Printed Circuit Design & Fab - October 2008 - (Page 2) OCTOBER 2008 • VOL. 25 • NO. 10 FEATURES Building a comprehensive PCB library can save time in the design process, improve quality and increase project margins. Cover artwork ©iStockPhoto/Alex Nikada Schematics courtesy of Intercept Technology. 22 SIGNAL INTEGRITY The New Wave in High-Speed Modeling Unlocking the electrical performance of an interconnect may be as simple as mastering the S-parameter. by DR. ERIC BOGATIN 26 DESIGN TOOLS POINT OF VIEW 4 THE PCB DESIGN LIBRARY Building and managing a library can translate into long-term timesavings and improved margins. by ABBY MONACO 29 DESIGN BASICS OUR LINE The people’s choice. Kathy Nargi-Toth 14 Mixed Signal Design Considerations Designs with analog, digital and RF features challenge the PCB designer to reduce noise, improve EMI performance and lower distortion. by SYED W. ALI 32 MODELING TEST AND INSPECTION A novel soldered bump could improve access at ICT, but must be designed in. Stacy Kalisz Johnson 16 Modeling Conductor Surface Roughness Stripline models can be used to determine the impact of copper surface roughness on transmission properties. by ANTONIO CICCOMANCINI SCOGNA 35 PLATING ROI Identifying critical requirements can help a business achieve measurable results. Peter Bigelow 17 Copper Erosion: The Influence of Metallurgy on Copper Dissolution The rate of copper dissolution in lead-free soldering may be linked to the physical characteristics of the electroplated copper. by CHRYS SHEA, JIM KENNY, JEAN RASMUSSEN, GIRISH WABLE, QUYEN CHU, SHIANG TENG, KEITH SWEATMAN and KAZUHIRO NOGITA, PH.D. 38 OUTSOURCING TIP JAR Designers crave rules, but few rules apply in every situation. Susy Webb 18 INTERCONNECT STRATEGIES Small, higher-density PCBs cost less to fabricate than high layer count boards, but closely spaced traces can result in crosstalk issues. The Wave of the Future Increasing offshore costs give rise to changing global outsourcing strategies. by GREG PAPANDREW 40 FRONT END ENGINEERING Dr. Abe (Abbas) Riazi 20 Building a Profitable Niche Engineering systems capture detailed customer specifications and transfer design and quote information to fabrication. by MEHUL DAVE FINAL FINISH FORUM Scratching the surface of surface finishes. Don Cullen 48 DEPARTMENTS 6 8 BGA BULLETIN Microvias can reduce the signal layer requirement. MARKET WATCH AROUND THE WORLD 12 39 HAPPENINGS AD INDEX 43 44 OFF THE SHELF MARKETPLACE Charles Pfeil Circuits Assembly Online MEDICAL ELECTRONICS ASSEMBLY TALKING HEADS circuitsassembly.com REACH Costs ‘Horrifically Expensive’ The legislation known as REACH (Regulation on Registration, Evaluation, Authorization and Restriction of Chemicals) has been in effect since June 1, 2007, yet that particular date lacked impact, says Michael Kirschner. But the president of Design Chain Associates says all that will change on Dec. 1. by CHELSEY DRYSDALE ‘Checking Up’ on Medical Electronics Medical electronics assembly demands a different set of criteria than do commercial PCBs. The US FDA requires specific documentation, especially for verification of certain processes. Today’s medical electronics assembly also requires special testing, avoiding obsolete components and a detailed evaluation of a Pb-free product. by ZULKI KHAN POSTMASTER: Send address changes to PRINTED CIRCUIT DESIGN & FAB, PO Box 35621 Tulsa, OK 74153-0621 http://www.circuitsassembly.com
Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - October 2008 Printed Circuit Design & Fab - October 2008 Contents Our Line Market Watch Around the World Happenings Test and Inspection ROI Tip Jar Interconnect Strategies Final Finish Forum The New Wave in High-Speed Modeling The PCB Design Library Mixed Signal Design Considerations Modeling Conductor Surface Roughness Copper Erosion: The Influence of Metallurgy on Copper Dissolution The Wave of the Future Ad Index Building a Profitable Niche Marketplace Off the Shelf BGA Bulletin Printed Circuit Design & Fab - October 2008 Printed Circuit Design & Fab - October 2008 - Printed Circuit Design & Fab - October 2008 (Page