Printed Circuit Design & Fab - November 2007 - (Page 2)

NOVEMBER 2007 • VOL. 24 • NO. 11 FEATURES Emerging 3-D build-up techniques and HDI board cross section. Images courtesy of Mentor Graphics 16 PACKAGING A New Approach for Finer Pitch Package-on-Package in Mobile Devices µPILR technology can reduce the standoff between the PCB and the bottom package and increase mechanical board-level reliability, improving drop-test performance. by MANISHA SHARMA POINT OF VIEW 4 20 HDI DESIGN AND FAB OUR LINE Fab futures. HDI VIA STRUCTURES EFFECT ON PCB DESIGN FLEXIBILITY, CONSTRAINTS AND COST Microvias are more reliable than through holes, so adding HDI to the design can improve reliability and reduce cost. by HAPPY HOLDEN 27 PLATING Kathy Nargi-Toth 14 ROI To exceed customer expectations, understand your customers’ values and focus on customers who share a common vision. The Fluid Mechanic Modeling of PCB Plating Solutions Aspect ratio is important in defining the flow rate through a hole, but hole diameter and the agitation speed are equally significant. by J. LEE PARKER 32 DESIGN TOOLS Peter Bigelow 48 ECAD-MCAD Design Integration THE SIGNAL DOCTOR Approximating loop inductance can point out the best design features to lower power return path inductance. As design disciplines converge, the ability to display, exchange and work in 3D will become an essential part of the electronic product development process. by ROB EVANS 36 METRIC DESIGN Dr. Eric Bogatin Metric Pitch BGA and Micro BGA Routing Solutions For designers, working with metric units increases performance and overall quality. by TOM HAUSHERR DEPARTMENTS 6 8 MARKET WATCH AROUND THE WORLD 12 42 HAPPENINGS PRODUCTRONICA PRODUCT PREVIEW 44 47 MARKETPLACE AD INDEX ONLINE EXCLUSIVES pcdandf.com Visit our Web site for news, products, extra features and columns, and more. Circuits Assembly Online BETTER MANUFACTURING circuitsassembly.com Value for Money THE FLEX MARKET TPCA review. Methods for dispassionately narrowing your supplier list. by PETER GRUNDY REFLOW SOLDERING Dominique Numakura Creating Ideal Solder Joints Reflow soldering is a superset of an accurate thermal profile. A poorly devised profile can have devastating (read: expensive) repercussions. Same goes for the stencil. by ZULKI KHAN POSTMASTER: Send address changes to PRINTED CIRCUIT DESIGN & FAB, P.O. Box 35646, Tulsa, OK 74153-0646 http://circuitsassembly.com http://pcdandf.com

Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - November 2007

Printed Circuit Design & Fab - November 2007 Contents Our Line Market Watch Around the World Happenings ROI Packaging HDI Design and Fab Plating Design Tools Metric Design Productronica Product Preview Marketplace Ad Index The Signal Doctor

Printed Circuit Design & Fab - November 2007

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