Printed Circuit Design & Fab - February 2009 - (Page 6) MarkEt watch SEMiS and coMPutErS craSh trends in the u.S. electronics equipment market (shipments only). Sept Computers/electronics products Computers Storage devices Other peripheral equipment Nondefense communications equipment Defense communications equipment A/V equipment Semiconductors Components1 Nondefense search and navigation equipment Defense search and navigation equipment Medical, measurement and control rRevised. 1Includes % chANge Oct r NOv* 2.2 2.2 -10.8 -4.6 -4.5 4.2 -4.6 29.0 -3.1 -5.0 2.2 -0.4 -4.5 -12.4 -7.8 3.3 6.5 -5.7 -9.8 -22.5 -4.1 -6.8 3.0 0.4 ytD -1.0 -11.1 -3.8 -1.8 -2.0 28.8 -17.3 -8.8 -3.6 -2.3 4.6 10.6 -2.3 -6.0 15.8 1.2 0.7 16.9 3.3 -14.3 -0.5 4.7 1.9 -2.9 loS altoS, ca – Global electronic equipment revenues will fall 2.2% in 2009, before rebounding to 6.7% growth in 2010, according to a new forecast by Henderson Ventures (hendersonventures.com). The firm estimates 2008 will show a 1.2% gain, lower than previous forecasts. According to Henderson, the US will take a 4.4% hit in 2009, then recover 4.3% in 2010. Japan will fall 5.3%, then rebound to 4.6% growth in 2010. Western Europe will decline 6% in 2009, then grow 3.8% in 2010. China is an exception: It will grow 2.3% in 2009 and 10.1% in 2010. Electronics Equipment Sales to Dip 2.2% in '09 Large-Sized LCD Panel Shipments Decline 5% in Q4 El SEGundo, ca – Following a 3% sequential decline *Preliminary. semiconductors. Seasonally adjusted. Source: U.S. Department of Commerce Census Bureau, Jan. 6, 2009 Manufacturing Continues Decline in December tEMPE, aZ – Economic activity in the manufacturing sector in the third quarter, global unit shipments of largesized (diagonal dimension of 10 inches or more) LCD panels decreased another 5% in the fourth quarter of 2008, says iSuppli Corp (isuppli.com). failed to grow in December for the fifth consecutive month, and the overall economy contracted for the third consecutive month, says the Institute for Supply Management (ism. ws). In response, manufacturers are reducing inventories and capacity, the trade group said. The December PMI registered 32.4%, down 3.8 percentage points, well below the 50% measure indicating expansion. New orders were at 22.7% - the lowest rate since 1948 – a drop of 5.2 points from the revised November rate, and the 13th straight month of decline. Production dipped six points to 25.5%. Backlogs dropped to the lowest level since ISM began tracking them in January 1993. Aug. PMI New orders Production Inventories Backlogs 49.9 48.3 52.1 49.3 43.5 Sept. 43.5 38.8 40.8 43.4 53.5 35.0 Oct. 38.9 32.2 34.1 44.3 55.0 29.5 NOv. 36.2 27.9 31.5 39.1 55.0 27.0 Dec. 32.4 22.7 25.5 38.8 57.0 23.0 Is Semi Industry About to Turn? nEw york – Wachovia (wachovia.com) analyst David Wong has upgraded the semiconductor sector to overweight from market weight, saying a recovery could come in the next quarter. “As more data become available, allowing us to quantify the impact of the current downturn on various technology segments, we grow more hopeful that an inflection point in fundamentals may be relatively close, a few months away,” he wrote in a research note. “We are hopeful aggressive action to control inventory in the electronic supply chain in recent months has paved the way for some improvement in inventory levels, perhaps beginning in the June quarter," he concluded. Wachovia forecasts worldwide drops of five to 15% in semiconductor sales, zero to 5% in PC unit shipments and zero to 10% in handset units in 2009. Customer inventories 54.5 Source: Institute for Supply Management, January 2, 2009 induStry MarkEt SnaPShot Book-to-bills of various components/equipment. July Aug. Sept. Oct. Semiconductor equipment1 Semiconductors2 Rigid PCBs3 (North America) Flexible PCBs3 (North America) Computers/electronic products4 0.83 0.94 1.01 5.08 0.81 0.95 0.90 5.27 0.70 0.96 0.94 5.32 0.96r 0.95 1.00 5.36r 7.11% 7.02% 4.82% NOv. 1.00p 0.94 1.04 5.46p MEtalS indEx DAte Gold1 Silver2 Copper3 Tin4 12nd 1/07/08 $859.25 $224.57 $3.14 $7.44 10/13/08 $831.50 $152.59 $2.28 $6.49 11/10/08 $753.00 $152.59 $1.82 $7.01 12/08/08 $767.25 $149.81 $1.38 $5.22 1/05/09 $853.50 $159.03 $1.39 $5.24 1.45%r -3.61%p London Fix price/tr.oz. 2Handy and Harman Silver (COMEX Silver) price/LB. 3LME Cash Seller and Settlement for Copper price/LB. 4LME Cash Seller and Settlement for Tin price/LB. Sources: 1SEMI, 2SIA (3-month moving average growth), 3IPC, 4Census Bureau, pPreliminary, rRevised 6 printEd CirCuit dESign & fAB FEBRUARY 2009 http://www.hendersonventures.com http://www.isuppli.com http://www.wachovia.com
Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - February 2009 Printed Circuit Design & Fab - February 2009 Contents Our Line Market Watch Around the World Happenings ROI Tip Jar BGA Bulletin Interconnect Strategies Final Finsh Forum Defects Database Embedded Active Components In Multilayer LCP Packages Simulation: The Need for Speed Advanced Registration Systems The DC Design Squeeze Ad Index Do You Really Want a Better Autorouter? Designing With Conductive Materials, Part 1 Off th eShelf Marketplace On the Forefront Printed Circuit Design & Fab - February 2009 Printed Circuit Design & Fab - February 2009 - (Page Intro) Printed Circuit Design & Fab - February 2009 - Printed Circuit Design & Fab - February 2009 (Page Cover1) Printed Circuit Design & Fab - February 2009 - Printed Circuit Design & Fab - February 2009 (Page Cover2) Printed Circuit Design & Fab - February 2009 - Printed Circuit Design & Fab - February 2009 (Page 1) Printed Circuit Design & Fab - February 2009 - Contents (Page 2) Printed Circuit Design & Fab - February 2009 - Contents (Page 3) Printed Circuit Design & Fab - February 2009 - Our Line (Page 4) Printed Circuit Design & Fab - February 2009 - Our Line (Page 5) Printed Circuit Design & Fab - February 2009 - Market Watch (Page 6) Printed Circuit Design & Fab - February 2009 - Market Watch (Page 7) Printed Circuit Design & Fab - February 2009 - Around the World (Page 8) Printed Circuit Design & Fab - February 2009 - Around the World (Page 9) Printed Circuit Design & Fab - February 2009 - Around the World (Page 10) Printed Circuit Design & Fab - February 2009 - Around the World (Page 11) Printed Circuit Design & Fab - February 2009 - Happenings (Page 12) Printed Circuit Design & Fab - February 2009 - Happenings (Page 13) Printed Circuit Design & Fab - February 2009 - ROI (Page 14) Printed Circuit Design & Fab - February 2009 - Tip Jar (Page 15) Printed Circuit Design & Fab - February 2009 - BGA Bulletin (Page 16) Printed Circuit Design & Fab - February 2009 - BGA Bulletin (Page P1) Printed Circuit Design & Fab - February 2009 - BGA Bulletin (Page P2) Printed Circuit Design & Fab - February 2009 - BGA Bulletin (Page P3) Printed Circuit Design & Fab - February 2009 - BGA Bulletin (Page P4) Printed Circuit Design & Fab - February 2009 - BGA Bulletin (Page 17) Printed Circuit Design & Fab - February 2009 - Interconnect Strategies (Page 18) Printed Circuit Design & Fab - February 2009 - Interconnect Strategies (Page 19) Printed Circuit Design & Fab - February 2009 - Final Finsh Forum (Page 20) Printed Circuit Design & Fab - February 2009 - Defects Database (Page 21) Printed Circuit Design & Fab - February 2009 - Embedded Active Components In Multilayer LCP Packages (Page 22) Printed Circuit Design & Fab - February 2009 - Embedded Active Components In Multilayer LCP Packages (Page 23) Printed Circuit Design & Fab - February 2009 - Embedded Active Components In Multilayer LCP Packages (Page 24) Printed Circuit Design & Fab - February 2009 - Embedded Active Components In Multilayer LCP Packages (Page 25) Printed Circuit Design & Fab - February 2009 - Simulation: The Need for Speed (Page 26) Printed Circuit Design & Fab - February 2009 - Simulation: The Need for Speed (Page 27) Printed Circuit Design & Fab - February 2009 - Simulation: The Need for Speed (Page 28) Printed Circuit Design & Fab - February 2009 - Simulation: The Need for Speed (Page 29) Printed Circuit Design & Fab - February 2009 - Advanced Registration Systems (Page 30) Printed Circuit Design & Fab - February 2009 - Advanced Registration Systems (Page 31) Printed Circuit Design & Fab - February 2009 - Advanced Registration Systems (Page 32) Printed Circuit Design & Fab - February 2009 - Advanced Registration Systems (Page 33) Printed Circuit Design & Fab - February 2009 - The DC Design Squeeze (Page 34) Printed Circuit Design & Fab - February 2009 - The DC Design Squeeze (Page 35) Printed Circuit Design & Fab - February 2009 - The DC Design Squeeze (Page 36) Printed Circuit Design & Fab - February 2009 - Ad Index (Page 37) Printed Circuit Design & Fab - February 2009 - Do You Really Want a Better Autorouter? (Page 38) Printed Circuit Design & Fab - February 2009 - Do You Really Want a Better Autorouter? (Page 39) Printed Circuit Design & Fab - February 2009 - Designing With Conductive Materials, Part 1 (Page 40) Printed Circuit Design & Fab - February 2009 - Designing With Conductive Materials, Part 1 (Page 41) Printed Circuit Design & Fab - February 2009 - Designing With Conductive Materials, Part 1 (Page 42) Printed Circuit Design & Fab - February 2009 - Off th eShelf (Page 43) Printed Circuit Design & Fab - February 2009 - Marketplace (Page 44) Printed Circuit Design & Fab - February 2009 - Marketplace (Page 45) Printed Circuit Design & Fab - February 2009 - Marketplace (Page 46) Printed Circuit Design & Fab - February 2009 - Marketplace (Page 47) Printed Circuit Design & Fab - February 2009 - On the Forefront (Page 48) Printed Circuit Design & Fab - February 2009 - On the Forefront (Page Cover3) Printed Circuit Design & Fab - February 2009 - On the Forefront (Page Cover4)
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