Cover1) Printed Circuit Design & Fab - October 2008 - Printed Circuit Design & Fab - October 2008 (Page Cover2) Printed Circuit Design & Fab - October 2008 - Printed Circuit Design & Fab - October 2008 (Page 1) Printed Circuit Design & Fab - October 2008 - Contents (Page 2) Printed Circuit Design & Fab - October 2008 - Contents (Page 3) Printed Circuit Design & Fab - October 2008 - Our Line (Page 4) Printed Circuit Design & Fab - October 2008 - Our Line (Page 5) Printed Circuit Design & Fab - October 2008 - Market Watch (Page 6) Printed Circuit Design & Fab - October 2008 - Market Watch (Page 7) Printed Circuit Design & Fab - October 2008 - Around the World (Page 8) Printed Circuit Design & Fab - October 2008 - Around the World (Page 9) Printed Circuit Design & Fab - October 2008 - Around the World (Page 10) Printed Circuit Design & Fab - October 2008 - Around the World (Page 11) Printed Circuit Design & Fab - October 2008 - Happenings (Page 12) Printed Circuit Design & Fab - October 2008 - Happenings (Page 13) Printed Circuit Design & Fab - October 2008 - Test and Inspection (Page 14) Printed Circuit Design & Fab - October 2008 - Test and Inspection (Page 15) Printed Circuit Design & Fab - October 2008 - ROI (Page 16) Printed Circuit Design & Fab - October 2008 - Tip Jar (Page 17) Printed Circuit Design & Fab - October 2008 - Interconnect Strategies (Page 18) Printed Circuit Design & Fab - October 2008 - Interconnect Strategies (Page 19) Printed Circuit Design & Fab - October 2008 - Final Finish Forum (Page 20) Printed Circuit Design & Fab - October 2008 - Final Finish Forum (Page 21) Printed Circuit Design & Fab - October 2008 - The New Wave in High-Speed Modeling (Page 22) Printed Circuit Design & Fab - October 2008 - The New Wave in High-Speed Modeling (Page 23) Printed Circuit Design & Fab - October 2008 - The New Wave in High-Speed Modeling (Page 24) Printed Circuit Design & Fab - October 2008 - The New Wave in High-Speed Modeling (Page 25) Printed Circuit Design & Fab - October 2008 - The PCB Design Library (Page 26) Printed Circuit Design & Fab - October 2008 - The PCB Design Library (Page 27) Printed Circuit Design & Fab - October 2008 - The PCB Design Library (Page 28) Printed Circuit Design & Fab - October 2008 - Mixed Signal Design Considerations (Page 29) Printed Circuit Design & Fab - October 2008 - Mixed Signal Design Considerations (Page 30) Printed Circuit Design & Fab - October 2008 - Mixed Signal Design Considerations (Page 31) Printed Circuit Design & Fab - October 2008 - Modeling Conductor Surface Roughness (Page 32) Printed Circuit Design & Fab - October 2008 - Modeling Conductor Surface Roughness (Page 33) Printed Circuit Design & Fab - October 2008 - Modeling Conductor Surface Roughness (Page 34) Printed Circuit Design & Fab - October 2008 - Copper Erosion: The Influence of Metallurgy on Copper Dissolution (Page 35) Printed Circuit Design & Fab - October 2008 - Copper Erosion: The Influence of Metallurgy on Copper Dissolution (Page 36) Printed Circuit Design & Fab - October 2008 - Copper Erosion: The Influence of Metallurgy on Copper Dissolution (Page 37) Printed Circuit Design & Fab - October 2008 - The Wave of the Future (Page 38) Printed Circuit Design & Fab - October 2008 - Ad Index (Page 39) Printed Circuit Design & Fab - October 2008 - Building a Profitable Niche (Page 40) Printed Circuit Design & Fab - October 2008 - Building a Profitable Niche (Page 41) Printed Circuit Design & Fab - October 2008 - Building a Profitable Niche (Page 42) Printed Circuit Design & Fab - October 2008 - Off the Shelf (Page 43) Printed Circuit Design & Fab - October 2008 - Marketplace (Page 44) Printed Circuit Design & Fab - October 2008 - Marketplace (Page 45) Printed Circuit Design & Fab - October 2008 - Marketplace (Page 46) Printed Circuit Design & Fab - October 2008 - Marketplace (Page 47) Printed Circuit Design & Fab - October 2008 - BGA Bulletin (Page 48) Printed Circuit Design & Fab - October 2008 - BGA Bulletin (Page Cover3) Printed Circuit Design & Fab - October 2008 - BGA Bulletin (Page Cover4)
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