Printed Circuit Design & Fab - January 2008 - (Page S3) SIERRA CIRCUITS SIERRA CIRCUITS PRESENTS: THE FUTURE PRINTED CIRCUIT BOARD COMPANY. Sierra East Tech Center Sales Office • Formed in June 2007 • Sierra East Tech Center 2500 sf (Atlanta, GA) • Employees: 6 highly trained PCB sales engineers (staffed from the PhotoCircuits closure) • Servicing key east coast customers • Gatekeeper to offshore production partners Sierra Proto Express Sunnyvale, CA • Up to 10 panels typ. • Differential impedance • 2 to 30 layers • Lead-free process • 3/3 Lines/spaces • Sequential lamination • Blind and buried vias • Filled vias • 24 hour – 5 day turn typ. • Hole in pad • Mil spec • Metal core • Carbon paste • Plated edge holes • Milled edges • Heavy copper Sierra Offshore China, Taiwan • Sierra allied with manufacturing companies in Asia. – Five people in China, resident manufacturers’ facilities – Reports to Sierra East Coast Tech Center • Formal qualification procedure for process and products. • Formal schedule for periodic re-certification of process and products. • ISO9001:2000, QS9000/TS16949:2002, UL, IPC Sierra Midwest Chanute, KS • 10 – 40 panels typ. • Controlled impedance • 1 to 12 Layers • Lead-free process • 5/5 Lines/spaces • Mechanical drill • Filled vias • 5 day – 3 week turn typ. • Mil spec • Metal core • Carbon paste • Plated edge hole • Milled edge • Heavy copper Current Manufacturing Technologies • Multilayer Boards, up to 30 layers and 0.250” thick • Materials Include: FR-4 (140TG, 170Tg, 200Tg) Polyimide, GETEK, Rogers 4003, Others Upon Request • Controlled Impedance - (RamBus Capable) • Blind and Buried Vias & Microvias • Carbon Inks, Conductive Epoxies, Filled Holes • Metal Core Boards • Burn-In Boards • Surface Finishes: HASL, White Tin, Tin-Nickel, Hard Gold, Bondable Gold, • Immersion Gold, Immersion Silver, Entek. • Military Certified 55110 – Renewed 2006. Company Technology Drill and Routing Min Drill Size Aspect Ratio Line Width & Space: Standard .0059” 10:1 .002 Controlled .004” 20:1 .00125 All surface finishes available.
Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - January 2008 Printed Circuit Design & Fab - January 2008 Contents Our Line Market Watch Around the World Happenings ROI PTH Reliability: Designing to Improve PTH Reliability EMC for the Real World PTH Reliability: The Survival and Long-Term Reliability of Lead-Free PCBs iNEMI's Emerging Technologies: Research Priorities for the Electronics Industry Printed Circuit Design & Fab Annual Buyers Guide Special Suppliers Section Guide to Products and Services Off the Shelf: Designcon Preview Marketplace Ad Index BGA Bulletin Printed Circuit Design & Fab - January 2008 Printed Circuit Design & Fab - January 2008 - Printed Circuit Design & Fab - January 2008 (Page Cover1) Printed Circuit Design & Fab - January 2008 - Printed Circuit Design & Fab - January 2008 (Page Cover2) Printed Circuit Design & Fab - January 2008 - Printed Circuit Design & Fab - January 2008 (Page 1) Printed Circuit Design & Fab - January 2008 - Contents (Page 2) Printed Circuit Design & Fab - January 2008 - Contents (Page 3) Printed Circuit Design & Fab - January 2008 - Our Line (Page 4) Printed Circuit Design & Fab - January 2008 - Our Line (Page 5) Printed Circuit Design & Fab - January 2008 - Market Watch (Page 6) Printed Circuit Design & Fab - January 2008 - Market Watch (Page 7) Printed Circuit Design & Fab - January 2008 - Around the World (Page 8) Printed Circuit Design & Fab - January 2008 - Around the World (Page 9) Printed Circuit Design & Fab - January 2008 - Around the World (Page 10) Printed Circuit Design & Fab - January 2008 - Around the World (Page 11) Printed Circuit Design & Fab - January 2008 - Happenings (Page 12) Printed Circuit Design & Fab - January 2008 - Happenings (Page 13) Printed Circuit Design & Fab - January 2008 - ROI (Page 14) Printed Circuit Design & Fab - January 2008 - ROI (Page 15) Printed Circuit Design & Fab - January 2008 - PTH Reliability: Designing to Improve PTH Reliability (Page 16) Printed Circuit Design & Fab - January 