Printed Circuit Design & Fab - February 2009 - (Page 12) haPPEninGS FACES The Board of Directors at Cadence Design Systems Inc. has appointed Lip-Bu Tan as president and CeO, effective immediately. Tan had been serving as interim vice chairman of the Board and was a member of the Interim Office of the Chief executive. he will retain his Board membership. Tan has been a member of the company’s Board of Directors since 2004. Daleba Electronics Ltd., a leading supplier of printed circuit boards (PCBs) in the United Kingdom, has promoted John Meyer to CeO. he joined the company in January 2008 as director of business development. As CeO, he will lead the company through the next stages of its growth and development. Meyer brings over 25 years of experience in the electronics industry. Prior to joining Daleba, he worked for companies such as Arrow electronics Inc., Philips and electrocomponents. Endicott Interconnect Technologies Inc. (EI) has named Steve Payne director of european sales for EI Technologies UK Ltd. he will manage the newly formed UK office and oversee account penetration for specific targets within the european market. eI’s european manufacturing representatives will report directly to him. Payne brings over 30 years of experience in the global electronic packaging industry. Prior to joining eI, he was the divisional manager for GeC Marconi Research and managing director of Cirflex Technology Ltd. Association Connecting Electronics Industries has named Arthur Huenecke chief information officer. In this newly created position, huenecke will have various responsibilities, including strengthening and leveraging IPC’s information infrastructure, overseeing development and maintenance of the company’s applications and databases and system security. he has over 15 years of experience in business and information systems management, planning and processing. Prior to joining IPC, huenecke worked for such companies as Flextronics and elkay Manufacturing. March EVENTS 2-5 DesignCon 2009 Santa Clara Convention Center Santa Clara, CA Contact: designcon.com/2009/register It's Not Easy Being Green: Compliance with Legislation and Customer Requirements IPC Wyndham San Jose San Jose, CA Contact: www.ipc.org/NotEasyBeingGreen PCB PHoENIx HILToN PHoENIx EAST/MESA PHoENIx, AZ CoNTACT: WWW.PCBSHoWS.CoM/PHoENIx FEB 4-5 11 24-25 VIRTUAL PCB HoSTED By UP MEDIA GRoUP CoNTACT: WWW.VIRTUAL-PCB.CoM 17-19 CPCA Show Hosted by CPCA Shanghai, China Contact: www.global--electronics.net/link/en/16545154 17-19 electronica & Productronica China Hosted by Munich Trade Fairs International Shanghai New International Expo Centre Contact: www.global-electronics.net/en/ge/ electronicaproductronicachina/Home 31-2 IPC Printed Circuits Expo, APEx and the Designers Summit Conference & Exhibition Mandalay Bay Hotel and Convention Center Las Vegas Contact: www.goipcshows.org/html/main/default.htm Mar/aPril aPril 21-24 Nepcon China Everbright Convention and Exhibition Center Shanghai Contact: www.nepconchina.com 27-1 PCB EAST WESTIN WALTHAM-BoSToN WALTHAM, MA CoNTACT: WWW.PCBEAST.CoM Valor Computerized Systems has obtained the assets of PCB Matrix Corp. The acquisition expands Valor’s product portfolio of PCB design solutions; PCB Matrix customers will be able to access Valor’s global support services. PCB Matrix was a partner with IPC in the development of IPC-7351 Land Pattern standards, and the LP Wizard land pattern generation software was awarded the DesignVision Award at DesignCon 2007 . Chemcut Corp. announced the appointment of Cogent Manufacturing Solutions of Atkinson, Nh as its agent for the northeastern U.S. and parts of Canada. Cogent Manufacturing Solutions now represents Chemcut in New england, NJ, NYC, Long 12 Island, Quebec and the eastern half of Ontario, Canada. Cogent Manufacturing Solutions recently merged with Betz & Company. Cogent is assuming responsibility for the territory previously assigned to the Betz organization. Richard Betz and the Betz offices in Cranbury, NJ will continue to support Chemcut as part of the Cogent organization. Altium has named Triacon Scientific as its channel partner for Sweden. Triacon will sell Altium Designer, as well as Desktop NanoBoard and daughterboards. In addition, it will provide training, sales and support to local electronics designers. By extending its sales force of channel partners, Altium believes it will strengthen future growth. aPril/May IT’S A dEAL CalAmp Corp. and Rogers Corp. have reached an out-of-court settlement regarding a lawsuit filed by CalAmp in May 2008. Both parties acknowledge that Rogers admits no wrongdoing, is not liable for any claim and settled the litigation to avoid an extensive and costly litigation. The litigation concerned product performance issues involving laminate, supplied by Rogers, that was included in certain products manufactured by CalAmp and sold to a Direct Satellite customer. Rogers has agreed to make a cash payment of $9 million to CalAmp. Under terms of its bank credit agreement, CalAmp will put $4 million of the settlement toward its bank term loan. FEBRUARY 2009 printEd CirCuit dESign & fAB http://www.designcon.com/2009/register http://www.ipc.org/NotEasyBeingGreen http://www.pcbshows.com/phoenix http://www.virtual-pcb.com http://www.global-electronics.net/link/en/16545154 http://www.global-electronics.net/en/ge/ http://www.goipcshows.org/html/main/default.htm http://www.nepconchina.com http://www.pcbeast.com
Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - February 2009 Printed Circuit Design & Fab - February 2009 Contents Our Line Market Watch Around the World Happenings ROI Tip Jar BGA Bulletin Interconnect Strategies Final Finsh Forum Defects Database Embedded Active Components In Multilayer LCP Packages Simulation: The Need for Speed Advanced Registration Systems The DC Design Squeeze Ad Index Do You Really Want a Better Autorouter? Designing With Conductive Materials, Part 1 Off th eShelf Marketplace On the Forefront Printed Circuit Design & Fab - February 2009 Printed Circuit Design & Fab - February 2009 - (Page Intro) Printed Circuit Design & Fab - February 2009 - Printed Circuit Design & Fab - February 2009 (Page Cover1) Printed Circuit Design & Fab - February 2009 - Printed Circuit Design & Fab - February 2009 (Page Cover2) Printed Circuit Design & Fab - February 2009 - Printed Circuit Design & Fab - February 2009 (Page 1) Printed Circuit Design & Fab - February 2009 - Contents (Page 2) Printed Circuit Design & Fab - February 2009 - Contents (Page 3) Printed Circuit Design & Fab - February 2009 - Our Line (Page 4) Printed Circuit Design & Fab - February 2009 - Our Line (Page 5) Printed Circuit Design & Fab - February 2009 - Market Watch (Page 6) Printed Circuit Design & Fab - February 2009 - Market Watch (Page 7) Printed Circuit Design & Fab - February 2009 - Around the World (Page 8) Printed Circuit Design & Fab - February 2009 - Around the World (Page 9) Printed Circuit Design & Fab - February 2009 - Around the World (Page 10) Printed Circuit Design & Fab - February 2009 - Around the World (Page 11) Printed Circuit Design & Fab - February 2009 - Happenings (Page 12) Printed Circuit Design & Fab - February 2009 - Happenings (Page 13) Printed Circuit Design & Fab - February 2009 - ROI (Page 14) Printed Circuit Design & Fab - February 2009 - Tip Jar (Page 15) Printed Circuit Design & Fab - February 2009 - BGA Bulletin (Page 16) Printed Circuit Design & Fab - February 2009 - BGA Bulletin (Page P1) Printed Circuit Design & Fab - February 2009 - BGA Bulletin (Page P2) Printed Circuit Design & Fab - February 2009 - BGA Bulletin (Page P3) Printed Circuit Design & Fab - February 2009 - BGA Bulletin (Page P4) Printed Circuit Design & Fab - February 2009 - BGA Bulletin (Page 17) Printed Circuit Design & Fab - February 2009 - Interconnect Strategies (Page 18) Printed Circuit Design & Fab - February 2009 - Interconnect Strategies (Page 19) Printed Circuit Design & Fab - February 2009 - Final Finsh Forum (Page 20) Printed Circuit Design & Fab - February 2009 - Defects Database (Page 21) Printed Circuit Design & Fab - February 2009 - Embedded Active Components In Multilayer LCP Packages (Page 22) Printed Circuit Design & Fab - February 2009 - Embedded Active Components In Multilayer LCP Packages (Page 23) Printed Circuit Design & Fab - February 2009 - Embedded Active Components In Multilayer LCP Packages (Page 24) Printed Circuit Design & Fab - February 2009 - Embedded Active Components In Multilayer LCP Packages (Page 25) Printed Circuit Design & Fab - February 2009 - Simulation: The Need for Speed (Page 26) Printed Circuit Design & Fab - February 2009 - Simulation: The Need for Speed (Page 27) Printed Circuit Design & Fab - February 2009 - Simulation: The Need for Speed (Page 28) Printed Circuit Design & Fab - February 2009 - Simulation: The Need for Speed (Page 29) Printed Circuit Design & Fab - February 2009 - Advanced Registration Systems (Page 30) Printed Circuit Design & Fab - February 2009 - Advanced Registration Systems (Page 31) Printed Circuit Design & Fab - February 2009 - Advanced Registration Systems (Page 32) Printed Circuit Design & Fab - February 2009 - Advanced Registration Systems (Page 33) Printed Circuit Design & Fab - February 2009 - The DC Design Squeeze (Page 34) Printed Circuit Design & Fab - February 2009 - The DC Design Squeeze (Page 35) Printed Circuit Design & Fab - February 2009 - The DC Design Squeeze (Page 36) Printed Circuit Design & Fab - February 2009 - Ad Index (Page 37) Printed Circuit Design & Fab - February 2009 - Do You Really Want a Better Autorouter? (Page 38) Printed Circuit Design & Fab - February 2009 - Do You Really Want a Better Autorouter? (Page 39) Printed Circuit Design & Fab - February 2009 - Designing With Conductive Materials, Part 1 (Page 40) Printed Circuit Design & Fab - February 2009 - Designing With Conductive Materials, Part 1 (Page 41) Printed Circuit Design & Fab - February 2009 - Designing With Conductive Materials, Part 1 (Page 42) Printed Circuit Design & Fab - February 2009 - Off th eShelf (Page 43) Printed Circuit Design & Fab - February 2009 - Marketplace (Page 44) Printed Circuit Design & Fab - February 2009 - Marketplace (Page 45) Printed Circuit Design & Fab - February 2009 - Marketplace (Page 46) Printed Circuit Design & Fab - February 2009 - Marketplace (Page 47) Printed Circuit Design & Fab - February 2009 - On the Forefront (Page 48) Printed Circuit Design & Fab - February 2009 - On the Forefront (Page Cover3) Printed Circuit Design & Fab - February 2009 - On the Forefront (Page Cover4)
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