Printed Circuit Design & Fab - January 2009 - (Page 6) MarkEt watch SEMi lEaP trends in the u.S. electronics equipment market (shipments only). aug. Computers/electronics products Computers Storage devices Other peripheral equipment Nondefense communications equipment A/V equipment Semiconductors Components1 Nondefense search and navigation equipment Defense search and navigation equipment Medical, measurement and control rRevised. PC Unit Shipments to Drop in 2009 loS altoS, ca – Following third-quarter growth of 14.8% year-over-year, the full force of the credit crunch is expected to pound fourth-quarter global PC shipments, dropping growth from 14.7% last year to 10.8% this year, says Henderson Ventures (hendersonventures.com). Severe regional recessions will constrain PC markets to a 3.8% gain in 2009, Henderson adds. Without WiMax and netbooks, unit growth rates would be negative during 2009. All major computer-manufacturing regions, except China, will take a hit, with US output falling 6.2%. China will grow just 2.2% gain in 2009. % change Sept.r Oct.* -2.3 -6.0 15.8 1.2 0.7 16.9 3.3 -14.3 -0.5 4.7 1.9 -2.9 3.3 7.9 -7.5 -5.2 -5.7 3.8 -0.8 33.3 -2.0 -7.7 1.0 0.0 ytD 0.0 -8.5 -2.1 -1.0 -2.3 29.2 -14.7 -6.1 -2.8 -0.5 4.0 11.0 -5.6 -4.9 -8.2 1.5 -7.5 Defense communications equipment -14.2 -7.7 -18.6 -0.9 0.5 1.7 -1.2 WSTS Lowers 2009 Chip Forecast San JoSE, ca – Global sales of semiconductors will fall 2.2% in 2009, according to a revised forecast by the World Semiconductor Trade Statistics group (wsts. org), citing the overall economy. The trade group said chip sales would drop to $256 billion next year, down from an estimated $261.9 billion in 2008. In May, WSTS forecast 5.8% growth for 2009. The WSTS is made up of 66 semiconductor manufacturers whose sales represent about 80% of the global market. The trade group expects 6.5% growth in 2010, to $273 billion, down from an earlier forecast of 8.8% growth. *Preliminary. 1Includes semiconductors. Seasonally adjusted. Source: U.S. Department of Commerce Census Bureau, December 4, 2008 Manufacturing Contraction tEMPE, aZ – Economic activity in the manufacturing sector failed to grow in November for the fourth consecutive month, and the overall economy contracted for the second consecutive month, says the Institute for Supply Management (ism.ws). The November PMI registered 36.2%, down 2.7 points. New orders fell 4.3 points to 27.9%, reaching their lowest level since June 1980 (24.2%). Production was 31.5%, down from 34.1%, while inventories dropped 5.2 points to 39.1%. Customer inventories remained at 55%, and the backlog of orders fell 2.5 points to 27%. A reading above 50% generally indicates growth. “When comparing November to October, the PMI indicates a continuing rapid rate of contraction in manufacturing,” said ISM spokesperson Norbert J. Ore. July PMI New orders Production Inventories Backlogs 50.0 45.0 52.9 45.0 43.0 aug. 49.9 48.3 52.1 49.3 54.5 43.5 Sept. 43.5 38.8 40.8 43.4 53.5 35.0 Oct. 38.9 32.2 34.1 44.3 55.0 29.5 nOv. 36.2 27.9 31.5 39.1 55.0 27.0 StaMFord, ct – Gartner Inc. (gartner.com) revised its 2009 capital spending estimates to $26.8 billion, the lowest levels since 2003. The revised figures are 17% and 18%, respectively, lower than 2008’s predicted levels. In October, the research firm forecast capital expenditures of $41.1 billion and total equipment spending of $30.5 billion. Gartner suggested buyers tighten component inventories by reducing order sizes and ordering more often. 2009 Equipment Sales Could Hit 6-Year Low Customer inventories 47.0 Source: Institute for Supply Management, December 1, 2008 induStry MarkEt SnaPShot Book-to-bills of various components/equipment. June July aug. Sept. Oct. Semiconductor equipment1 Semiconductors2 Rigid PCBs3 (North America) Flexible PCBs3 (North America) Computers/electronic products4 0.81 0.94 1.02 5.21 0.83 0.94 1.01 5.08 0.81 0.95 0.90 5.27 0.70r NA%r 0.96 0.94 5.32r 0.93p -2.4%p 0.95 1.00 5.35p 5.91% 7.11% 7.02% MEtalS indEx Date Gold1 Silver2 Copper3 Tin4 12nd 12/10/07 $809.50 $213.94 $3.04 $7.44 9/8/08 $815.00 $191.95 $3.14 $8.17 10/6/08 875.50 $133.13 $1.67 $5.65 11/3/08 729.50 $151.42 $1.69 $5.42 12/8/08 768.00 $149.81 $1.38 $5.22 London Fix price/tr.oz. 2Handy and Harman Silver (COMEX Silver) price/LB. 3LME Cash Seller and Settlement for Copper price/LB. 4LME Cash Seller and Settlement for Tin price/LB. Sources: 1SEMI, 2SIA (3-month moving average growth), 3IPC, 4Census Bureau, pPreliminary, rRevised 6 PRINTED CIRCUIT DESIGN & FAB JANUARY 2009 http://www.hendersonventures.com http://www.hendersonventures.com http://www.ism.ws http://www.gartner.com
Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - January 2009 Printed Circuit Design & Fab - January 2009 Contents Our Line Market Watch Around the World Happenings ROI The Signal Doctor Positive Plating Final Finish Forum Making Sense of Laminate Dielectric Properties Design and Fab Tips for Improving Solder Mask Registration Automating the DDRx Interface Verification Process Printed Circuit Design & Fab Annual Buyers Guide: Special Suppliers Section Printed Circuit Design & Fab Annual Buyers Guide: Guide to Products and Services Off the Shelf Marketplace Ad Index BGA Bulletin Printed Circuit Design & Fab - January 2009 Printed Circuit Design & Fab - January 2009 - (Page Intro) Printed Circuit Design & Fab - January 2009 - Printed Circuit Design & Fab - January 2009 (Page Cover1) Printed Circuit Design & Fab - January 2009 - Printed Circuit Design & Fab - January 2009 (Page Cover2) Printed Circuit Design & Fab - January 2009 - Printed Circuit Design & Fab - January 2009 (Page 1) Printed Circuit Design & Fab - January 2009 - Contents (Page 2) Printed Circuit Design & Fab - January 2009 - Contents (Page 3) Printed Circuit Design & Fab - January 2009 - Our Line (Page 4) Printed Circuit Design & Fab - January 2009 - Our Line (Page 5) Printed Circuit Design & Fab - January 2009 - Market Watch (Page 6) Printed Circuit Design & Fab - January 2009 - Market Watch (Page 7) Printed Circuit Design & Fab - January 2009 - Around the World (Page 8) Printed Circuit Design & Fab - January 2009 - Around the World (Page 9) Printed Circuit Design & Fab - January 2009 - Around the World (Page 10) Printed Circuit Design & Fab - January 2009 - Around the World (Page 11) Printed Circuit Design & Fab - January 2009 - Happenings (Page 12) Printed Circuit Design & Fab - January 2009 - Happenings (Page 13) Printed Circuit Design & Fab - January 2009 - ROI (Page 14) Printed Circuit Design & Fab - January 2009 - The Signal Doctor (Page 15) Printed Circuit Design & Fab - January 2009 - The Signal Doctor (Page 16) Printed Circuit Design & Fab - January 2009 - The Signal Doctor (Page 17) Printed Circuit Design & Fab - January 2009 - Positive Plating (Page 18) Printed Circuit Design & Fab - January 2009 - Final Finish Forum (Page 19) Printed Circuit Design & Fab - January 2009 - Making Sense of Laminate Dielectric Properties (Page 20) Printed Circuit Design & Fab - January 2009 - Making Sense of Laminate Dielectric Properties (Page 21) Printed Circuit Design & Fab - January 2009 - Making Sense of Laminate Dielectric Properties (Page 22) Printed Circuit Design & Fab - January 2009 - Making Sense of Laminate Dielectric Properties (Page 23) Printed Circuit Design & Fab - January 2009 - Making Sense of Laminate Dielectric Properties (Page 24) Printed Circuit Design & Fab - January 2009 - Making Sense of Laminate Dielectric Properties (Page 25) Printed Circuit Design & Fab - January 2009 - Making Sense of Laminate Dielectric Properties (Page 26) Printed Circuit Design & Fab - January 2009 - Making Sense of Laminate Dielectric Properties (Page 27) Printed Circuit Design & Fab - January 2009 - Design and Fab Tips for Improving Solder Mask Registration (Page 28) Printed Circuit Design & Fab - January 2009 - Design and Fab Tips for Improving Solder Mask Registration (Page 29) Printed Circuit Design & Fab - January 2009 - Design and Fab Tips for Improving Solder Mask Registration (Page 30) Printed Circuit Design & Fab - January 2009 - Automating the DDRx Interface Verification Process (Page 31) Printed Circuit Design & Fab - January 2009 - Automating the DDRx Interface Verification Process (Page 32) Printed Circuit Design & Fab - January 2009 - Automating the DDRx Interface Verification Process (Page 33) Printed Circuit Design & Fab - January 2009 - Printed Circuit Design & Fab Annual Buyers Guide: Special Suppliers Section (Page 34) Printed Circuit Design & Fab - January 2009 - Printed Circuit Design & Fab Annual Buyers Guide: Special Suppliers Section (Page 35) Printed Circuit Design & Fab - January 2009 - Printed Circuit Design & Fab Annual Buyers Guide: Guide to Products and Services (Page 36) Printed Circuit Design & Fab - January 2009 - Printed Circuit Design & Fab Annual Buyers Guide: Guide to Products and Services (Page 37) Printed Circuit Design & Fab - January 2009 - Printed Circuit Design & Fab Annual Buyers Guide: Guide to Products and Services (Page 38) Printed Circuit Design & Fab - January 2009 - Printed Circuit Design & Fab Annual Buyers Guide: Guide to Products and Services (Page 39) Printed Circuit Design & Fab - January 2009 - Printed Circuit Design & Fab Annual Buyers Guide: Guide to Products and Services (Page 40) Printed Circuit Design & Fab - January 2009 - Printed Circuit Design & Fab Annual Buyers Guide: Guide to Products and Services (Page 41) Printed Circuit Design & Fab - January 2009 - Printed Circuit Design & Fab Annual Buyers Guide: Guide to Products and Services (Page 42) Printed Circuit Design & Fab - January 2009 - Off the Shelf (Page 43) Printed Circuit Design & Fab - January 2009 - Marketplace (Page 44) Printed Circuit Design & Fab - January 2009 - Marketplace (Page 45) Printed Circuit Design & Fab - January 2009 - Ad Index (Page 46) Printed Circuit Design & Fab - January 2009 - Ad Index (Page 47) Printed Circuit Design & Fab - January 2009 - BGA Bulletin (Page 48) Printed Circuit Design & Fab - January 2009 - BGA Bulletin (Page Cover3) Printed Circuit Design & Fab - January 2009 - BGA Bulletin (Page Cover4)
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