Printed Circuit Design & Fab - November 2008 - (Page 43)

MACHINES MATERIALS TOOLS SYSTEMS SOFTWARE THERMAL SPOT CURING the iCure AS200 is an inline fiber optic system that provides thermal spot curing. the portable unit offers infrared radiation that is easily and quickly absorbed by thermal epoxies, resulting in not only a faster, but also a stronger curing. In addition, a light guide allows for precise and localized heating of bonded assemblies, and the automated manufacturing process eliminates the need for multiple thermal ovens, thus reducing costs. wHO: IRphotonics wHERE: www.irphotonics.com SIGNAL INTEGRITY SIMULATOR the transient-Convolution Simulator is able to achieve a three-fold simulation speed improvement for signal integrity simulations. It is reported to be the fastest signal integrity circuit simulator for multigigabit, high-speed data link design. Users can perform quick analyses with the high-capacity sparse matrix solver. Part of Agilent’s Advanced Design System (ADS) eDA software platform, applications include both design and verification of chip-tochip multigigabit serial links. wHO: Agilent technologies, Inc. wHERE: www.agilent.com CONNECTOR LOWERS COST the Series 95X is a smaller form factor board-to-board stacking connectors and box headers. this series provides a 10 microinch gold thickness for highvolume applications with less stringent demand on mating cycles. they are suited for short service life applications that will not face extreme temperatures or hostile atmosphere. the headers and connectors can satisfy numerous applications, including consumer electronics, control units for industry and handheld test and measurement devices. wHO: 3M wHERE: www.3M.com OTHERS OF NOTE LED DRIVER PROPELS LIGHT the dur-e-volt LeD driver is a constantfrequency, peak current mode control LeD driver. the product allows an LeD string to be driven at a fixed current, separate from the supply voltage. this provides improved reliability and constant light output. the dur-e-volt LeD driver can support one to hundreds of LeDs in series or parallel combinations, using fewer components. It is reported to be 90% efficient with excellent heat dissipation. High brightness LeDs (HBLeDs) from 8 VDC to 450 VDC can be supported efficiently. LeD dimming is controlled by the PWM input pin or by adjusting the voltage to the LD/Linear Dimming pin. wHO: Rogers Corporation wHERE: www.rogerscorp.com/durel CIRCUITSPACE IMPROVEMENTS Gains in productivity and increases in timeto-market profitability are predicted with CircuitSpace v3.0. the latest version adds increased functionality to CircuitSpace, allowing users to reduce board layout and placement time through AutoClustering, intelligent design reuse and Cross-Probing. Features include template usage, with or without etch, automated layout reference designator propagation and automated change time between layout designs. the hierarchy methodology is at the designer’s fingertips, throughout layout and placement. wHO: DesignAdvance Systems, Inc. wHERE: www.designadvance.com ELIMINATE HOT SPOTS the Lt3085 is part of the next generation of NPN LDOs. It has a 500 mA output current and offers input voltage capabilities from 1.2 V to 36 V. the output voltage ranges from 0 V to 35 V, while the dropout voltage is only 275 mV at full load. It is stable with ceramic, aluminum and tantalum Capacitors and comes in two high power density packages; a thermally enhanced, 8-lead MSOP and a low profile, 6-lead DFN. Both packages can d issipate 1 W to 2 W in surface mount applications without requiring a heat sink. wHO: Linear technology Corporation wHERE: www.linear.com RFID FOR MEDICAL PCBS RFID labels assist with the identification of PCBs in the medical technology industry. the space-saving technology provides improved readability and additional storage space for assembled PCB-related information. the adhesive label stores assembled, specific data. the labels can be attached to small PCBs or flex boards. When a label cannot be attached, due to size or high packing density, a small tAG can be mounted, similar to a board component. wHO: alpha-board GmbH wHERE: www.alpha-board.de OPTICAL DATA TRANSFER Advantest Corporation announced an optical-electrical printed circuit board technology that uses an optical waveguide technology to provide up to 160 gigabitper-second, high-volume data transfer. Features include higher density mounting and wiring and electrical connection and waveguide coexistence. Advantest predicts a faster semiconductor tests system with higher packaging densities, and it plans to use the technology in practical applications by 2011. wHO: Advantest Corporation wHERE: www.advantest.com HEAT SINK MATERIAL CarbAl is a carbon-based metal nanocomposite heat sink material. Reported to be three times more effective at diffusing heat, the material is comprised of 20% aluminum and 80% carbonaceous matrix, and it has a thermal transmission near 500 W/mK. the material is lighter than the traditional metallic heat sinks and provides low-cost, high-quality heat sinks for the microelectronic industry. wHO: Applied Nanotech Holdings wHERE: www.appliednanotech.net NOVEMBER 2008 printEd CirCuit dESign & fAB 43 http://www.irphotonics.com http://www.agilent.com http://www.3M.com http://www.linear.com http://www.designadvance.com http://www.rogerscorp.com/durel http://www.appliednanotech.net http://www.alpha-board.de http://www.advantest.com

Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - November 2008

Printed Circuit Design & Fab - November 2008 Contents Our Line Market Watch Around the World Happenings ROI Positive Plating Ten Tips to Improve Manufacturability 3D Chip-Package-Board Modeling Improving Circuit Simulation With The Addition Of Real Measurements Ad Index PCB West: Interview with NBS Design Inc. The Influence of Final Finish on Lead-Free Assembly Reliability The Lead-free Soldering Challenges for Peelable Resists Off the Shelf Marketplace BGA Bulletin

Printed Circuit Design & Fab - November 2008

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