Printed Circuit Design & Fab - October 2008 - (Page 8) AROUND thE world lazer-Tech Mil-prF Certified TORONTO – Lazer-Tech recently achieved MIL-PRF 55110 certification for the United States Department of Defense, allowing the company to process multilayer PCBs up to 20 layers containing 3 mil line/space and blind/buried technology. The certification brings Lazer-Tech into the MIL/Aero sector. In addition, the company completed the Controlled Goods Program (CGP), allowing the possession or transfer of controlled goods in accordance with the Defense Production Act. These certifications will allow the company to supply Mil spec PCBs to the US and Canada. OLATHE, KS – Bogatin Enterprises and the IEEE (Institute of Electrical and Elec- Bogatin Enterprises Partners with IEEE on Educational Programs CONTINUOUS LEARNING tronics Engineers) announce a Professional Development Certification Program conducted in conjunction with the IEEE’s Educational Partner’s Program. This partnership will provide a series of signal integrity and electrical design focused certification courses that cover the latest in high-speed design, simulation and modeling techniques. Classes beginning January 2009 will combine the traditional classroom style education along with a strong distance-learning program to facilitate access for signal integrity engineers world-wide. Challenges ahead for Indian pCB Industry BANGALORE – Despite the disparity Weak Market Impacting Electronics Growth VIETNAM – Since May, the electron- ics market has seen a 30% to 50% decrease in electronic goods including mobile phones, IT items and engineering products. The slowdown can be attributed to fluctuations within the market including a decrease in consumer spending and a record-high exchange rate on the US dollar. In addition, there are import contracts that cannot be cancelled that have resulted in stockpiles of higher-priced, imported electronics currently in low demand. between low production and high consumer demand, India shows high business potential for the PCB industry. The country has about 60 mid- to large-size PCB factories that produce approximately $300 million worth of PCBs per year. The total domestic consumption of PCBs is estimated at nearly $2 billion. China is the major importer, with a cost 15% to 20% cheaper than domestic products. Stringent environmental regulations and bureaucratic red tape, as well as high custom duties and difficulties with licensing, have contributed to the slow growth in this manufacturing sector. SAFETy DRIvEN Automotive MEMS Sensor Market to Nearly Double by 2012 EL SEGUNDO, CA – Driven by government mandates, global shipments of automo- SuNY, Sigrity File Patent Infringement Suit SANTA CLARA, CA – Sigrity Inc. and The Research Foundation of the State University of New York (SUNY) have filed a lawsuit against Ansoft Corp. and ANSYS, Inc. for infringement of U.S. Patent No. 5,504,423 titled “Method for Modeling Interactions in Multilayered Electronic Packaging Structures.” The Research Foundation is the owner and Sigrity is the exclusive licensee of this patent. The suit was filed on July 21, 2008 against Ansoft and alleges that Ansoft’s products, including its SIwave product, infringe the patent. An amended complaint adding ANSYS as a defendant was filed on August 5, 2008 as a result of ANSYS’s acquisition of Ansoft, which was effective July 31, 2008. 8 tive MEMS sensors are expected to nearly double from 2006 to 2012, according to iSuppli Corp. iSuppli forecasts worldwide automotive MEMS sensor shipments will grow to 935.7 million units in 2012, rising at a CAGR of 12% from 2006. Global auto MEMS sensor revenue will increase to $2.1 billion in 2012, increasing at a CAGR of 8%. “Driving the rapid growth of the automotive MEMS sensor market in the United States and Europe is a set of chassis safety-related mandates that makes compulsory the implementation of electronic stability control systems and tirepressure monitors,” said Richard Dixon, senior analyst for MEMS at iSuppli. Shipments of MEMS pressure sensors for tire pressure monitoring systems are expected to reach 179 million units in 2012, up from 43.1 million in 2006. Shipments of MEMS inertial and pressure sensors used in ESC systems will increase to 158 million units in 2012, rising at a CAGR of 17%. A substantial market driver will emerge in 2009 when Europe’s stringent emission–control regulations go into effect, said the firm. This will boost demand for powertrain pressure sensors. Other healthy MEMS markets include high-g accelerometers for airbags. “Mandates are reshaping the supply chain,” said Jérémie Bouchaud, principal analyst for MEMS at iSuppli. “In the case of ESC systems, transitioning rapidly from an expensive option to a standard function in just a few years will create a space for newcomers and threaten established second-tier suppliers.” Bouchaud added the market transparency brought by government mandates may herald greater commoditization and price erosion in MEMS sensor products, as all suppliers provide products that conform to government specifications, and which accommodate a range spanning the most expensive to the cheapest available vehicle. OCTOBER 2008 printEd CirCuit dESign & fAB
Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - October 2008 Printed Circuit Design & Fab - October 2008 Contents Our Line Market Watch Around the World Happenings Test and Inspection ROI Tip Jar Interconnect Strategies Final Finish Forum The New Wave in High-Speed Modeling The PCB Design Library Mixed Signal Design Considerations Modeling Conductor Surface Roughness Copper Erosion: The Influence of Metallurgy on Copper Dissolution The Wave of the Future Ad Index Building a Profitable Niche Marketplace Off the Shelf BGA Bulletin Printed Circuit Design & Fab - October 2008 Printed Circuit Design & Fab - October 2008 - Printed Circuit Design & Fab - October 2008 (Page Cover1) Printed Circuit Design & Fab - October 2008 - Printed Circuit Design & Fab - October 2008 (Page Cover2) Printed Circuit Design & Fab - October 2008 - Printed Circuit Design & Fab - October 2008 (Page 1) Printed Circuit Design & Fab - October 2008 - Contents (Page 2) Printed Circuit Design & Fab - October 2008 - Contents (Page 3) Printed Circuit Design & Fab - October 2008 - Our Line (Page 4) Printed Circuit Design & Fab - October 2008 - Our Line (Page 5) Printed Circuit Design & Fab - October 2008 - Market Watch (Page 6) Printed Circuit Design & Fab - October 2008 - Market Watch (Page 7) Printed Circuit Design & Fab - October 2008 - Around the World (Page 8) Printed Circuit Design & Fab - October 2008 - Around the World (Page 9) Printed Circuit Design & Fab - October 2008 - Around the World (Page 10) Printed Circuit Design & Fab - October 2008 - Around the World (Page 11) Printed Circuit Design & Fab - October 2008 - Happenings (Page 12) Printed Circuit Design & Fab - October 2008 - Happenings (Page 13) Printed Circuit Design & Fab - October 2008 - Test and Inspection (Page 14) Printed Circuit Design & Fab - October 2008 - Test and Inspection (Page 15) Printed Circuit Design & Fab - October 2008 - ROI (Page 16) Printed Circuit Design & Fab - October 2008 - Tip Jar (Page 17) Printed Circuit Design & Fab - October 2008 - Interconnect Strategies (Page 18) Printed Circuit Design & Fab - October 2008 - Interconnect Strategies (Page 19) Printed Circuit Design & Fab - October 2008 - Final Finish Forum (Page 20) Printed Circuit Design & Fab - October 2008 - Final Finish Forum (Page 21) Printed Circuit Design & Fab - October 2008 - The New Wave in High-Speed Modeling (Page 22) Printed Circuit Design & Fab - October 2008 - The New Wave in High-Speed Modeling (Page 23) Printed Circuit Design & Fab - October 2008 - The New Wave in High-Speed Modeling (Page 24) Printed Circuit Design & Fab - October 2008 - The New Wave in High-Speed Modeling (Page 25) Printed Circuit Design & Fab - October 2008 - The PCB Design Library (Page 26) Printed Circuit Design & Fab - October 2008 - The PCB Design Library (Page 27) Printed Circuit Design & Fab - October 2008 - The PCB Design Library (Page 28) Printed Circuit Design & Fab - October 2008 - Mixed Signal Design Considerations (Page 29) Printed Circuit Design & Fab - October 2008 - Mixed Signal Design Considerations (Page 30) Printed Circuit Design & Fab - October 2008 - Mixed Signal Design Considerations (Page 31) Printed Circuit Design & Fab - October 2008 - Modeling Conductor Surface Roughness (Page 32) Printed Circuit Design & Fab - October 2008 - Modeling Conductor Surface Roughness (Page 33) Printed Circuit Design & Fab - October 2008 - Modeling Conductor Surface Roughness (Page 34) Printed Circuit Design & Fab - October 2008 - Copper Erosion: The Influence of Metallurgy on Copper Dissolution (Page 35) Printed Circuit Design & Fab - October 2008 - Copper Erosion: The Influence of Metallurgy on Copper Dissolution (Page 36) Printed Circuit Design & Fab - October 2008 - Copper Erosion: The Influence of Metallurgy on Copper Dissolution (Page 37) Printed Circuit Design & Fab - October 2008 - The Wave of the Future (Page 38) Printed Circuit Design & Fab - October 2008 - Ad Index (Page 39) Printed Circuit Design & Fab - October 2008 - Building a Profitable Niche (Page 40) Printed Circuit Design & Fab - October 2008 - Building a Profitable Niche (Page 41) Printed Circuit Design & Fab - October 2008 - Building a Profitable Niche (Page 42) Printed Circuit Design & Fab - October 2008 - Off the Shelf (Page 43) Printed Circuit Design & Fab - October 2008 - Marketplace (Page 44) Printed Circuit Design & Fab - October 2008 - Marketplace (Page 45) Printed Circuit Design & Fab - October 2008 - Marketplace (Page 46) Printed Circuit Design & Fab - October 2008 - Marketplace (Page 47) Printed Circuit Design & Fab - October 2008 - BGA Bulletin (Page 48) Printed Circuit Design & Fab - October 2008 - BGA Bulletin (Page Cover3) Printed Circuit Design & Fab - October 2008 - BGA Bulletin (Page Cover4)
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