Printed Circuit Design & Fab - January 2008 - (Page 43) DesignCon Product Preview • Feb. 4-7, Santa Clara, CA MACHINES MATERIALS TOOLS SYSTEMS SOFTWARE EMBEDDED CAPACITANCE MATERIAL New FaradFlex materials for embedded capacitors, the MC25ST (laminate version) and MC25STR (resin coated foil version) are formulated to provide uniform capacitance density (640 pF/cm2) and low loss (0.0096) over a wide frequency range (tested to 10 GHz). Also, the TCC (temperature coefficient of capacitance) is better than +/-4% from -55˚C to +155˚C, enabling tighter tolerance capacitors for PCB and IC packaging. WHO: Oak-Mitsui Technology Inc., oakmitsui.com BACKPLANE CONNECTOR SYSTEM The I-Trac backplane connector system is a standard and orthogonal midplane solution offering high port density and speeds up to 12.5+ Gbps. Enabling some of the largest, densest switches on the market today, I-Trac orthogonal facilitates the transition of differential pairs from daughtercard-to-daughtercard through the midplane, while still maintaining the channel’s signal integrity performance. WHO: Molex Inc., molex.com CRYSTAL OSCILLATOR New synchronized crystal oscillator that offers frequency and phase synchronization, eliminating the need for a master clock. NEL synchronized clock oscilla’s tor is ideal for mixed signal applications where ADC or DAC clocks need to be synchronized in a multi channel environment. The SXO eliminates clock distribution jitter, while providing unlimited scalability and full redundancy. WHO: NEL Frequency Controls, nelfc.com WHERE: BOOTH #803 WHERE: Booth #511 WHERE: Booth #820 HIGH-SPEED CONNECTORS Q2 high speed connectors feature contacts on .635 mm (.025”) pitch with increased insertion depth and integrated guide posts for rugged applications. Performance is up to 7 GHz for dif.5 ferential and 8 GHz for single-ended, depending on stack height and configuration. WHO: Samtec Inc., samtec.com WHERE: Booth #325 ANALYSIS AND VERIFICATION SOLUTION HyperLynx high-speed design analysis and verification tools for virtually any design flow. HyperLynx analyzes signal integrity and delay, eliminates crosstalk, and detects EMI problems early, enabling PCB designers to ”get it right the first time. ” WHO: Mentor Graphics, mentor.com BOOKS ON ELECTRICAL DESIGN Jitter, Noise, and Signal Integrity at HighSpeed, by Mike Peng Li, shows readers how to overcome the biggest challenges in high speed digital design. One of the field’s respected experts, Dr. Li has brought together the latest theory, analysis, methods, and practical applications, demonstrating how to solve JNB and SI problems. Other new books include Timing Analysis and Simulation for Signal Integrity Engineers, Digital Communications Test and Measurement, and Power Integrity Modeling and Design for Semiconductors and Systems. WHO: Prentice Hall Professional, informit.com/ph 3D PLANAR EM MODELING Sonnet Suites Release 11 high frequency 3D planar electromagnetic (EM) software includes a broad band Spice model extractor (bbextract) yielding Pspice, Hspice and Spectre format models for any planar circuitry. bbextract yields a single model, valid and stable from DC to GHz frequencies. Co-Calibrated Port technology removes port discontinuities which lead to unstable broadband Spice extraction models. Direct interfaces exist for Cadence Virtuoso, Agilent ADS and AWR Microwave/Analog Office. WHO: Sonnet Software Inc., sonnetsoftware.com WHERE: Booth #517 HIGH DENSITY CONNECTOR The new XCede Stacker enables parallel board-to-board designs with the same high levels of performance and reliability as the successful XCede backplane system. The XCede Stacker provides this same performance headroom for modular and expansion card interfaces, delivering more bandwidth without the need for costly and time-consuming redesigns down the road. WHO: Amphenol TCS, amphenol-tcs.com WHERE: Booth #842 WHERE: Booth #724 