Printed Circuit Design & Fab - September 2008 - (Page 4) OUR LINE The Road to Gold time watching the Olympic games that began in Beijing on Aug. 8, 2008. The culmination of the 8’s (eight is a lucky number for the Chinese) for many in the U.S. was the eighth gold medal won by Michael Phelps, breaking the previous record of seven. Record after record was smashed as athletes swam, rowed and ran faster than ever before. To KAtHy ensure success these athletes did not rely on luck. They all trained to win. nArgi-totH As a designer or engineer, business owner, supplier or OEM, every day should be like a bit of Olympic training. To win the gold – no matter your chosen field – mandates a focus on continuous improvement. It’s true: Some great athletes seem to be born to their sport, but even for them, the only way to continue to break world records (even the ones they themselves have set) is to strive to do more. In preparation, swimmers like Phelps undergo rigorous training designed to improve strength, speed and stamina. To succeed, tools are is refined, approaches tweaked, weaknesses coached, all to help the athletes gain a legitimate edge over the competition. What are you doing to improve your edge? Training is a key component to continuous improvement. In a few weeks, PCB West will debut in its new fall rotation in Santa Clara, CA. At this writing, conference registration looks to break last year’s mark. It looks like a fair number of designers know where they can train to gain a competitive advantage. There are new topics and speakers featured. Here are a few of my favorites. Tuesday, Sept. 16, is the PCB Design, Fab and Assembly Roundtable. The topic of discussion is “Understanding the Dynamics of the Cost/Technology Equation Across the Supply Chain.” This is a unique opportunity to hear some leading PCB fabricators and ODM/EMS companies talk about what drives costs in the manufacturing equation. Moderator Terry Heilman, president and CEO of Sunstone Circuits, will lead an easily recognizable group of PCB fabrication and assembly notables including, Peter Bigelow, IMI Inc.; Nilesh Naik, One Source; Nolan Johnson, Sunstone Circuits; George Dudnikov, SanminaSCI; and Andy Cameron, TTM Technologies. These speakers will provide insight into their company’s technology roadmap including design guidelines, cost of advancing technology and examples of cost/technology tradeoffs such as adding HDI microvia layers versus increasing overall layer count, or reducing lines and spaces to accommodate routing higher I/O devices. This session, the first of a series of related supply chain topics, is organized to join designers, fabricators and assemblers in a forum that will help each to better understand the others’ constraints and business models. Like a gold medal-winning relay team, we need to be able to work together to achieve greatness. The better we understand the strengths (and weaknesses) of the other members of our supply team, the more likely we are to bring home the gold. That afternoon on the exhibit hall floor, we will host Designer Decision 2008. It’s your opportunity to vote for the topics you think Printed Circuit Design and Fab needs to cover in the coming year. As your partner for information and educational materials, we want to know what topics you need to read and hear more about. And our 2009 editorial calendar will reflect the outcome of this unique event. Come to “Meet the Authors,” where attendees can meet Charles Pfeil, author of BGA Breakouts and Routing, and Lee Ritchey, author of Right the First Time, A Practical Handbooks on High-Speed PCB and System Design, volumes 1 and 2. Pfeil and Ritchey will also teach classes during the week. On Sept. 17, there will be a special session on “IC-Package-PCB