Printed Circuit Design & Fab - February 2009 - (Page P3) WEDNESDAY SESSIONS AND EVENTS 9:30 am – 10 am FREE THURSDAY, APRIL 30 8 am – 4 pm REGISTRATION OPEN 9 am – 11 am FREE TECHNICAL SESSION F1: Design for Wafer-Level CSP Technology Speaker: Vern Solberg 10 am – 11 am 3-DAY TECHNICAL CONFERENCE COURSES W6: Grounding to Control Noise and EMI Speaker: Rick Hartley, L-3 Communications, Avionics Systems 9 am – 12:30 pm FREE TECHNICAL SESSIONS F2: Design in 3D -- Solving Hardware to MCAD Integration Issues Speaker: Daniel Fernsebner, Altium 3-DAY TECHNICAL CONFERENCE COURSES S12: Placement and Routing of PCBs Speaker: Susy Webb, Fairfield Industries S13: DFT: What is It, and How Does It Affect My Design? F3: An Automated Model-Based Heuristic Approach to PCB Assembly Connectivity Analysis Speaker: Jason Wright, Celestica 11 am – 7 pm Speaker: Gary Ferrari, FTG Circuits S14: Crosstalk and Terminators Speaker: Robert Hanson, Americom Seminars 1:30 pm – 5 pm EXHIBITS OPEN 12 noon – 2 pm 3-DAY TECHNICAL CONFERENCE COURSES S15: Differential Signaling – Tradeoffs for Optimization of Signal Quality and Routing Speaker: Robert Hanson, Americom Seminars LUNCH ON THE SHOW FLOOR 1 pm – 2 pm FREE TECHNICAL SESSION F4: Death of a PCB Salesman Speaker: Greg Papandrew, Bare Board Group 1 pm – 2:30 pm S16: Implementing Advanced Technologies: How to Achieve Success Within Your Organization Speaker: Mike Fitts, Plexus S17: How to Measure Power Distribution Networks on PCBs? Speaker: Istvan Novak, Sun Microsystems FREE TECHNICAL SESSION F5: The Designers Guide to PCB Fabrication Speaker: James Hofer, Accurate Circuit Engineering 2 pm – 4 pm S18: Designing for Asian Fabrication and Lowest Cost Speaker: Happy Holden, Mentor Graphics FREE TECHNICAL SESSION F6: Top 10 Flex Circuit Questions (and Answers) Speakers: Mark A. Verbrugge and Mark Finstad, Minco Products 3 pm – 4 pm FRIDAY, MAY 1 8 am – 10 am REGISTRATION OPEN 9 am – 5 pm FREE TECHNICAL SESSION F7: Avoiding High-Speed Design Mistakes: A Survivor Tells All Speaker: Tim Coyle, Signal Consulting Group 5 pm – 7 pm PROFESSIONAL DEVELOPMENT CERTIFICATE COURSES T5: Design Challenges with HDI/Microvias Including Hands-On Design Speakers: Happy Holden, Mentor Graphics, and Mike Fitts, Plexus RECEPTION ON EXHIBIT FLOOR T6: Everything You Need to Know About Bypassing, Including BGAs Speaker: Robert Hanson, Americom Seminars T7: Control of EMI, Noise and Crosstalk in PCBs Speaker: Rick Hartley, L-3 Communications, Avionics Systems T8: PCB Layout for Signal Integrity, EMI and High Speed Speaker: Susy Webb, Fairfield Industries 12 pm – 1 pm PROFESSIONAL DEVELOPMENT ATTENDEE LUNCH 3
Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - February 2009 Printed Circuit Design & Fab - February 2009 Contents Our Line Market Watch Around the World Happenings ROI Tip Jar BGA Bulletin Interconnect Strategies Final Finsh Forum Defects Database Embedded Active Components In Multilayer LCP Packages Simulation: The Need for Speed Advanced Registration Systems The DC Design Squeeze Ad Index Do You Really Want a Better Autorouter? Designing With Conductive Materials, Part 1 Off th eShelf Marketplace On the Forefront Printed Circuit Design & Fab - February 2009 Printed Circuit Design & Fab - February 2009 - (Page Intro) Printed Circuit Design & Fab - February 2009 - Printed Circuit Design & Fab - February 2009 (Page Cover1) Printed Circuit Design & Fab - February 2009 - Printed Circuit Design & Fab - February 2009 (Page Cover2) Printed Circuit Design & Fab - February 2009 - Printed Circuit Design & Fab - February 2009 (Page 1) Printed Circuit Design & Fab - February 2009 - Contents (Page 2) Printed Circuit Design & Fab - February 2009 - Contents (Page 3) Printed Circuit Design & Fab - February 2009 - Our Line (Page 4) Printed Circuit Design & Fab - February 2009 - Our Line (Page 5) Printed Circuit Design & Fab - February 2009 - Market Watch (Page 6) Printed Circuit Design & Fab - February 2009 - Market Watch (Page 7) Printed Circuit Design & Fab - February 2009 - Around the World (Page 8) Printed Circuit Design & Fab - February 2009 - Around the World (Page 9) Printed Circuit Design & Fab - February 2009 - Around the World (Page 10) Printed Circuit Design & Fab - February 2009 - Around the World (Page 11) Printed Circuit Design & Fab - February 2009 - Happenings (Page 12) Printed Circuit Design & Fab - February 2009 - Happenings (Page 13) Printed Circuit Design & Fab - February 2009 - ROI (Page 14) Printed Circuit Design & Fab - February 2009 - Tip Jar (Page 15) Printed Circuit Design & Fab - February 2009 - BGA Bulletin (Page 16) Printed Circuit Design & Fab - February 2009 - BGA Bulletin (Page P1) Printed Circuit Design & Fab - February 2009 - BGA Bulletin (Page P2) Printed Circuit Design & Fab - February 2009 - BGA Bulletin (Page P3) Printed Circuit Design & Fab - February 2009 - BGA Bulletin (Page P4) Printed Circuit Design & Fab - February 2009 - BGA Bulletin (Page 17) Printed Circuit Design & Fab - February 2009 - Interconnect Strategies (Page 18) Printed Circuit Design & Fab - February 2009 - Interconnect Strategies (Page 19) Printed Circuit Design & Fab - February 2009 - Final Finsh Forum (Page 20) Printed Circuit Design & Fab - February 2009 - Defects Database (Page 21) Printed Circuit Design & Fab - February 2009 - Embedded Active Components In Multilayer LCP Packages (Page 22) Printed Circuit Design & Fab - February 2009 - Embedded Active Components In Multilayer LCP Packages (Page 23) Printed Circuit Design & Fab - February 2009 - Embedded Active Components In Multilayer LCP Packages (Page 24) Printed Circuit Design & Fab - February 2009 - Embedded Active Components In Multilayer LCP Packages (Page 25) Printed Circuit Design & Fab - February 2009 - Simulation: The Need for Speed (Page 26) Printed Circuit Design & Fab - February 2009 - Simulation: The Need for Speed (Page 27) Printed Circuit Design & Fab - February 2009 - Simulation: The Need for Speed (Page 28) Printed Circuit Design & Fab - February 2009 - Simulation: The Need for Speed (Page 29) Printed Circuit Design & Fab - February 2009 - Advanced Registration Systems (Page 30) Printed Circuit Design & Fab - February 2009 - Advanced Registration Systems (Page 31) Printed Circuit Design & Fab - February 2009 - Advanced Registration Systems (Page 32) Printed Circuit Design & Fab - February 2009 - Advanced Registration Systems (Page 33) Printed Circuit Design & Fab - February 2009 - The DC Design Squeeze (Page 34) Printed Circuit Design & Fab - February 2009 - The DC Design Squeeze (Page 35) Printed Circuit Design & Fab - February 2009 - The DC Design Squeeze (Page 36) Printed Circuit Design & Fab - February 2009 - Ad Index (Page 37) Printed Circuit Design & Fab - February 2009 - Do You Really Want a Better Autorouter? (Page 38) Printed Circuit Design & Fab - February 2009 - Do You Really Want a Better Autorouter? (Page 39) Printed Circuit Design & Fab - February 2009 - Designing With Conductive Materials, Part 1 (Page 40) Printed Circuit Design & Fab - February 2009 - Designing With Conductive Materials, Part 1 (Page 41) Printed Circuit Design & Fab - February 2009 - Designing With Conductive Materials, Part 1 (Page 42) Printed Circuit Design & Fab - February 2009 - Off th eShelf (Page 43) Printed Circuit Design & Fab - February 2009 - Marketplace (Page 44) Printed Circuit Design & Fab - February 2009 - Marketplace (Page 45) Printed Circuit Design & Fab - February 2009 - Marketplace (Page 46) Printed Circuit Design & Fab - February 2009 - Marketplace (Page 47) Printed Circuit Design & Fab - February 2009 - On the Forefront (Page 48) Printed Circuit Design & Fab - February 2009 - On the Forefront (Page Cover3) Printed Circuit Design & Fab - February 2009 - On the Forefront (Page Cover4)
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