Printed Circuit Design & Fab - October 2008 - (Page 12) HAPPENINGS FACES Patrick Crowley has been appointed president of Nelco Products Pte. Ltd., the subsidiary of Park Electrochemical Corporation located in Singapore. In addition, he will also serve as president of Nelco Technology, Park’s ECM subsidiary in China. Prior to his latest appointment, Crowley served several key positions within Park’s subsidiaries, including president of Neltec and Neltec Europe. Prototron Circuits recently appointed Judy K. Gentry to manage the company’s sales efforts in the Upper Midwest. Gentry has over 25 years of experience in the printed circuit board industry, including sales management and ownership positions with several companies including Nobel Industries, Wellbord and Multicircuits. Tiffany Charles recently joined the inside sales team of Canadian Circuits, Inc. She brings a strong background in customer service and sales. Charles will report to Pam Arya who is the sales manager and co-owner of Canadian Circuits. Charles joins Canadian Circuits with a strong background steeped in customer service and sales. Her goal is to be the “voice of the customer” at Canadian Circuits. Lazer-Tech recently announced that Ping Li has joined the company’s sales team and will be in charge of inside sales. With over 10 years of experience in the printed circuit board industry, Li has held key positions within a number of companies including Dynamic Details Canada and Data Circuits. Hamid R. Shokrgozar resigned as chairman, president, CEO and director of White Electronic Designs Corporation. Following Shokrgozar’s resignation, Edward A. White, the company’s founder, was elected chairman of the board. The board has begun an immediate search for a replacement. Until a permanent replacement is identified, Roger A. Derse, vice president and CFO, and Dante V. Tarantine, executive vice president sales and marketing, will perform the duties of the office of the president of the company. EVENTS 8 HDI Technology Conference Wyndham DFW Airport Irving, Texas Contact: www.ipc.org/HDIConference OCTOBER 13-16 International Wafer-Level Packaging Conference (IWLPC) Hosted by SMTA San Jose, California Contact: www.iwlpc.com 21-23 Mexitronica Guadalajara, Mexico Contact: www.mexitronica.com 22-24 2008 IMPACT & EMAP Joint Conference Taipei Nangang Exhibition Center Taipei, Taiwan contact: www.impact-emap.org 22-24 TPCA Show Hosted by TPCA Taipei, Taiwan Contact: www.tpca.org.tw 11-12 Symposium on Environmentally Friendly Materials Hosted by iNEMI and Intel Corp. InterContinental Hotel Shanghai, China Contact:www.inemi.org/cms/calendar/Intel_ Environmental_Materials.html 12-13 VIRTUAL PCB HOSTED BY UP MEDIA GROUP WWW.VIRTUAL-PCB.COM 2-4 PCB ORLANDO HOLIDAY INN INTERNATIONAL DRIVE RESORT ORLANDO, FLORIDA CONTACT: WWW.PCBSHOWS.COM 2008 International Printed Circuit and Electronics Assembly Fair Sponsored by HKPCA Shenzhen, China Contact: info@e21mm.com NOV DECEMBER 3-5 IT’S A DEAL Hunter Technology Corporation and Hallmark Circuits, Inc. have embarked on a joint market campaign in which both companies will fall under one sales and marketing group, headed by Mike Kadlec. The partnership allows Hunter to continue to expand their vertically integrated EMS model, while Hallmark customers will benefit from design in-sourcing capabilities and end-to-end electronic manufacturing services. Anaren Microwave Inc. announced it has entered into an agreement to acquire Unicircuit, Inc. of Littleton, CO. for approximately $22.5 million. Net sales for Unicircuit in 2007 was approximately $18.7 million. “Unicircuit is a leader in high frequency printed circuit board 12 (PCB) technology. The combination of Anaren’s microwave design, assembly and test capabilities, coupled with Unicircuit’s high frequency PCB technology, will greatly enhance Anaren’s ability to capture integrated microwave assembly opportunities in defense and aerospace applications, said Lawrence A. Sala, ” president and CEO of Anaren. Enthone Inc. has acquired Ormecon GmbH for an undisclosed sum. Ormecon supplies surface finishing products including an immersion tin and an organic nanofinish. Huub van Dun, Enthone’s president said, “Both Enthone and Ormecon are global leaders to the PCB surface finishes segment, making this acquisition an excellent strategic fit. The com- bination of Ormecon and Enthone is an enabling pathway for Enthone to further strengthen and expand our leadership as the premier supplier of PCB surface finishes, while developing new technologies to both existing and new, emerging markets. ” AT&S has installed Cimnet Systems’ pre-production engineering applications Engenix and the Direct Logix Control Center Solution in all six of the company’s facilities. Engenix includes tools for job management, pre-production engineering and communication and collaboration, and will be used to continue the development of advanced engineering tools in order to meet changing PCB technology. OCTOBER 2008 PRINTED CIRCUIT DESIGN & FAB http://www.ipc.org/HDIConference http://www.iwlpc.com http://www.mexitronica.com http://www.impact-emap.org http://www.tpca.org.tw http://www.inemi.org/cms/calendar/Intel_Environmental_Materials.html http://www.inemi.org/cms/calendar/Intel_Environmental_Materials.html http://www.virtual-pcb.com http://www.pcbshows.com
Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - October 2008 Printed Circuit Design & Fab - October 2008 Contents Our Line Market Watch Around the World Happenings Test and Inspection ROI Tip Jar Interconnect Strategies Final Finish Forum The New Wave in High-Speed Modeling The PCB Design Library Mixed Signal Design Considerations Modeling Conductor Surface Roughness Copper Erosion: The Influence of Metallurgy on Copper Dissolution The Wave of the Future Ad Index Building a Profitable Niche Marketplace Off the Shelf BGA Bulletin Printed Circuit Design & Fab - October 2008 Printed Circuit Design & Fab - October 2008 - Printed Circuit Design & Fab - October 2008 (Page Cover1) Printed Circuit Design & Fab - October 2008 - Printed Circuit Design & Fab - October 2008 (Page Cover2) Printed Circuit Design & Fab - October 2008 - Printed Circuit Design & Fab - October 2008 (Page 1) Printed Circuit Design & Fab - October 2008 - Contents (Page 2) Printed Circuit Design & Fab - October 2008 - Contents (Page 3) Printed Circuit Design & Fab - October 2008 - Our Line (Page 4) Printed Circuit Design & Fab - October 2008 - Our Line (Page 5) Printed Circuit Design & Fab - October 2008 - Market Watch (Page 6) Printed Circuit Design & Fab - October 2008 - Market Watch (Page 7) Printed Circuit Design & Fab - October 2008 - Around the World (Page 8) Printed Circuit Design & Fab - October 2008 - Around the World (Page 9) Printed Circuit Design & Fab - October 2008 - Around the World (Page 10) Printed Circuit Design & Fab - October 2008 - Around the World (Page 11) Printed Circuit Design & Fab - October 2008 - Happenings (Page 12) Printed Circuit Design & Fab - October 2008 - Happenings (Page 13) Printed Circuit Design & Fab - October 2008 - Test and Inspection (Page 14) Printed Circuit Design & Fab - October 2008 - Test and Inspection (Page 15) Printed Circuit Design & Fab - October 2008 - ROI (Page 16) Printed Circuit Design & Fab - October 2008 - Tip Jar (Page 17) Printed Circuit Design & Fab - October 2008 - Interconnect Strategies (Page 18) Printed Circuit Design & Fab - October 2008 - Interconnect Strategies (Page 19) Printed Circuit Design & Fab - October 2008 - Final Finish Forum (Page 20) Printed Circuit Design & Fab - October 2008 - Final Finish Forum (Page 21) Printed Circuit Design & Fab - October 2008 - The New Wave in High-Speed Modeling (Page 22) Printed Circuit Design & Fab - October 2008 - The New Wave in High-Speed Modeling (Page 23) Printed Circuit Design & Fab - October 2008 - The New Wave in High-Speed Modeling (Page 24) Printed Circuit Design & Fab - October 2008 - The New Wave in High-Speed Modeling (Page 25) Printed Circuit Design & Fab - October 2008 - The PCB Design Library (Page 26) Printed Circuit Design & Fab - October 2008 - The PCB Design Library (Page 27) Printed Circuit Design & Fab - October 2008 - The PCB Design Library (Page 28) Printed Circuit Design & Fab - October 2008 - Mixed Signal Design Considerations (Page 29) Printed Circuit Design & Fab - October 2008 - Mixed Signal Design Considerations (Page 30) Printed Circuit Design & Fab - October 2008 - Mixed Signal Design Considerations (Page 31) Printed Circuit Design & Fab - October 2008 - Modeling Conductor Surface Roughness (Page 32) Printed Circuit Design & Fab - October 2008 - Modeling Conductor Surface Roughness (Page 33) Printed Circuit Design & Fab - October 2008 - Modeling Conductor Surface Roughness (Page 34) Printed Circuit Design & Fab - October 2008 - Copper Erosion: The Influence of Metallurgy on Copper Dissolution (Page 35) Printed Circuit Design & Fab - October 2008 - Copper Erosion: The Influence of Metallurgy on Copper Dissolution (Page 36) Printed Circuit Design & Fab - October 2008 - Copper Erosion: The Influence of Metallurgy on Copper Dissolution (Page 37) Printed Circuit Design & Fab - October 2008 - The Wave of the Future (Page 38) Printed Circuit Design & Fab - October 2008 - Ad Index (Page 39) Printed Circuit Design & Fab - October 2008 - Building a Profitable Niche (Page 40) Printed Circuit Design & Fab - October 2008 - Building a Profitable Niche (Page 41) Printed Circuit Design & Fab - October 2008 - Building a Profitable Niche (Page 42) Printed Circuit Design & Fab - October 2008 - Off the Shelf (Page 43) Printed Circuit Design & Fab - October 2008 - Marketplace (Page 44) Printed Circuit Design & Fab - October 2008 - Marketplace (Page 45) Printed Circuit Design & Fab - October 2008 - Marketplace (Page 46) Printed Circuit Design & Fab - October 2008 - Marketplace (Page 47) Printed Circuit Design & Fab - October 2008 - BGA Bulletin (Page 48) Printed Circuit Design & Fab - October 2008 - BGA Bulletin (Page Cover3) Printed Circuit Design & Fab - October 2008 - BGA Bulletin (Page Cover4)
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