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- Contents
- Our Line
- Market Watch
- Around the World
- Happenings
- ROI
- On the Forefront
- Positive Plating
- Final Finish Forum
- IC Package to PCB Co-Design
- Manufacturing Compliance: It’s Your Job
- Dielectric Performance in Lead-Free Assembly
- Optical Waveguide PCB Interconnects
- Designing with High Frequency Laminates
- Electronics as a Solution for Sustainability
- Off the Shelf
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- Ad Index
- Designer Notebook

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- Printed Circuit Design & Fab - February 2009
- Contents
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- Market Watch
- Around the World
- Happenings
- ROI
- Tip Jar
- BGA Bulletin
- Interconnect Strategies
- Final Finsh Forum
- Defects Database
- Embedded Active Components In Multilayer LCP Packages
- Simulation: The Need for Speed
- Advanced Registration Systems
- The DC Design Squeeze
- Ad Index
- Do You Really Want a Better Autorouter?
- Designing With Conductive Materials, Part 1
- Off th eShelf
- Marketplace
- On the Forefront

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- Contents
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- Market Watch
- Around the World
- Happenings
- ROI
- Tip Jar
- BGA Bulletin
- Interconnect Strategies
- Final Finsh Forum
- Defects Database
- Embedded Active Components In Multilayer LCP Packages
- Simulation: The Need for Speed
- Advanced Registration Systems
- The DC Design Squeeze
- Ad Index
- Do You Really Want a Better Autorouter?
- Designing With Conductive Materials, Part 1
- Off th eShelf
- Marketplace
- On the Forefront

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- Contents
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- Around the World
- Happenings
- ROI
- The Signal Doctor
- Positive Plating
- Final Finish Forum
- Making Sense of Laminate Dielectric Properties
- Design and Fab Tips for Improving Solder Mask Registration
- Automating the DDRx Interface Verification Process
- Printed Circuit Design & Fab Annual Buyers Guide: Special Suppliers Section
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- Off the Shelf
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- Around the World
- Happenings
- ROI
- Global Sourcing
- EMC for the Real World
- Interconnect Strategies
- On the Forefront
- Final Finish Forum
- Test and Inspection
- Electronic System Design
- Data Management 101
- Designers Take on Technology Challenges in 2008
- PCB Signal Integrity, Power Integrity and EMC Challenges
- What’s in a Name?
- Ad Index
- PCB Dielectric Materials for High-Speed Applications
- Off the Shelf
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- Market Watch
- Around the World
- Happenings
- ROI
- Global Sourcing
- EMC for the Real World
- Interconnect Strategies
- On the Forefront
- Final Finish Forum
- Test and Inspection
- Electronic System Design
- Data Management 101
- Designers Take on Technology Challenges in 2008
- PCB Signal Integrity, Power Integrity and EMC Challenges
- What’s in a Name?
- Ad Index
- PCB Dielectric Materials for High-Speed Applications
- Off the Shelf
- Marketplace
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- Contents
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- Around the World
- Happenings
- ROI
- Positive Plating
- Ten Tips to Improve Manufacturability
- 3D Chip-Package-Board Modeling
- Improving Circuit Simulation With The Addition Of Real Measurements
- Ad Index
- PCB West: Interview with NBS Design Inc.
- The Influence of Final Finish on Lead-Free Assembly Reliability
- The Lead-free Soldering Challenges for Peelable Resists
- Off the Shelf
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- Contents
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- Market Watch
- Around the World
- Happenings
- ROI
- Positive Plating
- Ten Tips to Improve Manufacturability
- 3D Chip-Package-Board Modeling
- Improving Circuit Simulation With The Addition Of Real Measurements
- Ad Index
- PCB West: Interview with NBS Design Inc.
- The Influence of Final Finish on Lead-Free Assembly Reliability
- The Lead-free Soldering Challenges for Peelable Resists
- Off the Shelf
- Marketplace
- BGA Bulletin

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- Contents
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- Market Watch
- Around the World
- Happenings
- Test and Inspection
- ROI
- Tip Jar
- Interconnect Strategies
- Final Finish Forum
- The New Wave in High-Speed Modeling
- The PCB Design Library
- Mixed Signal Design Considerations
- Modeling Conductor Surface Roughness
- Copper Erosion: The Influence of Metallurgy on Copper Dissolution
- The Wave of the Future
- Ad Index
- Building a Profitable Niche
- Marketplace
- Off the Shelf
- BGA Bulletin

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- Around the World
- Happenings
- ROI
- Positive Plating
- Off the Shelf
- Marketplace
- Ad Index
- EMC for the Real World
- Final Finish Forum
- Design for Green: Laminates
- A Systematic Approach to Increasing Layer Count
- The NTI $100 Million Club 
- Printable Nanocomposites
- BGA Bulletin

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- Contents
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- Market Watch
- Around the World
- Happenings
- ROI
- Positive Plating
- Off the Shelf
- Marketplace
- Ad Index
- EMC for the Real World
- Final Finish Forum
- Design for Green: Laminates
- A Systematic Approach to Increasing Layer Count
- The NTI $100 Million Club 
- Printable Nanocomposites
- BGA Bulletin

