Printed Circuit Design & Fab - October 2008 - (Page 24)

HMS Total System Concept Total System Concept – Our goal is to be able, in future, to offer our customers the complete range of necessary equipment. That will provide the customer with a production line made up of modules optimally adapted to each other and ensure a maximum of security in planning, as he will have only one project partner to deal with. Additive Tin Process process oriented machine solutions Troughhole Plating HDF Tsunami Technology - primary focus is on the rinsing of the holes - faster removement of the chemistry in smaller holes - less drag-in of chemistry in following process - removing air bubbles out of holes - less space requirements - lower equipment costs Desmear DC & Resist and Reverse Pulse Plating ComPlate Exposure System – Impact of G4 - 50% reduced current at contact Cu G4 Selectable for both, ng Plating Imaging - robust machine behaviour - strongly reduced maintenance - higher current density possible: 12-15 Adm in panel plating, 4-6 Adm in pattern plating - best surface uniformity - TCC (thin copper clad) compatible: 0,1µm – 2,5µm base copper - ﬁne line applicable:15µm line and space Clean Etching HMS Spray/Flood Technology - primary focus is a perfect treatment of high aspect ratio holes - removement of particles and soluble coatings in small holes with high solution ﬂow rate combined with effective spray pressure - high impact spray/ﬂood bar with ﬂat spray nozzles close to product - can be used in process steps and rinses - high yields because of most reliable hole cleaning Tin Stripping Tin Plating Stripping Solder Mask & Exposure Cleaning Finishing Tin as resist - ﬁne line adjustment system for equal etching over whole product - high impact nozzles with short spray angle, spraying in gap between rollers - ultra high resolution and etching factor - special correction etch system for correction of leading/trailing edge or dog bone effects available Imaging - high frequent oscillation system Höllmüller Maschinenbau GmbH Kappstrasse 69, 71083 Herrenberg, Germany more information www.hms-germany.de Fon +49-7032-207-0 , Fax +49-7032-207-113 contact@hms-germany.de http://www.hms-germany.de

Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - October 2008

Printed Circuit Design & Fab - October 2008 Contents Our Line Market Watch Around the World Happenings Test and Inspection ROI Tip Jar Interconnect Strategies Final Finish Forum The New Wave in High-Speed Modeling The PCB Design Library Mixed Signal Design Considerations Modeling Conductor Surface Roughness Copper Erosion: The Influence of Metallurgy on Copper Dissolution The Wave of the Future Ad Index Building a Profitable Niche Marketplace Off the Shelf BGA Bulletin

Printed Circuit Design & Fab - October 2008

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