PCB FABRICATION SERVICES Accurate Circuit Engineering is pleased to announce Certification under Mil-P-55110. ACE is a high-tech manufacturer of prototype PCBs that specializes in high layer count, hybrid and high speed designs. “With the addition of 55110 to our Mil-PRF31032 certification, ACE stands ready to supply all sectors of the military and high reliability markets, states James Hofer, ” General Manger at ACE. WHO: Accurate Circuit Engineering, ace-pcb.com CAD LIBRARY TOOLS AND SERVICES PCB Libraries Inc. is dedicated to delivering software tools that automate CAD library construction and eliminate most of the waste of resources associated with the creation of CAD libraries. Its award-winning Land Pattern software has been tested and is used by thousands of users worldwide. The company offers a revolutionary, CADneutral PCB design tool backed by unrivaled responsiveness to customer feedback. WHO: PCB Libraries Inc., PCBLibraries.com WHERE: Booth #105 DESIGN TOOL PIStream will help meet your target impedance by adding/moving capacitors, changing capacitance values, plane shapes, and power/GND plane distances. Transfer Impedance Analysis function will help you reduce noise propagation between aggressor IC and victim IC. Graphic based PIStream is easy to use and offers speedy analysis and improved power integrity. WHO: NEC, nec-nis.co.jp/emistream WHERE: Booth #633 WHERE: Booth #719 WHERE: Booth #713 JANUARY 2008 PRINTED CIRCUIT DESIGN & FAB 43 http://www.oakmitsui.com http://nelfc.com http://molex.com http://samtec.com http://mentor.com http://informit.com/ph http://sonnetsoftware.com http://www.amphenol-tcs.com http://PCBLibraries.com http://ace-pcb.com http://www.emistream.com
Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - January 2008 Printed Circuit Design & Fab - January 2008 Contents Our Line Market Watch Around the World Happenings ROI PTH Reliability: Designing to Improve PTH Reliability EMC for the Real World PTH Reliability: The Survival and Long-Term Reliability of Lead-Free PCBs iNEMI's Emerging Technologies: Research Priorities for the Electronics Industry Printed Circuit Design & Fab Annual Buyers Guide Special Suppliers Section Guide to Products and Services Off the Shelf: Designcon Preview Marketplace Ad Index BGA Bulletin Printed Circuit Design & Fab - January 2008 Printed Circuit Design & Fab - January 2008 - Printed Circuit Design & Fab - January 2008 (Page Cover1) Printed Circuit Design & Fab - January 2008 - Printed Circuit Design & Fab - January 2008 (Page Cover2) Printed Circuit Design & Fab - January 2008 - Printed Circuit Design & Fab - January 2008 (Page 1) Printed Circuit Design & Fab - January 2008 - Contents (Page 2) Printed Circuit Design & Fab - January 2008 - Contents (Page 3) Printed Circuit Design & Fab - January 2008 - Our Line (Page 4) Printed Circuit Design & Fab - January 2008 - Our Line (Page 5) Printed Circuit Design & Fab - January 2008 - Market Watch (Page 6) Printed Circuit Design & Fab - January 2008 - Market Watch (Page 7) Printed Circuit Design & Fab - January 2008 - Around the World (Page 8) Printed Circuit Design & Fab - January 2008 - Around the World (Page 9) Printed Circuit Design & Fab - January 2008 - Around the World (Page 10) Printed Circuit Design & Fab - January 2008 - Around the World (Page 11) Printed Circuit Design & Fab - January 2008 - Happenings (Page 12) Printed Circuit Design & Fab - January 2008 - Happenings (Page 13) Printed Circuit Design & Fab - January 2008 - ROI (Page 14) Printed Circuit Design & Fab - January 2008 - ROI (Page 15) Printed Circuit Design & Fab - January 2008 - PTH Reliability: Designing to Improve PTH Reliability (Page 16) Printed Circuit Design & Fab - January 2008 - PTH Reliability: Designing to Improve PTH Reliability (Page V1) Printed Circuit Design & Fab - January 2008 - PTH Reliability: Designing to Improve PTH Reliability (Page