Co-Design Strategies” with Lawrence Romine, Altium; How-Siang Yap, Agilent Technologies; Dr. Mike Heimlich, AWR Corp.; Egino Santo, Magma Design Automation and Hemant Shah of Cadence. This session will focus on system design that can help engineers and designers to bring a successful project to completion. That’s just a fraction of the event-filled education and networking opportunities available at PCB West. Don’t miss out on the chance to improve your “game” for the upcoming year through one of the PCB West professional development building exercises. Brushing up on what’s new in technology is a surefire way to go for gold. For more information go to www. pcbwest.com. 4 pcdandf.com Editorial Editor: Kathy Nargi-Toth, 678-589-8866, knargitoth@upmediagroup.com ASSoCiAtE Editor: Margo Lakin, 678-5898853, mlakin@upmediagroup.com N o matter where in the world you are, chances are you spent some EditoriAl offiCE: 2400 Lake Park Drive, Suite 440, Smyrna, GA 30080 678-589-8800; fax 678-589-8850 EditoriAl AdviSory BoArd: Dr. Eric Bogatin, Be The Signal; Michael Carano, OM Group; George Dudnikov, Sanmina-SCI; Jack Fisher, Interconnect Technology Analysis; Happy Holden, Mentor Graphics; Istvan Novak, Sun Microsystems ContriButing Editor: Dr. Hayao Nakahara ColumniStS: Bruce Archambeault, Peter Bigelow, Michael Carano, Charles Pfeil, Dr. Abe Riazi, Susy Webb, George Milad, Don Cullen, Jim Kenny Production Art dirECtor: Katherine Haddox, khaddox@upmediagroup.com produCtion mAnAgEr: Javier Longoria, jlongoria@upmediagroup.com SalES SAlES ASSoCiAtE: Kamden Robb, 678-589-8843, krobb@upmediagroup.com EXHiBit SAlES: Kamden Robb, 678-589-8843, krobb@upmediagroup.com; Frances Stewart, 678-817-1286, fstewart@upmediagroup.com KorEA SAlES: Young Media Inc., +82 2 2273 4818, fax +82 2 2273 4866, ymedia@ymedia.co.kr print rEprintS: Edward Kane, FosteReprints, 866-879-9144 ext. 131, fax 219-561-2009, ekane@fostereprints.com ElECtroniC rEprintS: pcdf_reprints@upmediagroup.com liSt rEntAl: Jennifer Schuler, 918-496-1476, fax 918-496-9465 WEBinArS: Frances Stewart, 678-817-1286, fstewart@upmediagroup.com, pcbshows.com/webinars circulation dirECtor of AudiEnCE dEvElopmEnt: Jennifer Schuler CirCulAtion And SuBSCription inquiriES/ AddrESS CHAngES: fax 918-496-9465, jschuler@upmediagroup.com uP MEdia GrouP, inc. prESidEnt: Pete Waddell viCE prESidEnt, SAlES And mArKEting: Frances Stewart, fstewart@upmediagroup.com viCE prESidEnt, EditoriAl And produCtion: Mike Buetow, mbuetow@upmediagroup.com SpECiAl projECtS mAnAgEr: Ronda Faries, 678-589-8827, rfaries@upmediagroup.com Printed Circuit Design & Fab is distributed without charge to qualified subscribers. 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Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - September 2008 Printed Circuit Design & Fab - August 2008 Contents Our Line Market Watch Around the World Happenings ROI Positive Plating Off the Shelf Marketplace Ad Index EMC for the Real World Final Finish Forum Design for Green: Laminates A Systematic Approach to Increasing Layer Count The NTI $100 Million Club Printable Nanocomposites BGA Bulletin Printed Circuit Design & Fab - September 2008 Printed Circuit Design & Fab - September 2008 - Printed Circuit Design & Fab - August 2008 (Page Cover1) Printed Circuit Design & Fab - September 2008 - Printed Circuit Design & Fab - August 2008 (Page Cover2) Printed Circuit Design & Fab - September 2008 - Printed Circuit Design & Fab - August 2008 (Page Bellyband1) Printed Circuit Design & Fab - September 2008 - Printed Circuit Design & Fab - August 2008 (Page Bellyband2) Printed Circuit Design & Fab - September 2008 - Printed Circuit Design & Fab - August 2008 (Page 1) Printed Circuit Design & Fab - September 2008 - Contents (Page 2) Printed