Printed Circuit Design & Fab - September 2008 - (Page 43) PRODUCT PREVIEW CONFERENCE: SEPTEMBER 14 – 19, 2008 | EXHIBITION: SEPTEMBER 16 – 17, 2008 | SANTA CLARA, CA | PCBWEST.COM SANTA CLARA MARRIOTT CAM DATA VERIFICATION TOOL CAM350 Release 10 has a user interface that improves the verification of design data before PCB fabrication. BluePrint Release 2 can simplify and automate the creation of documentation that drives the PCB fabrication, assembly and inspection processes. The user can create a complete PCB fabrication and assembly release package that can be used to distribute, view and extract documents, Gerber files, NC Drill / Mill data and panel designs for the manufacturing process. WHO: DownStream Technologies WEB: downstreamtech.com DOWNLOAD COMPONENT INFORMATION The EMA Component Information Portal (CIP) drives the integration between Cadence orCAD Capture CIS and DigiKey. CIP allows direct download of DigiKey part numbers, availability, cost, and parametric information and provides direct access to the CIS database. This allows users external to engineering to view and modify part data and approve temporary parts. The CIS database will hold data from external systems like ERP and PLM. WHO: EMA Design Automation WEB: ema-eda.com CREATE PDFS FROM PCB NETLISTS E-Studio PCB Assistant can help electronic engineers, PCB designers and test engineers to visualize, explore, debug and publish netlist and schematic data. The product supports multiple netlist and schematic formats including Cadence orCAD, Mentor PADS Powerlogic, etc. and standard formats like EDIF . E-studio PCB Assistant includes configurable PCB Netlist-To-Schematics generator and integrated schematic visual environment and exports designs to Adobe PDF schematics. WHO: Elgris Technologies, Inc. WEB: elgris.com OTHERS OF NOTE PCB INSTANT ORDERING JetPCB.com speeds up the the sales process. This online service allows PCB designers/engineers to calculate the price of the printed circuit board instantly, at any time, day or night. With this instant quote capability, the user no longer has to wait for a salesperson. once the instant PCB quote is accepted, the sales order process starts immediately; the site even accepts credit card payment. Technology is continually changing the way businesses operate, and JetPCB.com is ideal for those who recognize the convenience of the Doit-Yourself approach. WHO: JetPCB WEB: JetPCB.com/eng OPTIMIzEPI VERSION 1.2 optimizePI enables designers to meet PCB and IC package power delivery system impedance targets in record time. Prelayout assessments are simplified, and a single-click option has been added to guide optimization targeting for performance, decap count, area or cost. Component tolerances are now included as part of optimizePI’s analysis for refined accuracy, and inductance can be viewed at every decoupling capacitor location. Decap cost savings of 50% have been observed. WHO: Sigrity WEB: sigrity.com/products/optimizepi/optimizepi.htm AUTOMATED PACKAGE CREATION The new generation of DrawingX gives Pantheon users the ability to automate drawing package creation, shaving up to a full week from one design cycle. Complex assembly, fabrication and part drawings are created according to a defined standard. DrawingX utilizes reusable drawing profiles and provides a comprehensive palette of common features, such as board stack-up diagram, automated dimensioning controls and design notes that are automatically generated by the system during drawing creation. WHO: Intercept Technology Inc. WEB: intercept.com SOLDER JOINT VERIFICAITON NBS Corp announces the introduction of its newest X-Ray test equipment, the Agilent’s X6000. The X6000 is the next generation of the Agilent 5DX 3d x-ray technology and NBS uses this equipment to X-ray every solder joint that we assemble, in addition to offering X-ray testing as a service to other CM’s and oEM’s. With Three Agilent X-ray machines at NBS, we currently test in excess of 12 Million solder joints per week. Please visit us during the tour to see them in action. WHO: NBS Corp. WEB: nbscorp.com PRINTED CIRCUIT BOARDS Dynamic & Proto Circuits, offers a comprehensive line of products including; single & double-sided boards, complex multilayers, compliant-pin backplanes as well as a host of special/exotic laminate materials. Capability of up to 36 layer rigid printed circuit boards. IPC Class II/III, Military MIL -PRF 31032, ISo 9001-2000, AS9100B. Facilities include Frontline Genesis 2000 oDB++ - 11 seats. UL approved for 4/4 lines/spaces, 3/3 inners. WHO: WEB: Dynamic & Proto Circuits, Inc. dapc.com CONSTRAINT-DRIVEN HDI DESIGN Allegro PCB 16.2 has new objects, an extensive set of new rules for microvias, an enhanced via-transition use model, and changes to the entire PCB design flow to enable a comprehensive constraint-driven HDI design flow. Horizontally and soft boundary design partitioning allows users to work in parallel, further shortening the design cycle. WHO: Cadence Design Systems WEB: Cadence.com SEPTEMBER 2008 printEd CirCuit dESign & fAB 43 http://PCBWEST.COM http://PCBWEST.COM http://www.ema-eda.com http://www.downstreamtech.com http://www.elgris.com http://JetPCB.com http://JetPCB.com http://www.sigrity.com/products/optimizepi/optimizepi.htm http://www.intercept.com http://www.jetpcb.com/eng http://www.cadence.com http://www.nbscorp.com http://www.dapc.com
Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - September 2008 Printed Circuit Design & Fab - August 2008 Contents Our Line Market Watch Around the World Happenings ROI Positive Plating Off the Shelf Marketplace Ad Index EMC for the Real World Final Finish Forum Design for Green: Laminates A Systematic Approach to Increasing Layer Count The NTI $100 Million Club Printable Nanocomposites BGA Bulletin Printed Circuit Design & Fab - September 2008 Printed Circuit Design & Fab - September 2008 - Printed Circuit Design & Fab - August 2008 (Page Cover1) Printed Circuit Design & Fab - September 2008 - Printed Circuit Design & Fab - August 2008 (Page Cover2) Printed Circuit Design & Fab - September 2008 - Printed Circuit Design & Fab - August 2008 (Page Bellyband1) Printed Circuit Design & Fab - September 2008 - Printed Circuit Design & Fab - August 2008 (Page Bellyband2) Printed Circuit Design & Fab - September 2008 - Printed Circuit Design & Fab - August 2008 (Page 1) Printed Circuit Design & Fab - September 2008 - Contents (Page 2) Printed Circuit Design & Fab - September 2008 - Contents (Page 3) Printed Circuit Design & Fab - September 2008 - Our Line (Page 4) Printed Circuit Design & Fab - September 2008 - Our Line (Page 5) Printed Circuit Design & Fab - September 2008 - Market Watch (Page 6) Printed Circuit Design & Fab - September 2008 - Market Watch (Page 7) Printed Circuit Design & Fab - September 2008 - Market Watch (Page 8) Printed Circuit Design & Fab - September 2008 - Market Watch (Page 9) Printed Circuit Design & Fab - September 2008 - Around the World (Page 10) Printed Circuit Design & Fab - September 2008 - Around the World (Page 11) Printed Circuit Design & Fab - September 2008 - Around the World (Page 12) Printed Circuit Design & Fab - September 2008 - Around the World (Page 13) Printed Circuit Design & Fab - September 2008 - Happenings (Page 14) Printed Circuit Design & Fab - September 2008 - Happenings (Page 15) Printed Circuit Design & Fab - September 2008 - ROI (Page 16) Printed Circuit Design & Fab - September 2008 - ROI (Page 17) Printed Circuit Design & Fab - September 2008 - Positive Plating (Page 18) Printed Circuit Design & Fab - September 2008 - Positive Plating (Page 19) Printed Circuit Design & Fab - September 2008 - EMC for the Real World (Page 20) Printed Circuit Design & Fab - September 2008 - Final Finish Forum (Page 21) Printed Circuit Design & Fab - September 2008 - Design for Green: Laminates (Page 22) Printed Circuit Design & Fab - September 2008 - Design for Green: Laminates (Page 23) Printed Circuit Design & Fab - September 2008 - Design for Green: Laminates (Page 24) Printed Circuit Design & Fab - September 2008 - Design for Green: Laminates (Page 25) Printed Circuit Design & Fab - September 2008 - A Systematic Approach to Increasing Layer Count (Page 26) Printed Circuit Design & Fab - September 2008 - A Systematic Approach to Increasing Layer Count (Page 27) Printed Circuit Design & Fab - September 2008 - The NTI $100 Million Club (Page 28) Printed Circuit Design & Fab - September 2008 - The NTI $100 Million Club (Page 29) Printed Circuit Design & Fab - September 2008 - The NTI $100 Million Club (Page 30) Printed Circuit Design & Fab - September 2008 - The NTI $100 Million Club (Page 31) Printed Circuit Design & Fab - September 2008 - The NTI $100 Million Club (Page 32) Printed Circuit Design & Fab - September 2008 - The NTI $100 Million Club (Page 33) Printed Circuit Design & Fab - September 2008 - The NTI $100 Million Club (Page 34) Printed Circuit Design & Fab - September 2008 - The NTI $100 Million Club (Page 35) Printed Circuit Design & Fab - September 2008 - Printable Nanocomposites (Page 36) Printed Circuit Design & Fab - September 2008 - Printable Nanocomposites (Page 37) Printed Circuit Design & Fab - September 2008 - Printable Nanocomposites (Page 38) Printed Circuit Design & Fab - September 2008 - Printable Nanocomposites (Page 39) Printed Circuit Design & Fab - September 2008 - Printable Nanocomposites (Page 40) Printed Circuit Design & Fab - September 2008 - Printable Nanocomposites (Page 41) Printed Circuit Design & Fab - September 2008 - Printable Nanocomposites (Page 42) Printed Circuit Design & Fab - September 2008 - Off the Shelf (Page 43) Printed Circuit Design & Fab - September 2008 - Marketplace (Page 44) Printed Circuit Design & Fab - September 2008 - Marketplace (Page 45) Printed Circuit Design & Fab - September 2008 - Marketplace (Page 46) Printed Circuit Design & Fab - September 2008 - Ad Index (Page 47) Printed Circuit Design & Fab - September 2008 - BGA Bulletin (Page 48) Printed Circuit Design & Fab - September 2008 - BGA Bulletin (Page Cover3) Printed Circuit Design & Fab - September 2008 - BGA Bulletin (Page Cover4)
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