V2) Printed Circuit Design & Fab - January 2008 - PTH Reliability: Designing to Improve PTH Reliability (Page 17) Printed Circuit Design & Fab - January 2008 - PTH Reliability: Designing to Improve PTH Reliability (Page 18) Printed Circuit Design & Fab - January 2008 - PTH Reliability: Designing to Improve PTH Reliability (Page 19) Printed Circuit Design & Fab - January 2008 - EMC for the Real World (Page 20) Printed Circuit Design & Fab - January 2008 - EMC for the Real World (Page 21) Printed Circuit Design & Fab - January 2008 - PTH Reliability: The Survival and Long-Term Reliability of Lead-Free PCBs (Page 22) Printed Circuit Design & Fab - January 2008 - PTH Reliability: The Survival and Long-Term Reliability of Lead-Free PCBs (Page 23) Printed Circuit Design & Fab - January 2008 - PTH Reliability: The Survival and Long-Term Reliability of Lead-Free PCBs (Page 24) Printed Circuit Design & Fab - January 2008 - PTH Reliability: The Survival and Long-Term Reliability of Lead-Free PCBs (Page S1) Printed Circuit Design & Fab - January 2008 - PTH Reliability: The Survival and Long-Term Reliability of Lead-Free PCBs (Page S2) Printed Circuit Design & Fab - January 2008 - PTH Reliability: The Survival and Long-Term Reliability of Lead-Free PCBs (Page S3) Printed Circuit Design & Fab - January 2008 - PTH Reliability: The Survival and Long-Term Reliability of Lead-Free PCBs (Page S4) Printed Circuit Design & Fab - January 2008 - PTH Reliability: The Survival and Long-Term Reliability of Lead-Free PCBs (Page 25) Printed Circuit Design & Fab - January 2008 - PTH Reliability: The Survival and Long-Term Reliability of Lead-Free PCBs (Page 26) Printed Circuit Design & Fab - January 2008 - iNEMI's Emerging Technologies: Research Priorities for the Electronics Industry (Page 27) Printed Circuit Design & Fab - January 2008 - iNEMI's Emerging Technologies: Research Priorities for the Electronics Industry (Page 28) Printed Circuit Design & Fab - January 2008 - iNEMI's Emerging Technologies: Research Priorities for the Electronics Industry (Page 29) Printed Circuit Design & Fab - January 2008 - iNEMI's Emerging Technologies: Research Priorities for the Electronics Industry (Page 30) Printed Circuit Design & Fab - January 2008 - iNEMI's Emerging Technologies: Research Priorities for the Electronics Industry (Page 31) Printed Circuit Design & Fab - January 2008 - Special Suppliers Section (Page 32) Printed Circuit Design & Fab - January 2008 - Special Suppliers Section (Page 33) Printed Circuit Design & Fab - January 2008 - Special Suppliers Section (Page 34) Printed Circuit Design & Fab - January 2008 - Special Suppliers Section (Page 35) Printed Circuit Design & Fab - January 2008 - Guide to Products and Services (Page 36) Printed Circuit Design & Fab - January 2008 - Guide to Products and Services (Page 37) Printed Circuit Design & Fab - January 2008 - Guide to Products and Services (Page 38) Printed Circuit Design & Fab - January 2008 - Guide to Products and Services (Page 39) Printed Circuit Design & Fab - January 2008 - Guide to Products and Services (Page 40) Printed Circuit Design & Fab - January 2008 - Guide to Products and Services (Page 41) Printed Circuit Design & Fab - January 2008 - Guide to Products and Services (Page 42) Printed Circuit Design & Fab - January 2008 - Off the Shelf: Designcon Preview (Page 43) Printed Circuit Design & Fab - January 2008 - Marketplace (Page 44) Printed Circuit Design & Fab - January 2008 - Marketplace (Page 45) Printed Circuit Design & Fab - January 2008 - Marketplace (Page 46) Printed Circuit Design & Fab - January 2008 - Ad Index (Page 47) Printed Circuit Design & Fab - January 2008 - BGA Bulletin (Page 48) Printed Circuit Design & Fab - January 2008 - BGA Bulletin (Page Cover3) Printed Circuit Design & Fab - January 2008 - BGA Bulletin (Page Cover4)
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