Printed Circuit Design & Fab - December 2008 - (Page 12) haPPEninGS FACES Dr. Jennie Hwang will serve on the board of advisors for Reactive NanoTechnologies, Inc. In her role, she will advise the company on technical and business matters pertaining to the electronics assembly industry. Prior to joining the board, she held senior executive positions with lockheed Martin Corporation, Sherwin Williams Company and SCM Corporation. Dr. Robert C. Pfahl Jr., VP of iNEMI, has received an electronics Goes Green 2008+ award. Pfahl was recognized not only for his commitment to protecting the environment, but also for spurring ideas that pertain to sustainable development in technology and business solutions. He has a long history of championing environmental issues within the electronics industry and has received numerous awards for his work. Park Electrochemical Corp. named David R. Dahlquist director of business development. Prior to his appointment, Dahlquist was the product director, and most recently, director of marketing for the company. He also has held positions within Photocircuits Corporation. Mar/aPril Enthone Inc. has named Ben Poon senior vice president and managing director of enthone asia. He brings over 20 years of commodity and specialty chemical experience to the position. Prior to his appointment, Poon held various financial, business development and executive positions globally with Dow Chemical and MeGlobal. The american Society for Quality (aSQ), Binghamton Sector, has awarded Mike Williams, quality engineer at Endicott Interconnect Technologies, Inc. (eI), with the esteemed Paul a. robert award for outstanding effort and dedication toward the advancement and recognition of quality principles, practices and values. EVENTS 3 PCB ORLANDO HOLIDAy INN INTERNATIONAL DRIVE RESORT ORLANDO, FLORIDA CONTACT: WWW.PCBSHOWS.COM/ORLANDO 2008 International Printed Circuit and Electronics Assembly Fair Sponsored by HKPCA Shenzhen, China Contact: info@e21mm.com International Conference on Lead-Free Electronics IPC, JEDEC Fairmont Hotel Dallas, TX Contact:www.ipc.org/LF1208 DesignCon 2009 Santa Clara Convention Center Santa Clara, CA Contact: designcon.com/2009/register PCB PHOENIx HILTON PHOENIx EAST/MESA PHOENIx, AZ CONTACT: WWW.PCBSHOWS.COM/PHOENIx IPC Printed Circuits Expo, APEx and the Designers Summit Conference & Exhibition Mandalay Bay Hotel and Convention Center Las Vegas Contact: http://www.goipcshows.org/html/main/default.htm dEc 3-5 8-10 2-5 FEB 11 31-2 21-24 Nepcon China Everbright Convention and Exhibition Center Shanghai Contact: www.nepconchina.com 27-1 PCB EAST WESTIN WALTHAM-BOSTON WALTHAM, MA CONTACT: WWW.PCBEAST.COM Optimum Design Associates, Inc. has acquired RockSolid Design, Inc., including its assets, intellectual property and customer base. The terms of the purchase were not disclosed. The combined businesses will form one of the largest PCB design layout service providers in the country. The newly combined company will have access to both a Cadence allegro design platform (rockSolid Design) and the Mentor Graphics expedition platform used by OPTIMUM. OPTIMUM also provides quick turnaround electronic Manufacturing Services (eMS). rockSolid Design’s management team will remain in place to lead the new combined PCB layout division. 12 Mania Technologie Outsourcing Services, Inc. (MTOS) has reached an agreement with DGTek regarding the acquisition of its test facility in California. Beginning this month, the newly acquired test center will become part of the worldwide Mania Outsourcing and Service Group network. MTOS plans to fully integrate the anaheim center into its procedures and work flow. The company also plans to invest in flying probe and drill equipment to increase the capacity and quality of the test center. The North american Customer Care organization will operate out of the new facility. Sun Chemical and its parent company DIC Corporation, formerly known as Dainippon Ink & Chemicals, have aPril aPril/May IT’S A DEAL formed a joint venture with Lianyungang Haidi Chemicals, Co. Ltd., China. The joint venture will be named Lianyungang DIC Color Co., Ltd. and will continue to manufacture high performance pigments and sell them through the worldwide sales network of DIC Corporation and Sun Chemical. The joint venture would eventually lead to an expansion of its product line to a wider range of organic, high-performance pigments in the future. Mania Belgium NV will work with PCB GraphTech in Southeast asia to promote its entire product range. Both companies hope to build on their pre-existing relationship. Mania looks to expand its customer base through the established reputation of PCB GraphTech. DECEMBER 2008 printEd CirCuit dESign & fAB http://www.pcbshows.com/orlando http://www.ipc.org/LF1208 http://www.designcon.com/2009/register http://www.pcbshows.com/phoenix http://www.goipcshows.org/html/main/default.htm http://www.nepconchina.com http://www.pcbeast.com
Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - December 2008 Printed Circuit Design & Fab - December 2008 Contents Our Line Market Watch Around the World Happenings ROI Global Sourcing EMC for the Real World Interconnect Strategies On the Forefront Final Finish Forum Test and Inspection Electronic System Design Data Management 101 Designers Take on Technology Challenges in 2008 PCB Signal Integrity, Power Integrity and EMC Challenges What’s in a Name? Ad Index PCB Dielectric Materials for High-Speed Applications Off the Shelf Marketplace BGA Bulletin Printed Circuit Design & Fab - December 2008 Printed Circuit Design & Fab - December 2008 - (Page Intro) Printed Circuit Design & Fab - December 2008 - Printed Circuit Design & Fab - December 2008 (Page Cover1) Printed Circuit Design & Fab - December 2008 - Printed Circuit Design & Fab - December 2008 (Page Cover2) Printed Circuit Design & Fab - December 2008 - Printed Circuit Design & Fab - December 2008 (Page 1) Printed Circuit Design & Fab - December 2008 - Contents (Page 2) Printed Circuit Design & Fab - December 2008 - Contents (Page 3) Printed Circuit Design & Fab - December 2008 - Market Watch (Page 4) Printed Circuit Design & Fab - December 2008 - Market Watch (Page 5) Printed Circuit Design & Fab - December 2008 - Around the World (Page 6) Printed Circuit Design & Fab - December 2008 - Around the World (Page 7) Printed Circuit Design & Fab - December 2008 - Around the World (Page 8) Printed Circuit Design & Fab - December 2008 - Around the World (Page 9) Printed Circuit Design & Fab - December 2008 - Around the World (Page 10) Printed Circuit Design & Fab - December 2008 - Around the World (Page 11) Printed Circuit Design & Fab - December 2008 - Happenings (Page 12) Printed Circuit Design & Fab - December 2008 - Happenings (Page 13) Printed Circuit Design & Fab - December 2008 - ROI (Page 14) Printed Circuit Design & Fab - December 2008 - Global Sourcing (Page 15) Printed Circuit Design & Fab - December 2008 - EMC for the Real World (Page 16) Printed Circuit Design & Fab - December 2008 - EMC for the Real World (Page 16a) Printed Circuit Design & Fab - December 2008 - EMC for the Real World (Page 16b) Printed Circuit Design & Fab - December 2008 - EMC for the Real World (Page 17) Printed Circuit Design & Fab - December 2008 - Interconnect Strategies (Page 18) Printed Circuit Design & Fab - December 2008 - Interconnect Strategies (Page 19) Printed Circuit Design & Fab - December 2008 - Interconnect Strategies (Page 20) Printed Circuit Design & Fab - December 2008 - On the Forefront (Page 21) Printed Circuit Design & Fab - December 2008 - Final Finish Forum (Page 22) Printed Circuit Design & Fab - December 2008 - Test and Inspection (Page 23) Printed Circuit Design & Fab - December 2008 - Electronic System Design (Page 24) Printed Circuit Design & Fab - December 2008 - Electronic System Design (Page 25) Printed Circuit Design & Fab - December 2008 - Electronic System Design (Page 26) Printed Circuit Design & Fab - December 2008 - Electronic System Design (Page 27) Printed Circuit Design & Fab - December 2008 - Data Management 101 (Page 28) Printed Circuit Design & Fab - December 2008 - Data Management 101 (Page 29) Printed Circuit Design & Fab - December 2008 - Data Management 101 (Page 30) Printed Circuit Design & Fab - December 2008 - Designers Take on Technology Challenges in 2008 (Page 31) Printed Circuit Design & Fab - December 2008 - Designers Take on Technology Challenges in 2008 (Page 32) Printed Circuit Design & Fab - December 2008 - Designers Take on Technology Challenges in 2008 (Page 32a) Printed Circuit Design & Fab - December 2008 - Designers Take on Technology Challenges in 2008 (Page 32b) Printed Circuit Design & Fab - December 2008 - Designers Take on Technology Challenges in 2008 (Page 33) Printed Circuit Design & Fab - December 2008 - PCB Signal Integrity, Power Integrity and EMC Challenges (Page 34) Printed Circuit Design & Fab - December 2008 - PCB Signal Integrity, Power Integrity and EMC Challenges (Page 35) Printed Circuit Design & Fab - December 2008 - PCB Signal Integrity, Power Integrity and EMC Challenges (Page 36) Printed Circuit Design & Fab - December 2008 - PCB Signal Integrity, Power Integrity and EMC Challenges (Page 37) Printed Circuit Design & Fab - December 2008 - What’s in a Name? (Page 38) Printed Circuit Design & Fab - December 2008 - Ad Index (Page 39) Printed Circuit Design & Fab - December 2008 - PCB Dielectric Materials for High-Speed Applications (Page 40) Printed Circuit Design & Fab - December 2008 - PCB Dielectric Materials for High-Speed Applications (Page 41) Printed Circuit Design & Fab - December 2008 - PCB Dielectric Materials for High-Speed Applications (Page 42) Printed Circuit Design & Fab - December 2008 - Off the Shelf (Page 43) Printed Circuit Design & Fab - December 2008 - Marketplace (Page 44) Printed Circuit Design & Fab - December 2008 - Marketplace (Page 45) Printed Circuit Design & Fab - December 2008 - Marketplace (Page 46) Printed Circuit Design & Fab - December 2008 - Marketplace (Page 47) Printed Circuit Design & Fab - December 2008 - BGA Bulletin (Page 48) Printed Circuit Design & Fab - December 2008 - BGA Bulletin (Page Cover3) Printed Circuit Design & Fab - December 2008 - BGA Bulletin (Page Cover4)
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