Printed Circuit Design & Fab - February 2009 - (Page 2)

FEBRUARY 2009 • VOL. 26 • NO. 2 FEATURES DC simulations, like this 3D walk through that shows current flow around PCB structures, can help designers meet tight voltage margins. Screen capture courtesy of Sigrity Inc. Vice image ©iStockPhoto.com / Olivier Blondeau Design by Katherine Haddox 22 PACKAGING Embedded Active Components In Multilayer LCP Packages Embedded active technology offers advantages in reduced parasitics and form factors, but thermal dissipation and rework issues are delaying commercialization. by SWAPAN K. BHATTACHARYA, NICKOLAS KINGSLEY, CHAD PATTERSON and JOHN PAPAPOLYMEROU 26 HS SIMULATION POINT OF VIEW 4 Simulation: The Need for Speed Establishing selection criteria can help determine the best simulation model for a specific task. by TIMOTHY COYLE 30 MATERIAL REGISTRATION OUR LINE Consensus management. Kathy Nargi-Toth 14 Advanced Registration Systems An integrated registration control system can provide feedback for continuous improvement, increasing overall process yields. by NEIL CHILTON 34 SIMULATION ROI Making difficult decisions can help your company rise to the top during the economic storm. Peter Bigelow 15 THE DC DESIGN SQUEEZE DC simulations can help meet tight voltage margins and avoid field failure risk. by LESLIE LANDERS and TANIT VIRUTCHAPUNT 38 LAYOUT TOOLS TIP JAR Planning via placement can improve the routability and integrity of the PCB. Susy Webb 16 Do You Really Want a Better Autorouter? Complex constraints require integrated autorouting that gives the designer the control to deliver productivity gains. by ROB IRWIN 40 THERMAL MANAGEMENT BGA BULLETIN A look back at the most important ideas for fanout and routing of BGAs. Charles Pfeil 18 Designing With Conductive Materials, Part 1 Complex electronic products present design engineers with an increased need for cost-effective thermal management. by HELENA LI INTERCONNECT STRATEGIES PCB material selection requires the evaluation of electrical, mechanical and thermal properties, as well as price. DEPARTMENTS 6 8 Dr. Abe (Abbas) Riazi 20 FINAL FINISH FORUM Organic metals take the stage. MARKET WATCH AROUND THE WORLD 12 37 HAPPENINGS AD INDEX 43 44 OFF THE SHELF MARKETPLACE Jim Kenny 21 DEFECTS DATABASE Thermal shock testing can avoid plating adhesion problems. Circuits Assembly Online The $50 Billion Club circuitsassembly.com Dr. Davide Di Maio 48 ON THE FOREFRONT The right investments will prepare companies for tomorrow. The gap between the Top 10 EMS companies and their smaller rivals is striking. But to make our exclusive list of the largest EMS companies in 2008 involves first reaching $200 million in sales. by MIKE BUETOW and CHELSEY DRYSDALE E. Jan Vardaman The Changing Role of OEM Product Development Engineering Teams OEM engineering teams are being asked to do more with less on a regular basis. Result: Product development teams and suppliers see changes in the way they collaborate. by DUANE BENSON POSTMASTER: Send address changes to PRINTED CIRCUIT DESIGN & FAB, P.O. Box 35646, Tulsa, OK 74153-0646 http://www.iStockPhoto.com http://www.circuitsassembly.com

Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - February 2009

Printed Circuit Design & Fab - February 2009 Contents Our Line Market Watch Around the World Happenings ROI Tip Jar BGA Bulletin Interconnect Strategies Final Finsh Forum Defects Database Embedded Active Components In Multilayer LCP Packages Simulation: The Need for Speed Advanced Registration Systems The DC Design Squeeze Ad Index Do You Really Want a Better Autorouter? Designing With Conductive Materials, Part 1 Off th eShelf Marketplace On the Forefront

Printed Circuit Design & Fab - February 2009

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