Printed Circuit Design & Fab - September 2008 - (Page 41)

nanotEch cycling (DTC) between -55ºC and 125ºC was within 5%. The change in capacitance after IR reflow (assembly) pre-conditioning (3X, 245ºC) and a thermal shock up to 1,400 cycles (-55C to 125ºC) for large, medium and small embedded capacitors was less than 5% (FiGurE 7). Most of the nanocomposites in the test vehicle were stable after IR reflow, PCT and solder shock. The change of conductivity of electrically conducting adhesives after 3X IR reflow at 220ºC was less than 5%. Some of the low-loss materials were also exposed to PCT (4 hr.) followed by a 15 second solder dip at 260ºC. PCT and solder shock sometimes cause delamination. In general, solder dip/shock pick up the PCT-induced defects and cause delamination. Initial PCT - solder dip experiment didn’t show any delamination. Detailed reliability testing of nanocomposites is under investigation. rabindra daS is senior advisory technologist, Rabindra. Das@eitny.com, how lin is senior advisory test engineer, How.Lin@eitny.com, John lauFFEr is senior advisory technologist, John.Lauffer@eitny.com, MichaEl rowlandS is senior associate R&D engineer, Michael.Rowlands@eitny. com, norMan card is associate process engineer, Norm. Card@eitny.com and Voya MarkoVich is senior VP & CTo, Voya.Markovich@eitny.com, all working for Endicott Interconnect. Ed note: This article is based on materials presented at the 2008 IPC Printed Circuit Expo and is printed with the permission of the authors. Conclusion Printable nanocomposites are promising – because they are not only versatile – but also economical when compared to other methods. A variety of nanocomposites suitable in printable processes for the fabrication of selective and localized embedded components in PCB/ LCC has been developed. The materials and processes enable fine features and controlled thickness layer deposition. This is accomplished by using ink-jetting, screen printing, contact and dispensing processes. Nanocomposites can produce variable resistances ranging from 1 ohm to 120 M ohms. Low k and loss materials can also be fabricated from nanocomposites. Overall, printable nanocomposites will be useful to produce multi-functional complex electronic packaging. The results also suggest that printable nanocomposites may be attractive for roll-to-roll manufacturing of large-area microelectronics, such as roll-up displays, E-papers, keyboards, radio frequency structures and medical devices. pCd&f Bringing a world of information to you GET INTERCONNECTED “IPC is all about networking, the sharing of knowledge, being educated in return, learning about new technologies and innovating industry processes. I learn more about PWB manufacturing processes with every meeting I attend. ” Bryan James, EPA QAE Acceptance Standards/Product Integrity, Rockwell Collins, Cedar Rapids, Iowa If you need to see electronics assembly and PCB equipment, you need to be at this show! PRINTED BOARDS ELECTRONICS ASSEMBLY TEST TM rEFErEncES 1. G.B. Blanchet, C. R. Fincher, and F Gao, “Polyaniline . nanotube composites: A high-resolution printable conductor” Appl. Phys. Lett., Vol. 82, No. 8, 1291 2. D. Huang, F. Liao, S. Molesa, D. Redinger, and V. Subramanian, “Plastic-Compatible Low Resistance Printable Gold Nanoparticle Conductors for Flexible Electronics” Journal of The Electrochemical Society, 150 (7) G412-G417 (2003) 3. H-H Lee, K-S Chou, K-C Huang, “Inkjet printing of nanosized silver colloids” Nanotechnology 16 (2005) 2436–2441 4. Yiliang Wu, Yuning Li, Ping Liu, Sandra Gardner, and Beng S. ong, “Studies of Gold Nanoparticles as Precursors to Printed Conductive Features for Thin-Film Transistors” Chem. Mater. 2006, 18, 4627-4632 Keep up with global changes in technology, standards and customer expectations. Sunday–Thursday, September 24–25, 2008 Renaissance Schaumburg Hotel & Convention Center Schaumburg, Ill www.IPCMidwestShow.org SEPTEMBER 2008 printEd CirCuit dESign & fAB 41 http://www.IPCMidwestShow.org http://www.IPCMidwestShow.org

Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - September 2008

Printed Circuit Design & Fab - August 2008 Contents Our Line Market Watch Around the World Happenings ROI Positive Plating Off the Shelf Marketplace Ad Index EMC for the Real World Final Finish Forum Design for Green: Laminates A Systematic Approach to Increasing Layer Count The NTI $100 Million Club Printable Nanocomposites BGA Bulletin

Printed Circuit Design & Fab - September 2008

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