Printed Circuit Design & Fab - November 2008 - (Page 34) FROM THE FIELD PcB West: Interview with nBS Design Inc. Craig Arcuri talks about the company credo; passion, quality and speed, that translates into end product perfection. by kATHy NARGI-TOTH PCB WeSt MOVeD to its new venue in Santa Clara, CA, this past September. The program did not disappoint as organizers and sponsors expanded it to include new classes and a plant tour. The exhibit hall sold out, and the attendees networked throughout the week, spending time in tutorials and workshops and perusing the exhibits. UP Media Group launched the UPstudio to provide coverage of the conference. At the close of the 2-day exhibition, there was an in-depth shop tour of NBS Design Inc. It was conducted by president and CEO Craig Arcuri and supported by his talented team. Highlights of the tour can be seen at www.pcbwest.com/upstudio. I had a chance to speak with the very charismatic Craig Arcuri before the tour to learn a bit more about the company. Mr. Arcuri provided some interesting insight into NBS Design employees and how the company has become so successful. Interview PCD&F: I’ve heard NBS has the motto, “Passion, Quality, Speed.” Could you elaborate on that? Craig Arcuri: Simply put, it is the collective passion of the company that creates the environment that allows for the quality and speed. It is the root, and without the passion to build a perfect product every time, consistent quality is impossible to achieve. NBS has been described as fanatical about quality. This comes from passion. We can and do expect every board of every build to be perfect. You can quickly see by looking at our facility that we have an extreme attention to detail in every aspect of our business. The facility is spotless. The manufacturing flow is seamless. A typical assembly line ‘change over’ is measured in minutes; ours is measured in seconds, because time is a critical component to our success. I could go on and on, but one look at how NBS employees approach their jobs, and the tools the company has provided, with an absolute passion from the top on down to build perfect boards explains why we have been successful. We aim to be absolutely world class in every respect. PCD&F: Tell me about DfA at NBS. Is it a fact that when design and assembly teams are co-located, communication improves and yields go up? Craig Arcuri: Yes, yields do go up, and with this integration done correctly, they go up substantially. NBS pioneered a DfA/DfM process called Continuous Validation. Traditionally, after a PCB layout is completed, a final DfM/DfA check is run. The problem with this approach is that in most cases, there is little time available to fix the things that the manufacturability check finds. Even more critical, serious errors that are found and 34 must be fixed cause big schedule hits because the fixes require the layout to be redone. In the NBS Continuous Validation process, the layout undergoes four to six DfM/DfA checks at each critical stage of the layout process. Not only does this have a great positive impact on yield, but also it adds no time to the process because theses checks are done in parallel with layout, and when errors are found, they are fixed before they can impact the schedule. Another byproduct of Continuous Validation is that engineering and manufacturing teams never get to the point of disagreeing because they are working together from the start, and potential issues are mitigated immediately rather then waiting until the end of the layout process. PCD&F: As a design company, what are some of the other tangible advantages of having an in-house assembly operation? Craig Arcuri: Higher yield, faster turn around times, consistent results and long-term product reliability come to mind. Often when I am doing a tour of NBS for a perspective customer, this is reinforced when I get to the layout room and see not one but several of our manufacturing process engineers sitting side-by-side with our layout engineers, creating a solution to a layout/manufacturing challenge. Also, each of designers has had to spend many weeks actually on the assembly floor working for the production staff. They have gotten to ‘feel the pain’ of hand installing hundreds of jumpers on a poorly marked board, then having to go back and move those jumpers to the correct location after AOI discovers their error. Believe me, after you do this once or twice, you work very hard to make sure that the silkscreen on a board is clear! PCD&F: How many customers do you have? Craig Arcuri: The typical assembly shop desires to have a small number of large customers. At NBS our infrastructure was set up from the beginning to handle hundreds of customers of all sizes. This fiscal year, we have approximately 175 active customers, ranging from $75 to over $5M. Next year we expect that to double. PCD&F: There are hundreds of contract manufactures out there. Your firm continues to do incredibly well, so what really makes NBS so unique in the market? Craig Arcuri: I’ve been asked that question many times, and I wish I could come up with an incredibly complicated answer or provide some evidence of a proprietary process that is unique to NBS and nobody else. What makes NBS grow continuously in this extremely competitive market is the decisions that have been made and the willpower to stick with it. When we looked at starting the manufacturing operation, we looked at all of the NOVEMBER 2008 printEd CirCuit dESign & fAB http://www.pcbwest.com/upstudio
Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - November 2008 Printed Circuit Design & Fab - November 2008 Contents Our Line Market Watch Around the World Happenings ROI Positive Plating Ten Tips to Improve Manufacturability 3D Chip-Package-Board Modeling Improving Circuit Simulation With The Addition Of Real Measurements Ad Index PCB West: Interview with NBS Design Inc. The Influence of Final Finish on Lead-Free Assembly Reliability The Lead-free Soldering Challenges for Peelable Resists Off the Shelf Marketplace BGA Bulletin Printed Circuit Design & Fab - November 2008 Printed Circuit Design & Fab - November 2008 - (Page Intro) Printed Circuit Design & Fab - November 2008 - Printed Circuit Design & Fab - November 2008 (Page Cover1) Printed Circuit Design & Fab - November 2008 - Printed Circuit Design & Fab - November 2008 (Page Cover2) Printed Circuit Design & Fab - November 2008 - Printed Circuit Design & Fab - November 2008 (Page 1) Printed Circuit Design & Fab - November 2008 - Contents (Page 2) Printed Circuit Design & Fab - November 2008 - Contents (Page 3) Printed Circuit Design & Fab - November 2008 - Our Line (Page 4) Printed Circuit Design & Fab - November 2008 - Our Line (Page 5) Printed Circuit Design & Fab - November 2008 - Market Watch (Page 6) Printed Circuit Design & Fab - November 2008 - Market Watch (Page 7) Printed Circuit Design & Fab - November 2008 - Around the World (Page 8) Printed Circuit Design & Fab - November 2008 - Around the World (Page 9) Printed Circuit Design & Fab - November 2008 - Around the World (Page 10) Printed Circuit Design & Fab - November 2008 - Around the World (Page 11) Printed Circuit Design & Fab - November 2008 - Happenings (Page 12) Printed Circuit Design & Fab - November 2008 - Happenings (Page 13) Printed Circuit Design & Fab - November 2008 - ROI (Page 14) Printed Circuit Design & Fab - November 2008 - ROI (Page 15) Printed Circuit Design & Fab - November 2008 - Positive Plating (Page 16) Printed Circuit Design & Fab - November 2008 - Positive Plating (Page 17) Printed Circuit Design & Fab - November 2008 - Ten Tips to Improve Manufacturability (Page 18) Printed Circuit Design & Fab - November 2008 - Ten Tips to Improve Manufacturability (Page 19) Printed Circuit Design & Fab - November 2008 - Ten Tips to Improve Manufacturability (Page 20) Printed Circuit Design & Fab - November 2008 - Ten Tips to Improve Manufacturability (Page 21) Printed Circuit Design & Fab - November 2008 - Ten Tips to Improve Manufacturability (Page 22) Printed Circuit Design & Fab - November 2008 - Ten Tips to Improve Manufacturability (Page 23) Printed Circuit Design & Fab - November 2008 - 3D Chip-Package-Board Modeling (Page 24) Printed Circuit Design & Fab - November 2008 - 3D Chip-Package-Board Modeling (Page 25) Printed Circuit Design & Fab - November 2008 - 3D Chip-Package-Board Modeling (Page 26) Printed Circuit Design & Fab - November 2008 - 3D Chip-Package-Board Modeling (Page 27) Printed Circuit Design & Fab - November 2008 - 3D Chip-Package-Board Modeling (Page 28) Printed Circuit Design & Fab - November 2008 - 3D Chip-Package-Board Modeling (Page 29) Printed Circuit Design & Fab - November 2008 - Improving Circuit Simulation With The Addition Of Real Measurements (Page 30) Printed Circuit Design & Fab - November 2008 - Improving Circuit Simulation With The Addition Of Real Measurements (Page 31) Printed Circuit Design & Fab - November 2008 - Ad Index (Page 32) Printed Circuit Design & Fab - November 2008 - Ad Index (Page 33) Printed Circuit Design & Fab - November 2008 - PCB West: Interview with NBS Design Inc. (Page 34) Printed Circuit Design & Fab - November 2008 - PCB West: Interview with NBS Design Inc. (Page 35) Printed Circuit Design & Fab - November 2008 - The Influence of Final Finish on Lead-Free Assembly Reliability (Page 36) Printed Circuit Design & Fab - November 2008 - The Influence of Final Finish on Lead-Free Assembly Reliability (Page 37) Printed Circuit Design & Fab - November 2008 - The Influence of Final Finish on Lead-Free Assembly Reliability (Page 38) Printed Circuit Design & Fab - November 2008 - The Influence of Final Finish on Lead-Free Assembly Reliability (Page InsertA) Printed Circuit Design & Fab - November 2008 - The Influence of Final Finish on Lead-Free Assembly Reliability (Page InsertB) Printed Circuit Design & Fab - November 2008 - The Influence of Final Finish on Lead-Free Assembly Reliability (Page 39) Printed Circuit Design & Fab - November 2008 - The Lead-free Soldering Challenges for Peelable Resists (Page 40) Printed Circuit Design & Fab - November 2008 - The Lead-free Soldering Challenges for Peelable Resists (Page 41) Printed Circuit Design & Fab - November 2008 - The Lead-free Soldering Challenges for Peelable Resists (Page 42) Printed Circuit Design & Fab - November 2008 - Off the Shelf (Page 43) Printed Circuit Design & Fab - November 2008 - Marketplace (Page 44) Printed Circuit Design & Fab - November 2008 - Marketplace (Page 45) Printed Circuit Design & Fab - November 2008 - Marketplace (Page 46) Printed Circuit Design & Fab - November 2008 - Marketplace (Page 47) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page 48) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page Cover3) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page Cover4) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S1) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S2) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S3) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S4) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S5) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S6) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S7) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S8) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S9) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S10) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S11) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S12) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S13) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S14) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S15) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S16) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S17) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S18) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S19) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S20) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S21) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S22) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S23) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S24) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S25) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S26) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S27) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S28) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S29) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S30) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S31) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S32) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S33) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S34) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S35) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S36) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S37) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S38) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S39) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S40) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S41) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S42)
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