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- Contents
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- Market Watch
- Around the World
- Happenings
- ROI
- Tip Jar
- Software Performance
- Interconnect Strategies
- Final Finish Forum
- Product Development Challenges in a Global Market
- Innovative Modeling Supports Co-Design of the Power Supply Chain, Part 2
- Low-Loss Fluoropolymer Copper Clad Laminate
- Qualifying PCBs Outsourced in Asia
- Copper Plating and Microvia Fill for Advanced PCBs
- Off the Shelf
- Marketplace
- Ad Index
- BGA Bulletin

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- PCB West Brochure 2008
- Free Special Events
- Travel Information
- Registration Information
- Schedule-At-A-Glance
- Professional Development Certificate Program
- 3-Day Technical Conference Program
- Speaker Biographies

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- Contents
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- Market Watch
- Around the World
- Happenings
- ROI
- Tip Jar
- Software Performance
- Interconnect Strategies
- Final Finish Forum
- Product Development Challenges in a Global Market
- Innovative Modeling Supports Co-Design of the Power Supply Chain, Part 2
- Low-Loss Fluoropolymer Copper Clad Laminate
- Qualifying PCBs Outsourced in Asia
- Copper Plating and Microvia Fill for Advanced PCBs
- Off the Shelf
- Marketplace
- Ad Index
- BGA Bulletin

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- Contents
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- Market Watch
- Around the World
- Happenings
- ROI
- Final Finish Forum
- On the Forefront
- Positive Plating
- The Cost of Advancing Technology
- Solving System Level Thermal Management Challenges
- Innovative Modeling Supports Co-Design of the Power Supply Chain Part 1
- "Warm" Manufacturing Heats Up
- Greener PCB Coatings
- Environmentally Friendly Digital Inkjet Solder Mask Printing
- Off the Shelf
- Marketplace
- Ad Index
- BGA Bulletin

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- Contents
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- Market Watch
- Around the World
- Happenings
- ROI
- Tip Jar
- Interconnect Strategies
- Final Finish Forum
- DFA/DFT
- Signal Integrity
- From the Field
- DFA
- Fab Basics
- Drill
- Off the Shelf
- Marketplace
- Ad Index
- BGA Bulletin

]]>Printed Circuit Design & Fab - June 2008 - Digital Edition - ONLINE NOW!Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - June 2008http://www.nxtbook.com/nxtbooks/upmg/pcdf-design_200806/index.phpTue, 27 May 2008 12:30:06 -0700http://www.nxtbook.com/nxtbooks/upmg/pcdf-design_200806/index.php
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- Around the World
- Happenings
- ROI
- Tip Jar
- Interconnect Strategies
- Final Finish Forum
- DFA/DFT
- Signal Integrity
- From the Field
- DFA
- Fab Basics
- Drill
- Off the Shelf
- Marketplace
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- Contents
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- Market Watch
- Around the World
- Happenings
- ROI
- EMC For the Real World
- PCB East Conference Brochure
- Positive Plating
- Don't Let your Signals Stub Their Toes
- Improve PCB Layout With Skill Utility Programs
- The Next Generation Design Tool Challenge
- Thermally Conductive Microwave Materials
- PCB Dielectric Degradation in Lead-Free Assembly Applications
- A Tale of Two Trade Shows
- Eliminating Board Defects
- Off the Shelf
- Marketplace
- Ad Index
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- Contents
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- Market Watch
- Around the World
- Happenings
- ROI
- Tip Jar
- Interconnect Strategies
- Positive Plating
- Improving Fabrication Yields by Design
- Solve Design Problems with Signal Integrity Optimization
- Laser Direct Imaging Made Easy
- Troubleshooting the Innerlayer Process
- SIPS Give More to Moore
- Off the Shelf
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- Around the World
- Happenings
- ROI
- EMC for the Real World
- Positive Plating
- FPGA/PCB Co-design Increases Fabrication Yields
- Optoelectronics Comes of Age, Part 2
- Implementation of Buried Capacitance in High-Speed Designs
- Ad Index
- Improved Innerlayer Bonding for Sequential Lamination
- Off the Shelf
- Marketplace
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- Contents
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- Happenings
- ROI
- Tip Jar
- Interconnect Strategies
- IC/PCB Co-Design
- Modeling
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- Trade Shows
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- Contents
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- Market Watch
- Around the World
- Happenings
- ROI
- PTH Reliability: Designing to Improve PTH Reliability
- EMC for the Real World
- PTH Reliability: The Survival and Long-Term Reliability of Lead-Free PCBs
- iNEMI's Emerging Technologies: Research Priorities for the Electronics Industry
- Printed Circuit Design & Fab Annual Buyers Guide
- Special Suppliers Section
- Guide to Products and Services
- Off the Shelf: Designcon Preview
- Marketplace
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- Contents
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- Market Watch
- Around the World
- Happenings
- ROI
- 2007 PCB Designer Salary Survey
- Interconnect Strategies
- Positive Plating
- RF Design
- Ad Index
- Noise Reduction
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- Happenings
- ROI
- Packaging
- HDI Design and Fab
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- Design Tools
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