Printed Circuit Design & Fab - November 2007 - (Page 42)

MACHINES MATERIALS TOOLS SYSTEMS SOFTWARE EPOXY HOLE PLUG MATERIAL CONTACT CLEANING EQUIPMENT The CM8 has been robustly engineered to cope with the most demanding production environments and is capable of cleaning a wide range of substrates while the FastPad system is the first automation cleaning system for hand rollers. It removes dry unattached particles down to one micron in size from a wide range of substrates including PCBs, SMT boards, LCDs and flat panels. WHO: Teknek, teknek.com Taiyo America introduces two new versions of its high Tg, low CTE, THP100DX1 single-part, thermally cured epoxy hole plugging ink. THP-100DX1 VF is designed for automated hole plugging equipment and THP-100DX1 SP is formulated for screen or stencil printing applications. THP-100DX1 is platable and has excellent thermal properties. THP-100DX1VF is available in standard bulk packaging and in airfree, pre-filled cartridges for machine plugging applications, and the SP version is packaged in bulk containers. WHO: TaiyoAmerica Inc., taiyo-america.com ULTRA-THIN MATERIAL HANDLING New TouchFree Technology is capable of handling the thinnest materials and finest images. The new Schmid TouchFree Technology will be shown for the first time at the Productronica. According to the company, it handles ultrathin materials down to 25 µm with lines and spaces of 15 µm and smaller. The new line is integrated into a fully automatic loading and unloading concept. Despite the extreme fineness of materials and structures, a remarkable high yield can be attained. WHO: Schmid GmbH + Co., schmid-group.com WHERE: Hall B4, Stand 353 WHERE: Umicore booth, Hall B5, Stand 205 WHERE: Hall B4, Stand 105 LIQUID PHOTOIMAGEABLE ETCH RESIST ELECTROLESS NICKEL/ PALLADIUM/GOLD Pallamerse SMT 2000 electroless nickel, electroless palladium and immersion gold final finish meets a variety of assembly requirements. The process, according to the supplier, is a production proven, universal final finish. It demonstrates superior solder wetting. The process is stable, and the operating system is robust. The resulting deposit is durable, wear resistant and RoHS compliant. WHO: Rohm and Haas, rohmhaas.com WHERE: Hall B4, Stand 205 APR 88 is a new liquid photoimageable etch resist from Atotech. According to the company, it has the sharpest image and the finest resolution available to create precise reproduction of patterns. Product benefits include improved surface hardness with a tack-free surface that allows for stacking over 100 cores without sticking or marring. It demonstrates imaging performance capabilities below 25 µm with sharp definition and high photo contrast. It also develops quickly and cleanly at low temperatures for ease of use. WHO: Atotech Deutschland GmbH, atotech.com SOLDER MASK REMOVER Magnastrip 600 HF developed by RBP Chemical Technology, is , a new solder mask remover specially designed to be compatible with halogen-free laminates. Conventional solder mask removers attack the buttercoat, exposing the glass weave in the laminate. Magnastrip 600 HF removes cured liquid photoimageable solder masks without damage to the laminate. Magnastrip 600 HF runs at a low temperature (75˚C), while stripping most masks quickly (30 to 75 minutes) and sustaining a long bath life, for reduced operating costs. WHO: RBP Chemical, rbpchemical.com WHERE: Hall B3, Stand 105 WHERE: Hall B3, Stand 536 42 PRINTED CIRCUIT DESIGN & FAB NOVEMBER 2007 http://taiyo-america.com http://schmid-group.com http://teknek.com http://rohmhaas.com http://atotech.com http://rbpchemical.com

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Printed Circuit Design & Fab - November 2007 Contents Our Line Market Watch Around the World Happenings ROI Packaging HDI Design and Fab Plating Design Tools Metric Design Productronica Product Preview Marketplace Ad Index The Signal Doctor

Printed Circuit Design & Fab - November 2007

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