Printed Circuit Design & Fab - February 2008 - (Page 12) HAPPENINGS EVENTS FEBRUARY 4-8 DesignCon 2008 Santa Clara Convention Center Santa Clara, CA Contact: designcon.com FACES Global Laminates vice president and sales manager Bruce Hurley has been appointed President. Mr. Hurley has been over seventeen years in the PCB industry and will be overseeing all operations for the Amesbury Massachusetts company. The appointment comes as former president Jack Pattie has moved to Executive Director for the Global Laminates Group of Companies, including GVL in the United Kingdom and Global Laminates West in Southern CA. Innovex named Terry Dauenhauer president and chief executive, replacing Bill Murnane, who will continue as chairman. Altium has appointed Gerry Gaffney senior VP Americas, , based in Altium’s office in the San Diego area. Gaffney’s appointment follows recent hirings of Jay Cao in Shanghai and Anand Shankaran in Sydney. Enthone appointed new managers in Eastern Europe. In Romania, Franz Hoffner has been appointed country manager and Petrisor Popescou has been named sales director. In Slovakia, Mirek Miskech has been appointed country manager and Jozef Gall has been appointed sales representative. Sun Chemical appointed Rudi Lenz as chief executive officer and president, effective January 1, 2008. Dr. Koji Oe, president of Dainippon Ink and Chemicals of Japan, Sun Chemical’s parent company, made the announcement on behalf of the Sun Chemical board of directors. Orbotech announced that Sylvain Pillons has joined the company as VP of sales and Amnon Landman has been appointed customer support director in Europe. Pillons brings to Orbotech his diverse and broad experience in sales and business development. Landman is a 14 year veteran of Orbotech who has a successful track record in both the operational and business sides of the company. 12-13 VIRTUAL PCB ONLINE TRADE SHOW AND CONFERENCE EVENT For information on how to exhibit or to attend this event, please contact Frances Stewart, 678-817-1286, fstewart@upmediagroup.com virtual-pcb.com MARCH 4-5 PCB AUSTIN DESIGN CONFERENCE AND EXHIBITION Holiday Inn Austin Town Lake, Austin, TX Contact: askarbek@upmediagroup.com pcbshows.com 11-12 IPC/JEDEC International Conference on Reliability, Rework and Reapir of Lead-Free Electronics Research Triangle Park, NC LFConf@ipc.com 17-19 Electronic Circuits World Convention 11 Shanghai Everbright Convention and Exhibition International Hotel Shanghai, China Contact: register@cpca.org.cn 18-20 CPCA Show Shanghai New International Expo Center Shanghai, China Contact: ecwc11.com/en/cpcashowhis.asp APRIL 1-3 IPC Printed Circuit Expo, APEX and the Designers Summit Mandalay Bay Resort & Convention Center Las Vegas, NV Contact: goipcshows.org 11-16 PCB EAST Holiday Inn Select & Convention Center Tinley Park, IL Contact: banglin@upmediagroup.com pcbeast.com IT’S A DEAL Optimal Electronics and Calavista Software announced a partnership to expand and improve the capabilities of Optimal’s manufacturing execution system software suite. Financial terms were not disclosed. The suite, Optel, is used in electronics assembly to implement lean manufacturing programs, including scheduling, line balancing, machine programming and optimization, and time and materials management. Qualcomm has acquired San Diego-based software company SoftMax, which specializes in noise reduction technology for mobile phones. The company intends to integrate Softmax’s multi-microphone noise suppression and echo cancellation software into its mobile handsets, Bluetooth headsets, VoIP phones and notebook PCs. IPTE has signed a letter of intent to buy a majority stake in German automation company Platzgummer GmbH, before 12 acquiring it in full. IPTE will take an 80% holding this year and the remaining 20% in 2010. Platzgummer has annual sales of between $11.76-$14.70 million. Two PWB fabricators merged this week, with One Way Circuits Ltd. acquiring Leicester Circuits UK. No financial terms were disclosed. In 2003, One Way Circuits also acquired Circast. Leicester Circuits owner Tony Williams will continue with the company in a consultant role. Scott Williams was named Leicester Circuits managing director and Les Round group technical manager. OM Group Inc. has completed its previously announced acquisition of the electronics businesses from Rockwood Holdings Inc. for approximately $315 million in cash, plus customary post closing adjustments. Included in the transaction is Rockwood’s French elec- tronic chemicals business which was originally subject to a put option that has since been exercised. FiranTechnology Group Corp. announced it has acquired substantially all of the assets from Filtran Microcircuits Inc., a Canadian PCB manufacturer based in Ottawa, Ontario and focused primarily on the manufacture of microwave PCBs for high frequency applications. Filtran had annual revenues of approximately $4,000,000 in 2007. M.E. Baker Co. announced the sale of wet process equipment to Unicircuit of Littleton, CO. These innovative develop, etch, strip, chemical cleaning, chemical milling and alternative oxide lines are designed for processing thin core material at high yields utilizing Baker’s proprietary Via-Head Fluid Delivery and High Performance Etch technologies. FEBRUARY 2008 PRINTED CIRCUIT DESIGN & FAB http://designcon.com http://virtual-pcb.com http://pcbshows.com http://www.ecwc11.com/en/cpcashowhis.asp http://goipcshows.org http://pcbeast.com
Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - February 2008 Printed Circuit Design & Fab - February 2008 Contents Our Line Market Watch Around the World Happenings ROI Tip Jar Interconnect Strategies IC/PCB Co-Design Modeling Design Tools Optical Interconnect Trade Shows Laminate Materials Off the Shelf Marketplace Ad Index BGA Bulletin Printed Circuit Design & Fab - February 2008 Printed Circuit Design & Fab - February 2008 - Printed Circuit Design & Fab - February 2008 (Page Cover1) Printed Circuit Design & Fab - February 2008 - Printed Circuit Design & Fab - February 2008 (Page Cover2) Printed Circuit Design & Fab - February 2008 - Printed Circuit Design & Fab - February 2008 (Page 1) Printed Circuit Design & Fab - February 2008 - Contents (Page 2) Printed Circuit Design & Fab - February 2008 - Contents (Page 3) Printed Circuit Design & