Printed Circuit Design & Fab - December 2008 - (Page 43)

MACHINES MATERIALS TOOLS SYSTEMS SOFTWARE SENSOR TO VERIFY AIRFLOW ON PCB The F600 sensor is designed for boardmounted, embedded applications in which in-situ airflow sensing is necessary. The product gives real time airflow and temperature information to prevent critical thermal situations. PCBs are able to warn of impending shutdowns due to fan failure or air blockage. The overall velocity ranges from 0.5 m/s to 5.0 m/s, and the sensor has an accuracy of ±10% of reading. The profile remains low on the PCB because of the small footprint design (0.500 inches). WHO: DegreeC www.degreeC.com QSFP CABLE FOR TIGHT SPACES GOre QSFP are copper cable assemblies for high-performance computing (HPC), enterprise network and network storage markets. It is reported that signal reliability is improved at speeds over the standard InfiniBand QDr data rate of 10 Gbps/channel. Signal reliability is enhanced over the InfiniBand QDr data rate of 10 Gbps/ channel. The cable is constructed with low dielectric materials that improve bend radius over longer distances in small cross-sectional areas. WHO: W.l. Gore & associates, Inc. WHERE: www.gore.com JUMP WIRE TACKING SYSTEM Flextac Wire Dots is a wire tacking system. It is comprised of shapes precut from flexible, polymer film membrane that has been coated on one side with a high-pressure and electronics-grade adhesive. The adhesive performance is not affected by high humidity. Many chemicals, including flux-cleaning solutions, saponifiers, mild acids and alkalis, do not affect the bond. Wires will hold through a PCB hot water wash, achieving best performance at temperatures ranging between 60° F and 100° F . WHO: CircuitMedic www.circuitmedic.com WHERE: WHERE: OTHERS OF NOTE TIMINGDESIGNER WITH SDC SUPPORT eMa Design automation presents TimingDesigner v9.1. The standard tool for interface timing design now has the ability to generate SDC timing constraints from timing diagrams. The SDC support also adds the ability to interface with FPGa and aSIC design flows. With focus on the altera FPGa, graphical timing analysis features enable the development of SDC timing constraints for altera devices. General productivity enhancements and updates are included. WHO: eMa Design automation www.ema-eda.com WHERE: STACKABLE MULTILAYER CAPACITORS TurboCap MlC are stackable multilayer capacitors (MlCs) that increase space on PCBs. By decoupling the parts from the board, the leads can minimize thermally or mechanically induced stresses occurring during assembly and temperature cycling. The TurboCap has a maximum voltage rating of 100 volts. It is available in two types: ST12 and ST20, and in a standard or high-reliability version. Featuring a X7r dielectric formulation, it has a temperature coefficient of –55° C to 125° C. WHO: aVX Corporation WHERE: www.avx.com BENCHTOP XRF FOR ROHS/WEEE The system performs nondestructive measurements of roHS and Weee prohibitive metals: lead, mercury, chromium, bromine and cadmium. The system can also perform lead content quantification for military and aerospace demands that require 2% to 5% minimum lead content. Standard circuit and packaging applications can be measured, including au/Ni/Cu and gold electro less nickel stacks. lead sensitivity and measurement confidence is provided at the 1000-ppm action level. WHO: Matrix Metrologies, Inc. www.matrixmetrologies.com WHERE: COMPRESSION CONNECTOR Cinch Connectors introduces an aMC compression connector for standard aTCa platform blades. The mezzanine connector meets or exceeds the newest PICMG aTCa specifications.The connector has one-piece stamped contacts that allow for seamless carrier board to mezzanine card paths. The captured individual contacts give a low insertion force and provide support for multiple card insertions. The compressed technology allows for simplified trace routing, as well as minimizing stub-effects and reflections. Unique plating lessens abrasions to the mezzanine card contacts. WHO: Cinch Connectors www.cinch.com WHERE: THIN-FILM BATTERIES enerChip CC CBC3112 and CBC3150 are thin-film batteries with integrated battery management. The single surface mount technology (SMT) package combines several power system features, including thinfilm battery, supply supervisor and lowripple chargers.The CBC3112 is a 12-micron ah device and the CBC3150 is a 50-micron ah device. Both are packaged in 7 mm by 7 mm, or 9 mm by 9 mm DFN surface mount, reflow tolerant packages. additional features include: >5000 recharge cycles, stable output voltage and does not need a socket or holder. WHO: Cymbet Corporation www.cymbet.com WHERE: UV HIGH-SPEED CURING accu-Cure UV is designed for high-speed curing of PCBs. The cooling system lowers heat transmission levels, protecting the substrate and belt. Features include a repositionable curing head with a focused reflector and a gate height adjustment that can accommodate substrates of various thicknesses. Users can choose UV output from the variable position wattage selections: 100-, 200-, 300- or 400-watts per inch. The ozone removal system removes hot air and ozone from the work area. WHO: a.W.T. World Trade Inc. WHERE: www.awt-gpi.com DECEMBER 2008 printEd CirCuit dESign & fAB 43 http://www.degreeC.com http://www.gore.com http://www.circuitmedic.com http://www.ema-eda.com http://www.avx.com http://www.matrixmetrologies.com http://www.cinch.com http://www.cymbet.com http://www.awt-gpi.com

Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - December 2008

Printed Circuit Design & Fab - December 2008 Contents Our Line Market Watch Around the World Happenings ROI Global Sourcing EMC for the Real World Interconnect Strategies On the Forefront Final Finish Forum Test and Inspection Electronic System Design Data Management 101 Designers Take on Technology Challenges in 2008 PCB Signal Integrity, Power Integrity and EMC Challenges What’s in a Name? Ad Index PCB Dielectric Materials for High-Speed Applications Off the Shelf Marketplace BGA Bulletin

Printed Circuit Design & Fab - December 2008

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