Printed Circuit Design & Fab - January 2008 - (Page 10)

AROUND THE WORLD in BRIEF Nuvation Opens Electronics Design Center in Shanghai, China. SAN JOSE – Nuvation announced today that it has opened a design center in Shanghai, China. The company reports that the new design center will increase the company’s offshore capabilities, localize design for manufacturing, and allow access to the Chinese marketplace. “Nuvation has always been recognized by our customers for engineering excellence in new product development from concept to production, stated Michael Worry, CEO. ” “We are thrilled with the talent joining our Shanghai team and are looking forward to rapid growth in this facility. ” Hanzas Elektronika Selects Valor’s vPlan. YAVNE, ISRAEL – Hanzas Elektronika has chosen Valor Computerized Systems’ vPlan process engineering software. Hanzas will use the tool in its factories in Ogre and Ventspils, Latvia. Financial terms were not disclosed. vPlan synchronizes process engineering, delivering a complete process from CAD to machine, Valor says. vPlan is also said to deliver synchronized manufacturing process definitions to the production floor, while generating machine specific libraries on demand. DIN EN ISO 14001 Certification for Dongguan Somacis Graphic PCB. CHASHAN, CHINA – Dongguan Somacis Graphic PCB announced that its plant has obtained the Environmental Management System certification in accordance with DIN EN ISO 14001:2004. The company reports that certification indicates it has complied with international environmental safety standards in the production of printed circuit boards. Lackwerke Peters Lauded for School Work. KEMPEN, GERMANY – Materials supplier Lackwerke Peters was among four North Rhine companies receiving accolades for exceptional engagement in local schools. The companies were honored for promotion of knowledge in science and mathematics. The awards were presented by Christa Thoben, Minister for Economy, Medium-sized Enterprises and Energy of North RhineWestphalia, and Barbara Sommer, Minister for Schools and Further Education, during a ceremony at parliament. Meiko Finishes Vietnam Expansion TOKYO – Meiko Vietnam Electronics Ltd. Co. has completed construction on a bare board fabrication plant in Ha Tay province, near Hanoi.The company, a subsidiary of Japan’s Meiko Group, received government approval to commence the project last December. It invested a reported $300 million in the development. Meiko also has 12 factories in Japan and three in China’s Hubei Province, where it has also been expanding. HMS Completes 5th Factory LODZ, POLAND – Wet processing equipment maker HMS has completed its fifth factory, located in Lodz. The Lodz II facilities have approximately 2,500 m² of office and manufacturing space, and will begin production Dec. 15. The property has another 20,000 m² available for expansion, HMS says. The factory will manufacture elements of the wet-processing systems for RENA and HMS. The machines will then be completed in the company’s German facilities. Last year, HMS opened its fourth manufacturing facility, in Wykroty, Poland. RENA Sondermaschinenbau GmbH acquired HMS in June. RENA specializes in wet-processing equipment for the solar and semiconductor industry, and has group sales of $150 million, 700 employees and eight factories, HMS reports. SELECTIVE SOLDERING SIPAD Systems Adds Laser-Cut Stencil Capability ALPHARETTA, GA – SIPAD Systems announced today that it has purchased a T-8 fiber laser for stencil manufacturing. “Bringing the process in house just made sense”, said Matt Kehoe. “Faster response and cheaper prices are what keep our customers coming back.” The company will also offer stencil services to the local and SE US markets. SIPAD Systems provides a service for selective solder application (both lead and lead free types) using a patented method to assure planar surfaces on the reflowed solder deposit. After the solder is applied, a tacky flux is added so that the PCB can be assembled directly, without needing a solder paste application at the assembly facility. The process is ideal for short runs, quick turn boards and specialty products. Financial Aid Aspocomp Reaches Debt Restructuring Agreement HELSINKI – Beleagured PWB maker Aspocomp has entered into a debt restructuring agreement with its Finnish bank creditors, the company reports. According to the agreement, installments of Aspocomp’s loans will be postponed. They will now begin this year and end on the year of the execution of the sale and purchase options related to the transactions, and will be concentrated for the last year of the period. The agreement will become effective provided the transactions entered into with Meadville Holdings Ltd. are completed. Once the agreement becomes effective, an annual interest of 2.5% will incur on the loans and will be added to the capital and paid on the year of the execution of the sale and purchase options, at the earliest in 2013. After the transactions and the agreed repayment of loans, the aggregate nominal amount of interest-bearing debt of Aspocomp Group will amount to approximately 51 million euros, of which Finnish debts will make up approximately 35 million euros. Aspocomp Group’s estimated 2008 sales are approximately 40 million euros. 10 PRINTED CIRCUIT DESIGN & FAB JANUARY 2008

Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - January 2008

Printed Circuit Design & Fab - January 2008 Contents Our Line Market Watch Around the World Happenings ROI PTH Reliability: Designing to Improve PTH Reliability EMC for the Real World PTH Reliability: The Survival and Long-Term Reliability of Lead-Free PCBs iNEMI's Emerging Technologies: Research Priorities for the Electronics Industry Printed Circuit Design & Fab Annual Buyers Guide Special Suppliers Section Guide to Products and Services Off the Shelf: Designcon Preview Marketplace Ad Index BGA Bulletin

Printed Circuit Design & Fab - January 2008

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