Printed Circuit Design & Fab - September 2008 - (Page 34) PCB Fab MarkEtS to manufacture IC substrates, but final approval from the Chinese government has taken a long time. Vertex decided to exit the PCB business in Taiwan. Its subsidiary in Suzhou, Global Flex, is listed on the Hong Kong exchange. Another Taiwan maker listed on the HKEX is notebook motherboard superstar HannStar Board. The Taiwanese government does not permit a Taiwan manufacturer to invest more than 40% of its capital into Chinese enterprises. Listing on the HKEX seems to be a way to get around this rule. There are at least a dozen mediumto-large scale Taiwanese fabricators that went out of business in the years after the IT bubble burst. Common to all of them is untimely overinvestment and lack of technologies. Ruwel AG of Germany recently decided to give rein of its Grassau plant near Munich to a Russian copper foil and laminate maker, Lamitec-Dielectra, that owns 25% of Ruwel’s competitor, FUBA PCB. The takeover of the Grassau facility by Lamitec-Dielectra creates an interesting situation. Twenty-five percent of Ruwel was owned by Bear Stearns, but now that Bear Stearns is owned by JP Morgan, the internal rule must have changed. Its much-publicized Romania venture was halted soon after its debt was assumed by Bear Stearns and two other investment funds. Recently, the Ruwel Wetter plant was subject to a management buyout. Ruwel sells 15% of its production to Japanese electronics firms operating in Europe, prompting Ruwel to exhibit at the JPCA Show for the past several years. Shye Feng is a little known Taiwanese fabricator with plants in Taiwan, China and Thailand (Apex Circuits). Until recently, the author did not know that Apex Circuit in Thailand is related with Shye Feng. The single-sided board business carries the name Shye Feng. Apex Circuits seems to be collaborating with Kyoden, a Japanese fabricator that recently purchased an ailing, yet once wellknown, Japanese maker, Airex. Airex is a classic example of makers that depend too much on one big customer. In the case of Airex, the biggest customer is NEC with nearly 80% of Airex revenue coming from sales to NEC. Kingboard Chemical (KB) is one of the largest laminate makers in the world today, together with Nan Ya Plastic, Isola and Matsushita Electric Works. It took over control of several PCB makers in China in the last several years. Kingboard has grown in leaps and bounds as a result. It controls Techwise (originally a captive shop built by Legend, now called Lenovo), Jiangmen Glory Faith, Top Faith, Elec & Eltek and a few other smaller fabrictors. KB seems to be trying to follow Nan Ya’s model, making materials and then manufacturing PCBs from these materials, creating a vertically integrated company. One big difference between KB and Nan Ya is the way they build manufacturing plants. KB’s PCB shops are acquired, while Nan Ya’s PCB shops are all built organically. Meiko Electronics of Japan has been investing “Taiwan” style in Japan and China. It is building a $350 million complex west of Hanoi, Vietnam, to produce PCBs and assemblies. It has two gigantic plants in China, one in Guangzhou, the other in Wuhan. The current combined production capacity is about five million square feet per month. It recently bought the PCB operation of Japan Victor Corp. (JVC), known for its build-up microvia board technology – liquid December 2-4, 2008 Orlando Metropolitan Resort Orlando, FL www.pcbshows.com/orlando An exciting addition to the PCB Shows portfolio of events for designers and fabricators Bringing you the best of our renowned and respected conferences and seminars to Orlando, FL Featuring • 3-day targeted technical conference • 1-day tabletop exhibition • Great networking opportunities Brought to you by 34 printEd CirCuit dESign & fAB SEPTEMBER 2008 http://www.pcbshows.com/orlando http://www.pcbshows.com/orlando http://www.pcbshows.com/orlando http://www.upmediagroup.com
Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - September 2008 Printed Circuit Design & Fab - August 2008 Contents Our Line Market Watch Around the World Happenings ROI Positive Plating Off the Shelf Marketplace Ad Index EMC for the Real World Final Finish Forum Design for Green: Laminates A Systematic Approach to Increasing Layer Count The NTI $100 Million Club Printable Nanocomposites BGA Bulletin Printed Circuit Design & Fab - September 2008 Printed Circuit Design & Fab - September 2008 - Printed Circuit Design & Fab - August 2008 (Page Cover1) Printed Circuit Design & Fab - September 2008 - Printed Circuit Design & Fab - August 2008 (Page Cover2) Printed Circuit Design & Fab - September 2008 - Printed Circuit Design & Fab - August 2008 (Page Bellyband1) Printed Circuit Design & Fab - September 2008 - Printed Circuit Design & Fab - August 2008 (Page Bellyband2) Printed Circuit Design & Fab - September 2008 - Printed Circuit Design & Fab - August 2008 (Page 1) Printed Circuit Design & Fab - September 2008 - Contents (Page 2) Printed Circuit Design & Fab - September 2008 - Contents (Page 3) Printed Circuit Design & Fab - September 2008 - Our Line (Page 4) Printed Circuit Design & Fab - September 2008 - Our Line (Page 5) Printed Circuit Design & Fab - September 2008 - Market Watch (Page 6) Printed Circuit Design & Fab - September 2008 - Market Watch (Page 7) Printed Circuit Design & Fab - September 2008 - Market Watch (Page 8) Printed Circuit Design & Fab - September 2008 - Market Watch (Page 9) Printed Circuit Design & Fab - September 2008 - Around the World (Page 10) Printed Circuit Design & Fab - September 2008 - Around the World (Page 11) Printed Circuit Design & Fab - September 2008 - Around the World (Page 12) Printed Circuit Design & Fab - September 2008 - Around the World (Page 13) Printed Circuit Design & Fab - September 2008 - Happenings (Page 14) Printed Circuit Design & Fab - September 2008 - Happenings (Page 15) Printed Circuit Design & Fab - September 2008 - ROI (Page 16) Printed Circuit Design & Fab - September 2008 - ROI (Page 17) Printed Circuit Design & Fab - September 2008 - Positive Plating (Page 18) Printed Circuit Design & Fab - September 2008 - Positive Plating (Page 19) Printed Circuit Design & Fab - September 2008 - EMC for the Real World (Page 20) Printed Circuit Design & Fab - September 2008 - Final Finish Forum (Page 21) Printed Circuit Design & Fab - September 2008 - Design for Green: Laminates (Page 22) Printed Circuit Design & Fab - September 2008 - Design for Green: Laminates (Page 23) Printed Circuit Design & Fab - September 2008 - Design for Green: Laminates (Page 24) Printed Circuit Design & Fab - September 2008 - Design for Green: Laminates (Page 25) Printed Circuit Design & Fab - September 2008 - A Systematic Approach to Increasing Layer Count (Page 26) Printed Circuit Design & Fab - September 2008 - A Systematic Approach to Increasing Layer Count (Page 27) Printed Circuit Design & Fab - September 2008 - The NTI $100 Million Club (Page 28) Printed Circuit Design & Fab - September 2008 - The NTI $100 Million Club (Page 29) Printed Circuit Design & Fab - September 2008 - The NTI $100 Million Club (Page 30) Printed Circuit Design & Fab - September 2008 - The NTI $100 Million Club (Page 31) Printed Circuit Design & Fab - September 2008 - The NTI $100 Million Club (Page 32) Printed Circuit Design & Fab - September 2008 - The NTI $100 Million Club (Page 33) Printed Circuit Design & Fab - September 2008 - The NTI $100 Million Club (Page 34) Printed Circuit Design & Fab - September 2008 - The NTI $100 Million Club (Page 35) Printed Circuit Design & Fab - September 2008 - Printable Nanocomposites (Page 36) Printed Circuit Design & Fab - September 2008 - Printable Nanocomposites (Page 37) Printed Circuit Design & Fab - September 2008 - Printable Nanocomposites (Page 38) Printed Circuit Design & Fab - September 2008 - Printable Nanocomposites (Page 39) Printed Circuit Design & Fab - September 2008 - Printable Nanocomposites (Page 40) Printed Circuit Design & Fab - September 2008 - Printable Nanocomposites (Page 41) Printed Circuit Design & Fab - September 2008 - Printable Nanocomposites (Page 42) Printed Circuit Design & Fab - September 2008 - Off the Shelf (Page 43) Printed Circuit Design & Fab - September 2008 - Marketplace (Page 44) Printed Circuit Design & Fab - September 2008 - Marketplace (Page 45) Printed Circuit Design & Fab - September 2008 - Marketplace (Page 46) Printed Circuit Design & Fab - September 2008 - Ad Index (Page 47) Printed Circuit Design & Fab - September 2008 - BGA Bulletin (Page 48) Printed Circuit Design & Fab - September 2008 - BGA Bulletin (Page Cover3) Printed Circuit Design & Fab - September 2008 - BGA Bulletin (Page Cover4)
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