Circuit Design & Fab - September 2008 - Contents (Page 3) Printed Circuit Design & Fab - September 2008 - Our Line (Page 4) Printed Circuit Design & Fab - September 2008 - Our Line (Page 5) Printed Circuit Design & Fab - September 2008 - Market Watch (Page 6) Printed Circuit Design & Fab - September 2008 - Market Watch (Page 7) Printed Circuit Design & Fab - September 2008 - Market Watch (Page 8) Printed Circuit Design & Fab - September 2008 - Market Watch (Page 9) Printed Circuit Design & Fab - September 2008 - Around the World (Page 10) Printed Circuit Design & Fab - September 2008 - Around the World (Page 11) Printed Circuit Design & Fab - September 2008 - Around the World (Page 12) Printed Circuit Design & Fab - September 2008 - Around the World (Page 13) Printed Circuit Design & Fab - September 2008 - Happenings (Page 14) Printed Circuit Design & Fab - September 2008 - Happenings (Page 15) Printed Circuit Design & Fab - September 2008 - ROI (Page 16) Printed Circuit Design & Fab - September 2008 - ROI (Page 17) Printed Circuit Design & Fab - September 2008 - Positive Plating (Page 18) Printed Circuit Design & Fab - September 2008 - Positive Plating (Page 19) Printed Circuit Design & Fab - September 2008 - EMC for the Real World (Page 20) Printed Circuit Design & Fab - September 2008 - Final Finish Forum (Page 21) Printed Circuit Design & Fab - September 2008 - Design for Green: Laminates (Page 22) Printed Circuit Design & Fab - September 2008 - Design for Green: Laminates (Page 23) Printed Circuit Design & Fab - September 2008 - Design for Green: Laminates (Page 24) Printed Circuit Design & Fab - September 2008 - Design for Green: Laminates (Page 25) Printed Circuit Design & Fab - September 2008 - A Systematic Approach to Increasing Layer Count (Page 26) Printed Circuit Design & Fab - September 2008 - A Systematic Approach to Increasing Layer Count (Page 27) Printed Circuit Design & Fab - September 2008 - The NTI $100 Million Club (Page 28) Printed Circuit Design & Fab - September 2008 - The NTI $100 Million Club (Page 29) Printed Circuit Design & Fab - September 2008 - The NTI $100 Million Club (Page 30) Printed Circuit Design & Fab - September 2008 - The NTI $100 Million Club (Page 31) Printed Circuit Design & Fab - September 2008 - The NTI $100 Million Club (Page 32) Printed Circuit Design & Fab - September 2008 - The NTI $100 Million Club (Page 33) Printed Circuit Design & Fab - September 2008 - The NTI $100 Million Club (Page 34) Printed Circuit Design & Fab - September 2008 - The NTI $100 Million Club (Page 35) Printed Circuit Design & Fab - September 2008 - Printable Nanocomposites (Page 36) Printed Circuit Design & Fab - September 2008 - Printable Nanocomposites (Page 37) Printed Circuit Design & Fab - September 2008 - Printable Nanocomposites (Page 38) Printed Circuit Design & Fab - September 2008 - Printable Nanocomposites (Page 39) Printed Circuit Design & Fab - September 2008 - Printable Nanocomposites (Page 40) Printed Circuit Design & Fab - September 2008 - Printable Nanocomposites (Page 41) Printed Circuit Design & Fab - September 2008 - Printable Nanocomposites (Page 42) Printed Circuit Design & Fab - September 2008 - Off the Shelf (Page 43) Printed Circuit Design & Fab - September 2008 - Marketplace (Page 44) Printed Circuit Design & Fab - September 2008 - Marketplace (Page 45) Printed Circuit Design & Fab - September 2008 - Marketplace (Page 46) Printed Circuit Design & Fab - September 2008 - Ad Index (Page 47) Printed Circuit Design & Fab - September 2008 - BGA Bulletin (Page 48) Printed Circuit Design & Fab - September 2008 - BGA Bulletin (Page Cover3) Printed Circuit Design & Fab - September 2008 - BGA Bulletin (Page Cover4)
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