Printed Circuit Design & Fab - February 2009 - (Page 25)

PackaGinG 12. S. K. Bhattacharya, M. Tentzeris, L. Yang, S. Basat and A. Rida “Flexible LCP and paperbased substrates with embedded actives, passives, and RFIDs, Polytronics 2007, ” Tokyo, Japan, January 2007. 13. C. Patterson, S. horst, S. Bhattacharya, J. Papapolymerou and J. Cressler, “Low cost organic packaging for silicon based mm-wave wireless systems, european ” Microwave Conference, Amsterdam, October, 2008. 14. N. Kingsley, G. Ponchak and J. Papapolymerou, “Reconfigurable RF MeMS phased array antenna integrated within a liquid crystal polymer, Ieee Transactions ” of Antennas and Propagation, Vol 56, No 1, January 2008, pgs. 108-118. 15. N. Kingsley, “Development of Miniature, Multilayer, Integrated, Reconfigurable RF MeMS Communication Module on Liquid Crystal Polymer (LCP) Substrate, Ph.D. Dis” sertation, Georgia Institute of Technology, 2007. a B FiGurE 6. (A) Return loss of the single layer antenna module with LNA, (B) Return loss of the multi-layer antenna module with LNA implementation.14 ductive metal can minimize line loss. Properly simulating the device and having good alignment accuracy during fabrication can minimize the aperture coupling loss. The use of metal-filled vias could also reduce the loss. An embedded active is a viable technology offering advantages in reduced parasitics and form factors and has been proven to be technologically feasible. However, thermal dissipation and reworkability issues are still considered bottlenecks for commercialization. LCP has been proven to be a promising dielectric for multilayer 3D packages with embedded actives without significant degradation of RF performance of the packaged chips in the mm-wave frequencies. pCd&f rEFErEncES 1. J. Fjelstad, “A brief history of embedded device technology, Global SMT and Pack” aging Magazine, Issue 8.3, March 2008. 2. W. Daum, W. Burdick and R. Fillion, “Overlay high-density interconnect: a chips-first multichip module technology, Computer, vol ” 26, issue 11, 1993, pp. 23-29. 3. D. Fritz, “Coming-embedded Active Components, how Does IPC Respond, IPC ” TAeC Meeting, Minnapolis, October, 2004 [Source: Japan Jisso Technology Roadmap, 2003 edition, JeITA]. 4. D. Thompson, O. Tantot, h. Jallageas, G. Ponchak, M. Tentzeris and J. Papapolymerou, “Characterization of Liquid Crystal Polymer (LCP) material and transmission lines on LCP substrates from 30 to 110 Ghz, ” Ieee Transactions on Microwave Theory and Techniques, Vol. 52, No. 4, April 2004, pgs. 1343–1352. 5. D. Thompson, M. Tentzeris and J. Papapolymerou, “experimental analysis of the water absorption effects on RF mm-wave active/passives circuits packaged in multilayer organic substrate, Ieee Transactions ” on Advanced Packaging, Vol 30, 2007 pgs. , 551-557 . 6. N. Kingsley, “Liquid crystal polymer: enabling next generation conformal and multi-layer electronics, Microwave Journal, ” 2008, pgs. 188-200. 7 X. Duo, L. Zheng and h. Tenhunen, “Design . and implementation of a 5 Ghz RF receiver in LCP based system-on-package with embedded chip technology, Ieee electronic ” Components and Technology Conference, SwaPan k. Bhattacharya, nicolaS 2003, pgs. 51-54. kinGSlEy, chad PattErSon and John 8. M. Chen, A.V. Pham, Chris Kapusta, J. IanPaPaPolyMErou are associated with notti, W. Kornrumpf and J. Maciel, Ieee the School of electrical and Computer Transactions on Microwave Theory and engineering, Georgia Institute of TechTechniques, Vol 56, No 4, April 2008, pgs. 952-958. nology. Atlanta, GA 30332, USA. Swa9. M. Rowlands and R. Das, “Manufacture and pan K. Bhattacharya can be reached at ultrahigh performance of an LCP based Swapan@ece.gatech.edu. Z-interconnect flip chip package, ” Ieee eCTC 2008, pgs. 1362-1367. 10. R. Dean, J. Weller, J. Bozack, C. Rodekohr, M. Bozach, B. Farrell,L. Jauniskis, J. Ting, D. edell and J. hetke “Realization of ultra fine pitch traces on LCP” , Ieee Transactions on Component and Packaging Technologies, Vol Internet pioneers with 15 years experience 31, No 2, June 2008, pgs. 315Instant online Quotations & Ordering 321. 11. T. Torikka, D. XinFrom Singlesided to 6 layers ML zhong, Z. Li-Rong, Leadtimes from 48 hrs e.Tjukanoff and h. Tenhunen, “ChipFull DRC included on all orders package co-design of a concurrent High Quality prototypes at LOW cost's LNA in systemon-package for Simply send your layout files multi-band radio and order online a p p l i c a t i o n s ,” electronic Packaging and TechnolTollFree USA: 1877 3908541 Email: sales@pcb-pool.com ogy Conference, Volume 2, June 2004, pgs. 1687 – 1692. Specializing in Quickturn Proto's www.pcb-pool.com FEBRUARY 2009 printEd CirCuit dESign & fAB 25 http://www.pcb-pool.com http://www.pcb-pool.com

Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - February 2009

Printed Circuit Design & Fab - February 2009 Contents Our Line Market Watch Around the World Happenings ROI Tip Jar BGA Bulletin Interconnect Strategies Final Finsh Forum Defects Database Embedded Active Components In Multilayer LCP Packages Simulation: The Need for Speed Advanced Registration Systems The DC Design Squeeze Ad Index Do You Really Want a Better Autorouter? Designing With Conductive Materials, Part 1 Off th eShelf Marketplace On the Forefront

Printed Circuit Design & Fab - February 2009

For optimal viewing of this digital publication, please enable JavaScript and then refresh the page. If you would like to try to load the digital publication without using Flash Player detection, please click here.