Printed Circuit Design & Fab - January 2009 - (Page 43)

PRODUCT PREVIEW CONFERENCE: FEBRUARY 2 – 5, 2009 SANTA CLARA CONVENTION CENTER | | EXHIBITION: FEBRUARY 3 – 4, 2009 | DESIGNCON.COM SANTA CLARA, CA HIGH-SPEED INTERCONNECTS Samtec Inc. introduces Q Rate high-speed and controlled impedance interconnects. the product combines the features of Samtec’s first- and second-generation Q series with Edge Rate signal integrity contacts. Performance is reported to be 10 GHz/pin for single-ended signaling at –3 dB insertion loss. For differential pair configurations, performance is reported to be 15 GHz/pair. Broadside coupling is reduced and a connector width of less than 5 mm is allowed through the use of Edge Rate contacts. WHO: www.samtec.com WHERE: Booth #325 SIMULATION SOFTWARE Sonnet Software introduces SONNEt Suites Professional Release 12. Faster simulation is attainable through parallel processing on multi-core CPUs plus improvements in the matrix solve algorithms. Enhanced geometry and circuit structure variables allow most geometrical and material properties to be defined by equations. Additional features include a Gerber import and export translator, and user defined hot keys. Accessable through Agilent, AWR and Cadence tools. WHO: www.sonnetsoftware.com WHERE: Booth #812 SCHEMATIC SYMBOL GENERATION PCB Matrix introduces the PCB Matrix Symbol Wizard. together with the LP Wizard, the PCB Matrix Symbol Wizard automates the complete schematic symbol and land pattern creation processes. Features include a PDF Scratch PAD that enables symbols to be accurately extracted from PDF data sheets in minutes, according to the company. the Symbol Partitioner automates the multipart symbol creation process, dynamically creating parts and moving pins between parts. WHO: www.PCBMatrix.com WHERE: Booth #820 HIGH DATA RATE TRANSMISSION W.L. Gore & Associates Inc. introduces GORE AIRMAX Assemblies, enabling high data rate signals to be transmitted over greater distances while maintaining fidelity and reliability. An extension of Gore’s 2 mm product family, this cable assembly can transmit signals up to 10 Gigabits per second. Available in a variety of configurations, they can be customized for pin out, cable type and latching features. WHO: www.gore.com WHERE: Booth #710 WAVEFORM/SIGNAL UTILITY TOOL IO Methodology Inc. introduces SignalMeth, a high-performance waveform/signal post-processing utility tool. Designed for signal integrity analysis and processing, its features include advanced signal/ waveform viewing, preset/programmable SI analysis and a signal/waveform comparison capability. SignalMeth can load numerous format signal/waveform files from tools, scopes and text. WHO: www.iometh.com Booth #925 WHERE: EMISTREAM V.4.0 DESIGN TOOL NEC Informatec Solutions Ltd. introduces EMIStream v. 4.0. this design rule check and plane resonance analysis tool can suppress undesirable EMI generated from printed circuit boards (PCBs) during the early design stage. the latest version is reported to reduce cost spent on the evaluation process, providing a faster time-tomarket. Features include far-field EMI calculation and estimated radiation frequency spectrum display. WHO: www.emistream.com WHERE: Booth #713 GRAPHICAL DESIGN TOOL Mentor Graphics Corp. introduces the Capital Architect tool, a graphical design tool that provides quick and detailed analysis of multiple architectures. It allows automotive OEMs and suppliers to assess the cost and weight of electrical distribution systems (EDS). Features include an on-the-fly EDS synthesis that can evaluate and compare multiple architectures. It can compare scenarios with studies, presenting the results of several scenarios, both graphically and numerically. In addition, results are capable of being exported to Microsoft Office. WHO: www.mentor.com WHERE: Booth #419 SIGNAL DENSITY CONNECTOR FCI introduces the ZipLine connector system, addressing the demand for greater signal density. the connectors have a data rate up to 12.5 Gb/s. Vertical header and right-angle receptacle modules support backplane and orthogonal midplane applications. ZipLine 6-pair signal modules with 1.8 mm column pitch provide the maximum density available, delivering 84.6 differential pairs per inch of card edge and can also be configured on 1.5 mm column pitch. the versatile design allows for mixed differential, single-ended or power pin assignments within a connector. WHO: www.fci.com WHERE: Booth #503 3D PCB DESIGN TOOL Altium Designer winter 09 release adds faster real-time 3D PCB features. the 3D PCB features exploit the potential of programmable devices like FPGAs. A new Field Instrumentation dashboard overcomes some of the challenges of testing or remotely monitoring designs inside FPGAs. Altium Designer has improved the memory and speed of the graphics system by up to seven times making the whole system more responsive by removing lags in the GUI. Additional features include mapping of 3D models and an enhanced interactive routing engine. WHO: www.altium.com WHERE: Booth # 409 JANUARY 2009 PRINTED CIRCUIT DESIGN & FAB 43 http://www.DESIGNCON.COM http://www.samtec.com http://www.sonnetsoftware.com http://www.PCBMatrix.com http://www.gore.com http://www.iometh.com http://www.emistream.com http://www.mentor.com http://www.fci.com http://www.altium.com

Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - January 2009

Printed Circuit Design & Fab - January 2009 Contents Our Line Market Watch Around the World Happenings ROI The Signal Doctor Positive Plating Final Finish Forum Making Sense of Laminate Dielectric Properties Design and Fab Tips for Improving Solder Mask Registration Automating the DDRx Interface Verification Process Printed Circuit Design & Fab Annual Buyers Guide: Special Suppliers Section Printed Circuit Design & Fab Annual Buyers Guide: Guide to Products and Services Off the Shelf Marketplace Ad Index BGA Bulletin

Printed Circuit Design & Fab - January 2009

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