Printed Circuit Design & Fab - December 2008 - (Page 38) REGULATION uPdatE what’s in a Name? The roles WEEE, RoHS and REACH play in the environment. by MARGO LAKIN Let’s face it; we live in a world that craves the newest, fastest technologies. Our insatiable appetite for the hottest trends can be compared to the coal that fueled the factories of the Industrial Revolution, and the multitude of electronic and electrical products that we purchase (cell phones, personal computers, flat screen televisions) are the pollution that resulted. In a recent report, the United Nations estimated the total amount of electronic waste, or e-waste, generated globally ranges between 20 million and 50 million tons per year, with 70% of that waste either illegally dumped or crudely processed in developing nations. E-waste contains more than 1,000 different substances, including lead, mercury and cadmium, and some environmental groups estimate that the United Nations’ figures could triple by 2010. That is a substantial amount of toxins with the possibility of entering landfills, water sources and our bodies. But there are directives and regulations in force to address, to audit and to control the swelling stream of e-waste entering the environment. WEEE, RoHS and REACH are the three big names behind the movement, but what do these acronyms represent? to establish systems to prevent the exportation of untreated e-waste. Exported products for reuse, for instance computers earmarked for schools in developing countries, are permitted. Non-EU manufacturers who wish to export products to be used within the European Union must meet the WEEE Directive. Other countries have begun to show interest in adopting the WEEE Directive, such as Japan and China. Japan is showing signs of implementing design changes, such as eco-design and automated disassembly using smart materials (ADSM). China has increased the number of recycling plants and has plans to introduce recycling treatment facilities. But there are severe cracks in the system. Although each country is allowed to regulate WEEE, some countries do not keep records of the amount of e-waste dumped in landfills each year. In a recent article in Ghana News Today, it was reported that as much as 75% of e-waste generated in the EU is unaccounted for. Where does the waste end up? One answer is in the landfills and the dumps of developing countries. taBlE 1. The 10 categories of waste included in the WEEE The Waste Electrical and Electronic Equipment (WEEE) Directive went into force in the European Union (EU) in 2003. Focusing on the end-of-life management of products, the purpose of the directive is to reduce the amount of e-waste in landfills by increasing the recycling and the reuse of electronic and electrical goods–thus reducing the impact on the environment. There are 10 categories the waste products fall under. These can be seen with examples of each in taBlE 1. WEEE places the financial burden of collection, treatment and recovery of the waste on the manufacturers; distributors must provide a means for the consumer to return their e-waste free of charge. Each EU member state has control over its own WEEE policy process and regulations. WEEE also requires EU members 38 Weee Directive. Category of Weee Waste Large Household Appliances Small Household Appliances IT/Telecommunications Equipment Consumer Equipment Lighting Equipment Electrical and Electronic Tools Toys/Leisure/Sports Equipment Monitoring and Control Equipment Medical Devices Automatic Dispensers examples Washing Machines Toasters, Irons Cell Phone, Laptop Computer TVs Fluorescent Lights Drills, Sewing Machines Video Games Electronic Thermostat X-Ray Equipment ATM Machines DECEMBER 2008 printEd CirCuit dESign & fAB
Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - December 2008 Printed Circuit Design & Fab - December 2008 Contents Our Line Market Watch Around the World Happenings ROI Global Sourcing EMC for the Real World Interconnect Strategies On the Forefront Final Finish Forum Test and Inspection Electronic System Design Data Management 101 Designers Take on Technology Challenges in 2008 PCB Signal Integrity, Power Integrity and EMC Challenges What’s in a Name? Ad Index PCB Dielectric Materials for High-Speed Applications Off the Shelf Marketplace BGA Bulletin Printed Circuit Design & Fab - December 2008 Printed Circuit Design & Fab - December 2008 - (Page Intro) Printed Circuit Design & Fab - December 2008 - Printed Circuit Design & Fab - December 2008 (Page Cover1) Printed Circuit Design & Fab - December 2008 - Printed Circuit Design & Fab - December 2008 (Page Cover2) Printed Circuit Design & Fab - December 2008 - Printed Circuit Design & Fab - December 2008 (Page 1) Printed Circuit Design & Fab - December 2008 - Contents (Page 2) Printed Circuit Design & Fab - December 2008 - Contents (Page 3) Printed Circuit Design & Fab - December 2008 - Market Watch (Page 4) Printed Circuit Design & Fab - December 2008 - Market Watch (Page 5) Printed Circuit Design & Fab - December 2008 - Around the World (Page 6) Printed Circuit Design & Fab - December 2008 - Around the World (Page 7) Printed Circuit Design & Fab - December 2008 - Around the World (Page 8) Printed Circuit Design & Fab - December 2008 - Around the World (Page 9) Printed Circuit Design & Fab - December 2008 - Around the World (Page 10) Printed Circuit Design & Fab - December 2008 - Around the World (Page 11) Printed Circuit Design & Fab - December 2008 - Happenings (Page 12) Printed Circuit Design & Fab - December 2008 - Happenings (Page 13) Printed Circuit Design & Fab - December 2008 - ROI (Page 14) Printed Circuit Design & Fab - December 2008 - Global Sourcing (Page 15) Printed Circuit Design & Fab - December 2008 - EMC for the Real World (Page 16) Printed Circuit Design & Fab - December 2008 - EMC for the Real World (Page 16a) Printed Circuit Design & Fab - December 2008 - EMC for the Real World (Page 16b) Printed Circuit Design & Fab - December 2008 - EMC for the Real World (Page 17) Printed Circuit Design & Fab - December 2008 - Interconnect Strategies (Page 18) Printed Circuit Design & Fab - December 2008 - Interconnect Strategies (Page 19) Printed Circuit Design & Fab - December 2008 - Interconnect Strategies (Page 20) Printed Circuit Design & Fab - December 2008 - On the Forefront (Page 21) Printed Circuit Design & Fab - December 2008 - Final Finish Forum (Page 22) Printed Circuit Design & Fab - December 2008 - Test and Inspection (Page 23) Printed Circuit Design & Fab - December 2008 - Electronic System Design (Page 24) Printed Circuit Design & Fab - December 2008 - Electronic System Design (Page 25) Printed Circuit Design & Fab - December 2008 - Electronic System Design (Page 26) Printed Circuit Design & Fab - December 2008 - Electronic System Design (Page 27) Printed Circuit Design & Fab - December 2008 - Data Management 101 (Page 28) Printed Circuit Design & Fab - December 2008 - Data Management 101 (Page 29) Printed Circuit Design & Fab - December 2008 - Data Management 101 (Page 30) Printed Circuit Design & Fab - December 2008 - Designers Take on Technology Challenges in 2008 (Page 31) Printed Circuit Design & Fab - December 2008 - Designers Take on Technology Challenges in 2008 (Page 32) Printed Circuit Design & Fab - December 2008 - Designers Take on Technology Challenges in 2008 (Page 32a) Printed Circuit Design & Fab - December 2008 - Designers Take on Technology Challenges in 2008 (Page 32b) Printed Circuit Design & Fab - December 2008 - Designers Take on Technology Challenges in 2008 (Page 33) Printed Circuit Design & Fab - December 2008 - PCB Signal Integrity, Power Integrity and EMC Challenges (Page 34) Printed Circuit Design & Fab - December 2008 - PCB Signal Integrity, Power Integrity and EMC Challenges (Page 35) Printed Circuit Design & Fab - December 2008 - PCB Signal Integrity, Power Integrity and EMC Challenges (Page 36) Printed Circuit Design & Fab - December 2008 - PCB Signal Integrity, Power Integrity and EMC Challenges (Page 37) Printed Circuit Design & Fab - December 2008 - What’s in a Name? (Page 38) Printed Circuit Design & Fab - December 2008 - Ad Index (Page 39) Printed Circuit Design & Fab - December 2008 - PCB Dielectric Materials for High-Speed Applications (Page 40) Printed Circuit Design & Fab - December 2008 - PCB Dielectric Materials for High-Speed Applications (Page 41) Printed Circuit Design & Fab - December 2008 - PCB Dielectric Materials for High-Speed Applications (Page 42) Printed Circuit Design & Fab - December 2008 - Off the Shelf (Page 43) Printed Circuit Design & Fab - December 2008 - Marketplace (Page 44) Printed Circuit Design & Fab - December 2008 - Marketplace (Page 45) Printed Circuit Design & Fab - December 2008 - Marketplace (Page 46) Printed Circuit Design & Fab - December 2008 - Marketplace (Page 47) Printed Circuit Design & Fab - December 2008 - BGA Bulletin (Page 48) Printed Circuit Design & Fab - December 2008 - BGA Bulletin (Page Cover3) Printed Circuit Design & Fab - December 2008 - BGA Bulletin (Page Cover4)
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