2008 - PTH Reliability: Designing to Improve PTH Reliability (Page V1) Printed Circuit Design & Fab - January 2008 - PTH Reliability: Designing to Improve PTH Reliability (Page V2) Printed Circuit Design & Fab - January 2008 - PTH Reliability: Designing to Improve PTH Reliability (Page 17) Printed Circuit Design & Fab - January 2008 - PTH Reliability: Designing to Improve PTH Reliability (Page 18) Printed Circuit Design & Fab - January 2008 - PTH Reliability: Designing to Improve PTH Reliability (Page 19) Printed Circuit Design & Fab - January 2008 - EMC for the Real World (Page 20) Printed Circuit Design & Fab - January 2008 - EMC for the Real World (Page 21) Printed Circuit Design & Fab - January 2008 - PTH Reliability: The Survival and Long-Term Reliability of Lead-Free PCBs (Page 22) Printed Circuit Design & Fab - January 2008 - PTH Reliability: The Survival and Long-Term Reliability of Lead-Free PCBs (Page 23) Printed Circuit Design & Fab - January 2008 - PTH Reliability: The Survival and Long-Term Reliability of Lead-Free PCBs (Page 24) Printed Circuit Design & Fab - January 2008 - PTH Reliability: The Survival and Long-Term Reliability of Lead-Free PCBs (Page S1) Printed Circuit Design & Fab - January 2008 - PTH Reliability: The Survival and Long-Term Reliability of Lead-Free PCBs (Page S2) Printed Circuit Design & Fab - January 2008 - PTH Reliability: The Survival and Long-Term Reliability of Lead-Free PCBs (Page S3) Printed Circuit Design & Fab - January 2008 - PTH Reliability: The Survival and Long-Term Reliability of Lead-Free PCBs (Page S4) Printed Circuit Design & Fab - January 2008 - PTH Reliability: The Survival and Long-Term Reliability of Lead-Free PCBs (Page 25) Printed Circuit Design & Fab - January 2008 - PTH Reliability: The Survival and Long-Term Reliability of Lead-Free PCBs (Page 26) Printed Circuit Design & Fab - January 2008 - iNEMI's Emerging Technologies: Research Priorities for the Electronics Industry (Page 27) Printed Circuit Design & Fab - January 2008 - iNEMI's Emerging Technologies: Research Priorities for the Electronics Industry (Page 28) Printed Circuit Design & Fab - January 2008 - iNEMI's Emerging Technologies: Research Priorities for the Electronics Industry (Page 29) Printed Circuit Design & Fab - January 2008 - iNEMI's Emerging Technologies: Research Priorities for the Electronics Industry (Page 30) Printed Circuit Design & Fab - January 2008 - iNEMI's Emerging Technologies: Research Priorities for the Electronics Industry (Page 31) Printed Circuit Design & Fab - January 2008 - Special Suppliers Section (Page 32) Printed Circuit Design & Fab - January 2008 - Special Suppliers Section (Page 33) Printed Circuit Design & Fab - January 2008 - Special Suppliers Section (Page 34) Printed Circuit Design & Fab - January 2008 - Special Suppliers Section (Page 35) Printed Circuit Design & Fab - January 2008 - Guide to Products and Services (Page 36) Printed Circuit Design & Fab - January 2008 - Guide to Products and Services (Page 37) Printed Circuit Design & Fab - January 2008 - Guide to Products and Services (Page 38) Printed Circuit Design & Fab - January 2008 - Guide to Products and Services (Page 39) Printed Circuit Design & Fab - January 2008 - Guide to Products and Services (Page 40) Printed Circuit Design & Fab - January 2008 - Guide to Products and Services (Page 41) Printed Circuit Design & Fab - January 2008 - Guide to Products and Services (Page 42) Printed Circuit Design & Fab - January 2008 - Off the Shelf: Designcon Preview (Page 43) Printed Circuit Design & Fab - January 2008 - Marketplace (Page 44) Printed Circuit Design & Fab - January 2008 - Marketplace (Page 45) Printed Circuit Design & Fab - January 2008 - Marketplace (Page 46) Printed Circuit Design & Fab - January 2008 - Ad Index (Page 47) Printed Circuit Design & Fab - January 2008 - BGA Bulletin (Page 48) Printed Circuit Design & Fab - January 2008 - BGA Bulletin (Page Cover3) Printed Circuit Design & Fab - January 2008 - BGA Bulletin (Page Cover4)
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