Printed Circuit Design & Fab - January 2008 - (Page 47)

BGA Bulletin, continued from p. 48 of cost, signal integrity and routeability. Signal integrity. Although the fabricators continue to improve their processes and produce reliable boards with increasingly smaller features and clearances, maintaining signal integrity at high performance levels usually requires greater spacing between critical nets, especially when attempting to eliminate crosstalk effects at higher speeds. This conflict is exacerbated with high pin-count and dense BGAs. Choosing appropriate layer stackups and via models will not only improve routeability, but signal integrity as well. Power Integrity. Managing power distribution effectively for large pincount BGAs is a challenge and is significantly impacted by the layer stackup. There are methods that can minimize the number decoupling capacitors required, thereby increasing the space available for signal routing. Because of the high number of variables with any PCB design, it is not possible to have a single BGA breakout solution for all. It is possible however, to develop solutions within a reasonable set of variables. PCD&F CHARLES PFEIL is a product marketing director for Mentor Graphics, Systems Design Division. He was the original product architect for Expedition PCB and an inventor of XtremePCB; charles_pfeil@mentor.com. PRINTED CIRCUIT BOARD STIFFENER Large PCB’s require a mechanical stiffener to eliminate warp and bow, also to prevent copper trace damage due to bending, vibration and rough handling. A must for guidance of a PCB into its connector, and for reliable operation afterwards. • Unique aluminum bar shape accepts a screw or rivet anywhere along its length. • Same bar will install on PCB’s with different hole locations. • Eliminates close tolerance requirement between mounting holes. • Can be installed on spacers to clear components, copper traces or wire adds. • Can also function as a Heat Sink or Power/Ground bus. • Visit our web site for dimensions and specifications. COMPUFAB INC. P.O. Box 68, Woodstown, N.J. 08098-0068 ph: (856) 769-9050 • fax: (856) 769-9058 • www.compufab.com Front Panels Circuitronix, a bare PCB provider from China is looking for BUSINESS DEVELOPMENT MANAGERS for We work with your CAD program North America Asia Europe eMail careers@circuitronix.com Quality pert in Service pert in pert in pert in Material Price Please contact us: info@cam-expert.com www.cam-expert.com ADVERTISER INDEX To learn more about the advertisers in this issue, go to pcdandf.com and select “Advertiser Index” in the home page menu. This will provide you with a direct link to the Web site of each advertiser in this index. ADVERTISER Accutrace Bare Board Group Beta Layout PAGE # 44 45 26 23 47 46 47 47 24 19 9 47 3 44 ADVERTISER Front Panel Express Garmin International Imagineering Intercept Technology IPC Expo 2008 PAGE # 46 46 46 22 42 C4 5 45 ADVERTISER PCB East 2008 PCB Shows PCB FAB Express Precision Technologies Sierra Proto Express PAGE # 29 46 45 45 C3 www.efabpcb.com Easy to use instant on-line quoting If you have any questions or need assistance Call Toll Free 1-877-332-2722 or Contact – sales@efabpcb Prototypes thru Production Check out our low prices and save big $ Save more with our Proto-Power Pack Specials! CADParts & Consulting LLC Cam Expert LLC CEPD Inc. Circuitronix LLC Compufab Current Inc. DesignCon 2008 DownStream Technologies eFabPCB EMA Design Automation EzPCB Mentor Graphics – Invent Mentor Graphics – PADS Midwest Accurate Grinding Sierra Proto Express insert opposite 24 Sunstone Circuits Superior Processing Technic Inc. 1 45 21 National Instruments/ C2 Electronics Workbench Group NEC Information Systems Ltd. 7 Online Electronics Operations Technology (OPTEK) OverflyPacific Corp. 44 31 45 Valor Computerized Systems Ltd. insert opposite 16 Virtual PCB 15 Quality PCBs at competitive prices! Let us be your on-line PCB shop Lead free / RoHS finishes available ENIG – Immersion Silver – Immersion Tin – OSP – Lead Free Solder efabpcb is a UL-approved – ISO9001:2000 certified facility The advertising index is published as an additional service. The publisher does not assume any liability for errors or omissions. JANUARY 2008 PRINTED CIRCUIT DESIGN & FAB 47 http://www.compufab.com http://www.cam-expert.com http://www.cam-expert.com http://www.efabpcb.com http://pcdandf.com

Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - January 2008

Printed Circuit Design & Fab - January 2008 Contents Our Line Market Watch Around the World Happenings ROI PTH Reliability: Designing to Improve PTH Reliability EMC for the Real World PTH Reliability: The Survival and Long-Term Reliability of Lead-Free PCBs iNEMI's Emerging Technologies: Research Priorities for the Electronics Industry Printed Circuit Design & Fab Annual Buyers Guide Special Suppliers Section Guide to Products and Services Off the Shelf: Designcon Preview Marketplace Ad Index BGA Bulletin

Printed Circuit Design & Fab - January 2008

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