Printed Circuit Design & Fab - February 2009 - (Page 23) PackaGinG a B c FiGurE 2. (A) Cross-sectional view of the mounted chip on a removable carrier Si wafer, (B) Packaged oscillator with wire bonding, (C) Output spectrum of the packaged oscillator vs. unpackaged state.13 sections show examples of embedded ICs in single and multilayer LCP. Embedded VCO A mm-wave 36 GHz SiGe voltage controlled oscillator was embedded in a laser-cut cavity13 and packaged within core LCP while maintaining a high performance profile (FiGurE 2). Photolithography and copper etching made the transmission lines on the LCP. A cavity that matches the lateral dimension of the VCO was laser cut using a KrF 248 nm UV Excimer laser. The laser cut LCP was then mounted on Si wafer. The VCO was dropped through the precut window and secured to the carrier Si substrate (FiGurE 2a). The connections to the transmission lines were made by wire bonding (FiGurE 2B). Measurements of both wafer-level and package-level oscillators were done on an Agilent E4446A spectrum analyzer. A plot of the output spectrum of the packaged oscillator, with respect to the unpackaged performance, is depicted in FiGurE 2c. The increased parasitics of the packaged part causes an additional 1.9% shift in oscillation frequency. The output power of the packaged part is 3 dB down from that of the unpackaged part (FIGURE 2C). Measurements after packaging showed a figure of merit 13 dB down from the on-chip measurements. Much of this degradation in oscillator performance is expected due to the wire bond connections. Three-dimensional Phased Array with RF MEMS switches and LNA A fully integrated phased array antenna with radio frequency micro-electromechanical systems (RF MEMS) switches on a flexible, organic substrate was demonstrated above 10 GHz for use in a NASA Earth observing satellite system.14 The fully integrated array con- FEBRUARY 2009 printEd CirCuit dESign & fAB 23 http://www.wssi.com/pcdm http://www.wssi.com/pcdm
Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - February 2009 Printed Circuit Design & Fab - February 2009 Contents Our Line Market Watch Around the World Happenings ROI Tip Jar BGA Bulletin Interconnect Strategies Final Finsh Forum Defects Database Embedded Active Components In Multilayer LCP Packages Simulation: The Need for Speed Advanced Registration Systems The DC Design Squeeze Ad Index Do You Really Want a Better Autorouter? Designing With Conductive Materials, Part 1 Off th eShelf Marketplace On the Forefront Printed Circuit Design & Fab - February 2009 Printed Circuit Design & Fab - February 2009 - (Page Intro) Printed Circuit Design & Fab - February 2009 - Printed Circuit Design & Fab - February 2009 (Page Cover1) Printed Circuit Design & Fab - February 2009 - Printed Circuit Design & Fab - February 2009 (Page Cover2) Printed Circuit Design & Fab - February 2009 - Printed Circuit Design & Fab - February 2009 (Page 1) Printed Circuit Design & Fab - February 2009 - Contents (Page 2) Printed Circuit Design & Fab - February 2009 - Contents (Page 3) Printed Circuit Design & Fab - February 2009 - Our Line (Page 4) Printed Circuit Design & Fab - February 2009 - Our Line (Page 5) Printed Circuit Design & Fab - February 2009 - Market Watch (Page 6) Printed Circuit Design & Fab - February 2009 - Market Watch (Page 7) Printed Circuit Design & Fab - February 2009 - Around the World (Page 8) Printed Circuit Design & Fab - February 2009 - Around the World (Page 9) Printed Circuit Design & Fab - February 2009 - Around the World (Page 10) Printed Circuit Design & Fab - February 2009 - Around the World (Page 11) Printed Circuit Design & Fab - February 2009 - Happenings (Page 12) Printed Circuit Design & Fab - February 2009 - Happenings (Page 13) Printed Circuit Design & Fab - February 2009 - ROI (Page 14) Printed Circuit Design & Fab - February 2009 - Tip Jar (Page 15) Printed Circuit Design & Fab - February 2009 - BGA Bulletin (Page 16) Printed Circuit Design & Fab - February 2009 - BGA Bulletin (Page P1) Printed Circuit Design & Fab - February 2009 - BGA Bulletin (Page P2) Printed Circuit Design & Fab - February 2009 - BGA Bulletin (Page P3) Printed Circuit Design & Fab - February 2009 - BGA Bulletin (Page P4) Printed Circuit Design & Fab - February 2009 - BGA Bulletin (Page 17) Printed Circuit Design & Fab - February 2009 - Interconnect Strategies (Page 18) Printed Circuit Design & Fab - February 2009 - Interconnect Strategies (Page 19) Printed Circuit Design & Fab - February 2009 - Final Finsh Forum (Page 20) Printed Circuit Design & Fab - February 2009 - Defects Database (Page 21) Printed Circuit Design & Fab - February 2009 - Embedded Active Components In Multilayer LCP Packages (Page 22) Printed Circuit Design & Fab - February 2009 - Embedded Active Components In Multilayer LCP Packages (Page 23) Printed Circuit Design & Fab - February 2009 - Embedded Active Components In Multilayer LCP Packages (Page 24) Printed Circuit Design & Fab - February 2009 - Embedded Active Components In Multilayer LCP Packages (Page 25) Printed Circuit Design & Fab - February 2009 - Simulation: The Need for Speed (Page 26) Printed Circuit Design & Fab - February 2009 - Simulation: The Need for Speed (Page 27) Printed Circuit Design & Fab - February 2009 - Simulation: The Need for Speed (Page 28) Printed Circuit Design & Fab - February 2009 - Simulation: The Need for Speed (Page 29) Printed Circuit Design & Fab - February 2009 - Advanced Registration Systems (Page 30) Printed Circuit Design & Fab - February 2009 - Advanced Registration Systems (Page 31) Printed Circuit Design & Fab - February 2009 - Advanced Registration Systems (Page 32) Printed Circuit Design & Fab - February 2009 - Advanced Registration Systems (Page 33) Printed Circuit Design & Fab - February 2009 - The DC Design Squeeze (Page 34) Printed Circuit Design & Fab - February 2009 - The DC Design Squeeze (Page 35) Printed Circuit Design & Fab - February 2009 - The DC Design Squeeze (Page 36) Printed Circuit Design & Fab - February 2009 - Ad Index (Page 37) Printed Circuit Design & Fab - February 2009 - Do You Really Want a Better Autorouter? (Page 38) Printed Circuit Design & Fab - February 2009 - Do You Really Want a Better Autorouter? (Page 39) Printed Circuit Design & Fab - February 2009 - Designing With Conductive Materials, Part 1 (Page 40) Printed Circuit Design & Fab - February 2009 - Designing With Conductive Materials, Part 1 (Page 41) Printed Circuit Design & Fab - February 2009 - Designing With Conductive Materials, Part 1 (Page 42) Printed Circuit Design & Fab - February 2009 - Off th eShelf (Page 43) Printed Circuit Design & Fab - February 2009 - Marketplace (Page 44) Printed Circuit Design & Fab - February 2009 - Marketplace (Page 45) Printed Circuit Design & Fab - February 2009 - Marketplace (Page 46) Printed Circuit Design & Fab - February 2009 - Marketplace (Page 47) Printed Circuit Design & Fab - February 2009 - On the Forefront (Page 48) Printed Circuit Design & Fab - February 2009 - On the Forefront (Page Cover3) Printed Circuit Design & Fab - February 2009 - On the Forefront (Page Cover4)
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