Printed Circuit Design & Fab - November 2007 - (Page 40) VIA-IN-LAND TECHNOLOGY BGA Ball Size: 0.15 BGA Land Dia: 0.275 Hole Size: 0.15 Thermal Relief Required Plane Clearance: 0.425 Solder Mask: 1:1 scale TRACE/SPACE & GRID DATA Trace Width: 0.075 Trace/Trace Space: 0.075 Trace/Via Space: 0.075 Trace/BGA Land: 0.075 Routing Grid: 0.05 Part Place Grid: 1 FIGURE 9. A collapsing 0.5-mm pitch BGA. FIGURE 14. Single trace between vias. FIGURE 10. Plated, filled and capped BGA land. FIGURE 11. Solder lands for BGA components. FIGURE 15. Double trace between vias. FIGURE 12. Top view of land illustrating increase of effective land diameter due to trace connections. FIGURE 13. Cross-sectional view of land with solder ball joint illustrating the solder wetting down the edge of the land with solder mask relief away from the land edge. 40 FIGURE 16. Controlled impedance, differential pairs for a 1mm pitch BGA. NOVEMBER 2007 PRINTED CIRCUIT DESIGN & FAB
Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - November 2007 Printed Circuit Design & Fab - November 2007 Contents Our Line Market Watch Around the World Happenings ROI Packaging HDI Design and Fab Plating Design Tools Metric Design Productronica Product Preview Marketplace Ad Index The Signal Doctor Printed Circuit Design & Fab - November 2007 Printed Circuit Design & Fab - November 2007 - Printed Circuit Design & Fab - November 2007 (Page Cover1) Printed Circuit Design & Fab - November 2007 - Printed Circuit Design & Fab - November 2007 (Page Cover2) Printed Circuit Design & Fab - November 2007 - Printed Circuit Design & Fab - November 2007 (Page 1) Printed Circuit Design & Fab - November 2007 - Contents (Page 2) Printed Circuit Design & Fab - November 2007 - Contents (Page 3) Printed Circuit Design & Fab - November 2007 - Our Line (Page 4) Printed Circuit Design & Fab - November 2007 - Our Line (Page 5) Printed Circuit Design & Fab - November 2007 - Market Watch (Page 6) Printed Circuit Design & Fab - November 2007 - Market Watch (Page 7) Printed Circuit Design & Fab - November 2007 - Around the World (Page 8) Printed Circuit Design & Fab - November 2007 - Around the World (Page 9) Printed Circuit Design & Fab - November 2007 - Around the World (Page 10) Printed Circuit Design & Fab - November 2007 - Around the World (Page 11) Printed Circuit Design & Fab - November 2007 - Happenings (Page 12) Printed Circuit Design & Fab - November 2007 - Happenings (Page 13) Printed Circuit Design & Fab - November 2007 - ROI (Page 14) Printed Circuit Design & Fab - November 2007 - ROI (Page 15) Printed Circuit Design & Fab - November 2007 - Packaging (Page 16) Printed Circuit Design & Fab - November 2007 - Packaging (Page 16A) Printed Circuit Design & Fab - November 2007 - Packaging (Page 16B) Printed Circuit Design & Fab - November 2007 - Packaging (Page 17) Printed Circuit Design & Fab - November 2007 - Packaging (Page 18) Printed Circuit Design & Fab - November 2007 - Packaging (Page 19) Printed Circuit Design & Fab - November 2007 - HDI Design and Fab (Page 20) Printed Circuit Design & Fab - November 2007 - HDI Design and Fab (Page 21) Printed Circuit Design & Fab - November 2007 - HDI Design and Fab (Page 22) Printed Circuit Design & Fab - November 2007 - HDI Design and Fab (Page 23) Printed Circuit Design & Fab - November 2007 - HDI Design and Fab (Page 24) Printed Circuit Design & Fab - November 2007 - HDI Design and Fab (Page 24A) Printed Circuit Design & Fab - November 2007 - HDI Design and Fab (Page 24B) Printed Circuit Design & Fab - November 2007 - HDI Design and Fab (Page 24C) Printed Circuit Design & Fab - November 2007 - HDI Design and Fab (Page 24D) Printed Circuit Design & Fab - November 2007 - HDI Design and Fab (Page 25) Printed Circuit Design & Fab - November 2007 - HDI Design and Fab (Page 26) Printed Circuit Design & Fab - November 2007 - Plating (Page 27) Printed Circuit Design & Fab - November 2007 - Plating (Page 28) Printed Circuit Design & Fab - November 2007 - Plating (Page 29) Printed Circuit Design & Fab - November 2007 - Plating (Page 30) Printed Circuit Design & Fab - November 2007 - Plating (Page 31) Printed Circuit Design & Fab - November 2007 - Design Tools (Page 32) Printed Circuit Design & Fab - November 2007 - Design Tools (Page 33) Printed Circuit Design & Fab - November 2007 - Design Tools (Page 34) Printed Circuit Design & Fab - November 2007 - Design Tools (Page 35) Printed Circuit Design & Fab - November 2007 - Metric Design (Page 36) Printed Circuit Design & Fab - November 2007 - Metric Design (Page 37) Printed Circuit Design & Fab - November 2007 - Metric Design (Page 38) Printed Circuit Design & Fab - November 2007 - Metric Design (Page 39) Printed Circuit Design & Fab - November 2007 - Metric Design (Page 40) Printed Circuit Design & Fab - November 2007 - Metric Design (Page 41) Printed Circuit Design & Fab - November 2007 - Productronica Product Preview (Page 42) Printed Circuit Design & Fab - November 2007 - Productronica Product Preview (Page 43) Printed Circuit Design & Fab - November 2007 - Marketplace (Page 44) Printed Circuit Design & Fab - November 2007 - Marketplace (Page 45) Printed Circuit Design & Fab - November 2007 - Marketplace (Page 46) Printed Circuit Design & Fab - November 2007 - Ad Index (Page 47) Printed Circuit Design & Fab - November 2007 - The Signal Doctor (Page 48) Printed Circuit Design & Fab - November 2007 - The Signal Doctor (Page Cover3) Printed Circuit Design & Fab - November 2007 - The Signal Doctor (Page Cover4)
For optimal viewing of this digital publication, please enable JavaScript and then refresh the page. If you would like to try to load the digital publication without using Flash Player detection, please click here.