Printed Circuit Design & Fab - November 2007 - (Page 19)

FIGURE 5. Inter-package stand-off of PoP using solder balls only versus µPILR with solder. Inclusion of µPILR increases joint stand-off. infrastructures. As these technologies mature and gain broader adoption, they will serve as the catalyst to enable future innovation in the converging mobile devices market. PCD&F Ed. – In a follow up to this article, Printed Circuit Design & Fab will publish the data generated from the daisy-chain, board-level reliability testing when it becomes available. MANISHA SHARMA is senior product marketing manager, Tessera Inc. She can be reached at msharma@tessera.com. FIGURE 6. SEM picture of a 0.125 mm µPILR copper pin surrounded by solder to form and interconnect with a stand-off of 0.540 mm. A leader in electronic and product design services. Specializing in Rapid Prototype Design Fab, and Assembly. We have a proven track record for turning concepts into products quickly and accurately. Design FAB Assembly Product Design Services Prototype to Production: Engineering Schematic Capture PCB Layout to the pad opening on the top interface of the bottom package. The total solder content can be optimized to achieve the required standoff for the clearance needed. Thus, surface-mount assembly can utilize existing processes, materials and equipment without incurring additional capital expenses. Tool Sets Allegro Concept Capture-CIS Expedition DxDesigner PADs Logic PADs Layout Cadstar Sch & PCB Conclusion Looking ahead, logic IC packaging will reduce interconnect pitch from the current 0.5 mm to 0.4 mm, driving technology capability toward higher I/Os and/or smaller packages. The smaller overall package size results in a lower I/O count for the memory interface at the current 0.65-mm pitch. Driving the memory module to 0.5-mm pitch will either maintain or increase the I/O count. However, 0.5-mm pitch standoff between the logic and memory interface will increase the risks and costs with the need to reduce thickness within the logic arena. Technologies of this type are being introduced to the market to allow for finer pitch with the ability to control solder standoff, while using existing assembly and surface-mount NOVEMBER 2007 Now Serving Customers Coast to Coast NJ Design Center, Morganville, NJ (732) 972-0247 TN Design Center, Crossville, TN (931) 788-6312 CA Design Center, Sunnyvale, CA 1 (877) 247-CADP (2237) Visit us on the web www.cadpartsusa.com PRINTED CIRCUIT DESIGN & FAB 19 http://www.cadpartsusa.com http://www.cadpartsusa.com http://www.cadpartsusa.com

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Printed Circuit Design & Fab - November 2007

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