Printed Circuit Design & Fab - November 2008 - (Page 6) MarkEt watch SEMiS tank Trends in the U.S. electronics equipment market (shipments only). JUne Computers/electronics products Computers Storage devices Other peripheral equipment Nondefense communications equipment Defense communications equipment A/V equipment Semiconductors Components1 Nondefense search and navigation equipment Defense search and navigation equipment Medical, measurement and control rRevised. 1Includes % Change JUly r aUgUST* yTD 6.0 -2.5 -1.6 -11.2 -3.0 11.1 -3.2 38.9 -1.9 -5.4 -3.6 13.4 -5.1 -3.3 -9.5 2.1 -7.3 -13.9 -7.7 -17.1 -0.4 0.9 1.8 -1.2 0.7 -4.2 -4.7 0.9 -0.9 25.0 -14.0 -6.9 -1.9 0.3 3.4 11.3 US Tech Exports Down 3%, Imports Up 3% in 2007 waShinGton, dc – US high-tech exports totaled -3.6 -3.3 2.1 -2.2 5.7 2.8 -5.8 -14.3 -0.7 3.7 -8.0 -5.4 $214 billion in 2007, down 3% compared to 2006, according to AeA (aeanet.org). High tech is the single largest merchandise export sector in the US, or 18% of all US exports, says the association. High-tech imports totaled $333 billion last year, up 3%, resulting in a high-tech trade deficit of $118 billion. The largest overseas markets for US high-tech exports were the European Union ($46.6 billion), Canada ($29.4 billion), Mexico ($26 billion), China ($14.5 billion), Japan ($11.9 billion) and Singapore ($9.2 billion). China was the leading importer of high-tech products to the US ($112.3 billion), followed by Mexico ($51.3 billion), the EU ($33.4 billion), Japan ($29.2 billion) and Malaysia ($25.1 billion). *Preliminary. semiconductors. Seasonally adjusted. Source: U.S. Department of Commerce Census Bureau, October 2, 2008 September Fall for Production TEMPE, AZ – The manufacturing sector in September dropped to its lowest level since October 2001 – the month following the terrorist attacks on New York City and Washington – the Institute for Supply Management (ism.ws) reported. The segment of Computer and Electronic Products was among the six sectors showing growth, however. The overall economy grew for the 83rd consecutive month. The Manufacturing PMI was 43.5%, down 6.4 points from August and the lowest mark since October 2001’s 40.8%. Prices are rising at a much slower rate, as the Prices Index fell to the lowest level in 21 months. Export orders continued to increase. The New Orders index was 38.8%, down 9.5 points sequentially. May PMI New orders Production Inventories Backlogs 49.6 49.7 51.2 48.0 46.0 JUne 50.2 49.6 51.5 51.2 55.0 47.5 JUly 50.0 45.0 52.9 45.0 47.0 43.0 aUg. 49.9 48.3 52.1 49.3 54.5 43.5 SepT. 43.5 38.8 40.8 43.4 53.5 35.0 2008 Semi Forecast Downgraded ScottSdalE, aZ – IC Insights (icinsights.com) slashed its 2008 semiconductor revenue forecast by $6 billion and revised its yearly growth outlook to 4% this year. In June, the firm predicted 2008 growth of 7% to $250.3 billion. The firm attributed the change to an inventory correction in the logic market and the pricing collapse of the NAND flash market. Overall, IC unit growth is set to increase 8%, with average selling prices down 4% this year. The firm said long-term trends would sustain pricing stability, resulting in a CAGR of 10.6% between 2007 and 2012. Capital spending will decrease 18% this year as a result of leading chipmakers easing up on expansion. For 2009, IC Insights expects semiconductor capital spending to be likely in the 8% to 10% range. Customer inventories 47.0 Source: Institute for Supply Management, October 1, 2008 induStry MarkEt SnaPShot Book-to-bills of various components/equipment. apr. Semiconductor equipment1 Semiconductors2 Rigid PCBs3 (North America) Flexible PCBs3 (North America) Computers/electronic products4 0.82 1.01 0.99 5.16 May JUne JUly aUg. 0.79 0.95 1.01 5.07 0.81 0.94 1.02 5.21 0.83r 7.11%r 0.94 1.01 5.08r 0.83p 7.04%p 0.95 0.90 5.25p MEtalS indEx DaTe Gold1 Silver2 Copper3 Tin4 12nd 10/8/07 $733.75 $193.85 $3.62 $6.37 7/7/08 $968.00 $262.02 $3.88 $10.60 8/4/08 $905.75 $253.83 $3.67 $9.84 9/2/08 $815.00 $186.68 $3.34 $8.82 10/6/08 $875.50 $160.20 $2.70 $7.69 3.82% 4.18% 5.91% London Fix price/tr.oz. 2Handy and Harman Silver (COMEX Silver) price/LB. 3LME Cash Seller and Settlement for Copper price/LB. 4LME Cash Seller and Settlement for Tin price/LB. Sources: 1SEMI, 2SIA (3-month moving average growth), 3IPC, 4Census Bureau, pPreliminary, rRevised 6 printEd CirCuit dESign & fAB NOVEMBER 2008 http://www.aeanet.org http://www.icinsights.com http://www.ism.ws
Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - November 2008 Printed Circuit Design & Fab - November 2008 Contents Our Line Market Watch Around the World Happenings ROI Positive Plating Ten Tips to Improve Manufacturability 3D Chip-Package-Board Modeling Improving Circuit Simulation With The Addition Of Real Measurements Ad Index PCB West: Interview with NBS Design Inc. The Influence of Final Finish on Lead-Free Assembly Reliability The Lead-free Soldering Challenges for Peelable Resists Off the Shelf Marketplace BGA Bulletin Printed Circuit Design & Fab - November 2008 Printed Circuit Design & Fab - November 2008 - (Page Intro) Printed Circuit Design & Fab - November 2008 - Printed Circuit Design & Fab - November 2008 (Page Cover1) Printed Circuit Design & Fab - November 2008 - Printed Circuit Design & Fab - November 2008 (Page Cover2) Printed Circuit Design & Fab - November 2008 - Printed Circuit Design & Fab - November 2008 (Page 1) Printed Circuit Design & Fab - November 2008 - Contents (Page 2) Printed Circuit Design & Fab - November 2008 - Contents (Page 3) Printed Circuit Design & Fab - November 2008 - Our Line (Page 4) Printed Circuit Design & Fab - November 2008 - Our Line (Page 5) Printed Circuit Design & Fab - November 2008 - Market Watch (Page 6) Printed Circuit Design & Fab - November 2008 - Market Watch (Page 7) Printed Circuit Design & Fab - November 2008 - Around the World (Page 8) Printed Circuit Design & Fab - November 2008 - Around the World (Page 9) Printed Circuit Design & Fab - November 2008 - Around the World (Page 10) Printed Circuit Design & Fab - November 2008 - Around the World (Page 11) Printed