (3COM) Sumitomo PCB* 3M* Dynamic Mitsubishi GC Group Vertex (Global Flex)* Daisho Denshi Hitachi Cable* Kyocera SLC Tech Fujitsu Interconnect 91 Schweizer Electronics AG 30,428 35,509 39,027 * estimated SEPTEMBER 2008 printEd CirCuit dESign & fAB
Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - September 2008 Printed Circuit Design & Fab - August 2008 Contents Our Line Market Watch Around the World Happenings ROI Positive Plating Off the Shelf Marketplace Ad Index EMC for the Real World Final Finish Forum Design for Green: Laminates A Systematic Approach to Increasing Layer Count The NTI $100 Million Club Printable Nanocomposites BGA Bulletin Printed Circuit Design & Fab - September 2008 Printed Circuit Design & Fab - September 2008 - Printed Circuit Design & Fab - August 2008 (Page Cover1) Printed Circuit Design & Fab - September 2008 - Printed Circuit Design & Fab - August 2008 (Page Cover2) Printed Circuit Design & Fab - September 2008 - Printed Circuit Design & Fab - August 2008 (Page Bellyband1) Printed Circuit Design & Fab - September 2008 - Printed Circuit Design & Fab - August 2008 (Page Bellyband2) Printed Circuit Design & Fab - September 2008 - Printed Circuit Design & Fab - August 2008 (Page 1) Printed Circuit Design & Fab - September 2008 - Contents (Page 2) Printed Circuit Design & Fab - September 2008 - Contents (Page 3) Printed Circuit Design & Fab - September 2008 - Our Line (Page 4) Printed Circuit Design & Fab - September 2008 - Our Line (Page 5) Printed Circuit Design & Fab - September 2008 - Market Watch (Page 6) Printed Circuit Design & Fab - September 2008 - Market Watch (Page 7) Printed Circuit Design & Fab - September 2008 - Market Watch (Page 8) Printed Circuit Design & Fab - September 2008 - Market Watch (Page 9) Printed Circuit Design & Fab - September 2008 - Around the World (Page 10) Printed Circuit Design & Fab - September 2008 - Around the World (Page 11) Printed Circuit Design & Fab - September 2008 - Around the World (Page 12) Printed Circuit Design & Fab - September 2008 - Around the World (Page 13) Printed Circuit Design & Fab - September 2008 - Happenings (Page 14) Printed Circuit Design & Fab - September 2008 - Happenings (Page 15) Printed Circuit Design & Fab - September 2008 - ROI (Page 16) Printed Circuit Design & Fab - September 2008 - ROI (Page 17) Printed Circuit Design & Fab - September 2008 - Positive Plating (Page 18) Printed Circuit Design & Fab - September 2008 - Positive Plating (Page 19) Printed Circuit Design & Fab - September 2008 - EMC for the Real World (Page 20) Printed Circuit Design & Fab - September 2008 - Final Finish Forum (Page 21) Printed Circuit Design & Fab - September 2008 - Design for Green: Laminates (Page 22) Printed Circuit Design & Fab - September 2008 - Design for Green: Laminates (Page 23) Printed Circuit Design & Fab - September 2008 - Design for Green: Laminates (Page 24) Printed Circuit Design & Fab - September 2008 - Design for Green: Laminates (Page 25) Printed Circuit Design & Fab - September 2008 - A Systematic Approach to Increasing Layer Count (Page 26) Printed Circuit Design & Fab - September 2008 - A Systematic Approach to Increasing Layer Count (Page 27) Printed Circuit Design & Fab - September 2008 - The NTI $100 Million Club (Page 28) Printed Circuit Design & Fab - September 2008 - The NTI $100 Million Club (Page 29) Printed Circuit Design & Fab - September 2008 - The NTI $100 Million Club (Page 30) Printed Circuit Design & Fab - September 2008 - The NTI $100 Million Club (Page 31) Printed Circuit Design & Fab - September 2008 - The NTI $100 Million Club (Page 32) Printed Circuit Design & Fab - September 2008 - The NTI $100 Million Club (Page 33) Printed Circuit Design & Fab - September 2008 - The NTI $100 Million Club (Page 34) Printed Circuit Design & Fab - September 2008 - The NTI $100 Million Club (Page 35) Printed Circuit Design & Fab - September 2008 - Printable Nanocomposites (Page 36) Printed Circuit Design & Fab - September 2008 - Printable Nanocomposites (Page 37) Printed Circuit Design & Fab - September 2008 - Printable Nanocomposites (Page 38) Printed Circuit Design & Fab - September 2008 - Printable Nanocomposites (Page 39) Printed Circuit Design & Fab - September 2008 - Printable Nanocomposites (Page 40) Printed Circuit Design & Fab - September 2008 - Printable Nanocomposites (Page 41) Printed Circuit Design & Fab - September 2008 - Printable Nanocomposites (Page 42) Printed Circuit Design & Fab - September 2008 - Off the Shelf (Page 43) Printed Circuit Design & Fab - September 2008 - Marketplace (Page 44) Printed Circuit Design & Fab - September 2008 - Marketplace (Page 45) Printed Circuit Design & Fab - September 2008 - Marketplace (Page 46) Printed Circuit Design & Fab - September 2008 - Ad Index (Page 47) Printed Circuit Design & Fab - September 2008 - BGA Bulletin (Page 48) Printed Circuit Design & Fab - September 2008 - BGA Bulletin (Page Cover3) Printed Circuit Design & Fab - September 2008 - BGA Bulletin (Page Cover4)
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