Printed Circuit Design & Fab - December 2007 - (Page 9)

EDITED BY KATHY NARGI-TOTH AROUND THE WORLD Occam Development Partners SAN JOSE, CA – At the First Occam Handheld Device Sales Continue to Drop FRAMINGHAM, MA – The worldwide market for handheld devices posted its fifteenth consecutive quarter of decline in shipments. According to IDC’s Worldwide Handheld QView, vendors shipped 728,894 handheld devices in 3Q07, approximately 1.5% more than the previous quarter but 39.3% less from the same quarter a year ago. Palm remained the clear leader in the handheld market even though it has not launched a new model for over two years. HP retained the No. 2 position during the quarter, still trailing Palm but far outpacing any of the remaining vendors. Mio has standardized GPS capability on all of its handheld devices. Fujitsu-Siemens climbed back into the top five rankings after a one quarter hiatus, and stayed far ahead of the remaining vendors to claim the No. 4 spot as its own. Sharp narrowly stayed ahead of a crowded group of other vendors to take the number five spot during the quarter, and suffered the largest yearon-year decline in the group. Process Developers Meeting on Oct. 17, the first three agreements for the development of the Occam process were established. Companies committing to develop processes and work with interested OEMs to produce Occam products include microelectronics assembly company Promex Industries, PCB fabricator Micropress, and Hunter Technology Group. Dick Otte, president of Promex stated, “We are just completing our first set of Occam process manufacturing runs … we’re excited about joining our Occam Process partners … and utilizing Occam to broaden our microelectronic assembly services.” “We want to be the Occam Process leader in South America,” said Gilmar Aparecido de Souza, president of Micropress, located in Sao Paulo, Brazil. “With over 2,000 customers in Brazil and throughout South America, we want to drive the Occam Process into our market … we will have our first Occam Process ‘fabsemblies’ completed within a few months.” Compeq Sees Record October TAIPAI, TAIWAN – Sales of Compeq’s handset printed circuit boards and rigidflex PCBs in November were down. October was a record month with revenues surpassing the record NT$2.05 billion (US$63.32 million) posted in December 2006. Compeq’s third-quarter shipments of handset HDI PCBs totaled almost 40 million units, up 20%. This increases comes from OEMs like Nokia, Motorola, and Compal Communications. The growth in HDI continues as fourth-quarter HDI shipments are expected to increase 25% sequentially to 50 million units. HDI PCB shipments started the year off slow and for 2007 will only reach 150 million units, down 20% from 190 million units manufactured in 2006. Compeq’s sales for the first three quarters totaled NT$11.73 billion, with a margin of 9.17%. Net income was NT$491 million, down 42.44% compared to the same period of 2006. Mentor Teams Up With Non-Profit WILSONVILLE, ORE – Mentor Graph- New iNEMI Guide to Lead-Free Manufacturing HERNDON, VA – The International Electronics Manufacturing Initiative announced publication of Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing. The book, published by Wiley-IEEE Press, is based on the results of iNEMI’s six years of study into lead-free electronics and covers implementation issues of Pb-free solder into board assembly, iNEMI says. “The iNEMI book is the first practical, primary reference to cover lead-free solder assembly, as well as the analysis and reasoning behind the selection of tin-silver-copper as the recommended lead-free solder,” said Jim McElroy, iNEMI CEO. “Data from several large reliability studies, including rework on standard and large boards, demonstrated the manufacturability of the recommended solder.” The book features chapters by industry experts on lead-free processing and covers such topics as solder material properties, reliability testing, lead-free rework and tin whisker mitigation strategies. The 472-page book sells for $99.95 and can be purchased through the Wiley-IEEE Press website at wiley.com/WileyCDA/WileyTitle/productCd0471448877. ics Corp. has joined the Multicore Association consortium as an executive board member. The Multicore Association is a global non-profit organization that supports the multicore ecosystem including vendors of processor IP, multicore chips, operating systems, hardware design and software development tools. The Multicore Association is focused on developing standards that help speed time to market for products that involve these various multicore implementations. DECEMBER 2007 PRINTED CIRCUIT DESIGN & FAB 9 http://wiley.com/WileyCDA/WileyTitle/productCd-0471448877 http://wiley.com/WileyCDA/WileyTitle/productCd-0471448877

Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - December 2007

Printed Circuit Design & Fab - December 2007 Contents Our Line Market Watch Around the World Happenings ROI 2007 PCB Designer Salary Survey Interconnect Strategies Positive Plating RF Design Ad Index Noise Reduction Supply Chain DfM Off the Shelf Marketplace The Signal Doctor

Printed Circuit Design & Fab - December 2007

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