Circuit Design & Fab - November 2008 - Happenings (Page 12) Printed Circuit Design & Fab - November 2008 - Happenings (Page 13) Printed Circuit Design & Fab - November 2008 - ROI (Page 14) Printed Circuit Design & Fab - November 2008 - ROI (Page 15) Printed Circuit Design & Fab - November 2008 - Positive Plating (Page 16) Printed Circuit Design & Fab - November 2008 - Positive Plating (Page 17) Printed Circuit Design & Fab - November 2008 - Ten Tips to Improve Manufacturability (Page 18) Printed Circuit Design & Fab - November 2008 - Ten Tips to Improve Manufacturability (Page 19) Printed Circuit Design & Fab - November 2008 - Ten Tips to Improve Manufacturability (Page 20) Printed Circuit Design & Fab - November 2008 - Ten Tips to Improve Manufacturability (Page 21) Printed Circuit Design & Fab - November 2008 - Ten Tips to Improve Manufacturability (Page 22) Printed Circuit Design & Fab - November 2008 - Ten Tips to Improve Manufacturability (Page 23) Printed Circuit Design & Fab - November 2008 - 3D Chip-Package-Board Modeling (Page 24) Printed Circuit Design & Fab - November 2008 - 3D Chip-Package-Board Modeling (Page 25) Printed Circuit Design & Fab - November 2008 - 3D Chip-Package-Board Modeling (Page 26) Printed Circuit Design & Fab - November 2008 - 3D Chip-Package-Board Modeling (Page 27) Printed Circuit Design & Fab - November 2008 - 3D Chip-Package-Board Modeling (Page 28) Printed Circuit Design & Fab - November 2008 - 3D Chip-Package-Board Modeling (Page 29) Printed Circuit Design & Fab - November 2008 - Improving Circuit Simulation With The Addition Of Real Measurements (Page 30) Printed Circuit Design & Fab - November 2008 - Improving Circuit Simulation With The Addition Of Real Measurements (Page 31) Printed Circuit Design & Fab - November 2008 - Ad Index (Page 32) Printed Circuit Design & Fab - November 2008 - Ad Index (Page 33) Printed Circuit Design & Fab - November 2008 - PCB West: Interview with NBS Design Inc. (Page 34) Printed Circuit Design & Fab - November 2008 - PCB West: Interview with NBS Design Inc. (Page 35) Printed Circuit Design & Fab - November 2008 - The Influence of Final Finish on Lead-Free Assembly Reliability (Page 36) Printed Circuit Design & Fab - November 2008 - The Influence of Final Finish on Lead-Free Assembly Reliability (Page 37) Printed Circuit Design & Fab - November 2008 - The Influence of Final Finish on Lead-Free Assembly Reliability (Page 38) Printed Circuit Design & Fab - November 2008 - The Influence of Final Finish on Lead-Free Assembly Reliability (Page InsertA) Printed Circuit Design & Fab - November 2008 - The Influence of Final Finish on Lead-Free Assembly Reliability (Page InsertB) Printed Circuit Design & Fab - November 2008 - The Influence of Final Finish on Lead-Free Assembly Reliability (Page 39) Printed Circuit Design & Fab - November 2008 - The Lead-free Soldering Challenges for Peelable Resists (Page 40) Printed Circuit Design & Fab - November 2008 - The Lead-free Soldering Challenges for Peelable Resists (Page 41) Printed Circuit Design & Fab - November 2008 - The Lead-free Soldering Challenges for Peelable Resists (Page 42) Printed Circuit Design & Fab - November 2008 - Off the Shelf (Page 43) Printed Circuit Design & Fab - November 2008 - Marketplace (Page 44) Printed Circuit Design & Fab - November 2008 - Marketplace (Page 45) Printed Circuit Design & Fab - November 2008 - Marketplace (Page 46) Printed Circuit Design & Fab - November 2008 - Marketplace (Page 47) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page 48) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page Cover3) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page Cover4) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S1) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S2) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S3) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S4) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S5) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S6) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S7) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S8) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S9) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S10) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S11) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S12) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S13) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S14) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S15) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S16) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S17) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S18) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S19) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S20) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S21) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S22) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S23) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S24) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S25) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S26) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S27) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S28) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S29) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S30) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S31) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S32) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S33) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S34) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S35) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S36) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S37) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S38) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S39) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S40) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S41) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S42)
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