Printed Circuit Design & Fab - November 2007 - (Page 21)

Thermo Scientific NITON XL3 Series RoHS Analyzers • • • • • Fast, reliable, nondestructive elemental analysis Revolutionary small-spot focus for isolation and screening of small components Quantifies total Pb, Cd, Hg, Cr, Br and more in seconds Integrated color CCD camera and sample imaging system VIP™ tilting color touch-screen display for easy viewing of result USA Billerica, MA USA Tel: +1 978 670-7460 niton@thermofisher.com Europe Munich, Germany Tel: +49 89 3681 380 niton.eur@thermofisher.com The HDI Vintage Chart HDI technologies in use today are comprised of three factors: the dielectric materials, the methods of interstitial via hole (IVH) formation and the method of metallization of the Z-axis via connections. Twenty-one different HDI processes are either currently in use or have been used recently, as seen in FIGURE 2. NOVEMBER 2007 Asia Central, Hong Kong Tel: +852 2869 6669 niton.asia@thermofisher.com Sales & Service Worldwide www.thermo.com/niton Part of Thermo Fisher Scientific PRINTED CIRCUIT DESIGN & FAB *Market position statements are based on publicly available information as well as private sources. Thermo Fisher does not endorse these sources as being accurate, comprehensive or complete with regard to product, market size or share. density changes is with the Interconnect Technology Map, FIGURE 1. To describe the component complexity of an assembly, the total component connections (I/Os), including both sides of an assembly as well as edge fingers or contacts, are divided by the total number of components of the assembly. The resulting average leads (I/Os) per part provide the X-axis of the chart. As ICs become more complex and their I/Os increase, this number naturally goes up. When the chart is used to describe surface-mount assemblies, the Y-axis describes how complex it is to assemble the board by the number of components per square inch or per square centimeter. This is component density. As the parts become smaller and closer together, or the substrates get smaller, this number naturally goes up. A second assembly measure is average leads (I/Os) per square inch or per square centimeter. This is the X-axis multiplied times the Y-axis. By charting products of a particular type over time, an analysis will show how the interconnect technology is changing, its rate of change and the direction of those changes. An example is given in Figure 1. The evolution of this board as a 16-layer multilayer PCB (a. & b.) to a 12-layer sequentially laminated MCM-L with blind and buried drilled vias (b.+) to its final form as an 8-layer HDI with sequential build-up microvias (c.) is seen in Figure 1. The area called the Region of Advanced Technologies is where calculations and data have shown that it is necessary to have a blind and buried via structure. Therefore, this is the through-hole barrier or wall of HDI! Cross this, and it now becomes cost effective to use HDI. Move too far, and it becomes a necessity. There are eight different general dielectric materials currently being used or used in recent HDI processes. IPC slash sheets such as IPC-4101B and IPC-4104A cover many of these, but many are not yet specified by IPC standards. These are: ■ Photosensitive liquid dielectrics ■ Photosensitive dry-film dielectrics ■ Polyimide flexible film ■ Thermally cured dry films Thermally cured liquid dielectrics Resin coated copper foil (RCC) ■ Conventional FR-4 cores and prepregs ■ Thermoplastics. There are seven different methods of forming the IVHs used in either current or past HDI processes. Laser drilling is the most prominent, but the other six come into use also: 1. Photo process to define vias in ■ ■ Individual Component Analysis ©2007 Thermo Fisher Scientific Inc. All rights reserved. All trademarks are the property of Thermo Fisher Scientific Inc. and its subsidiaries. Incoming Material Screening Pb-free Veriﬁcation The World’s #1 RoHS Compliance Screening Tools* 21 http://www.thermo.com/niton http://www.thermo.com/niton

Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - November 2007

Printed Circuit Design & Fab - November 2007 Contents Our Line Market Watch Around the World Happenings ROI Packaging HDI Design and Fab Plating Design Tools Metric Design Productronica Product Preview Marketplace Ad Index The Signal Doctor

Printed Circuit Design & Fab - November 2007

For optimal viewing of this digital publication, please enable JavaScript and then refresh the page. If you would like to try to load the digital publication without using Flash Player detection, please click here.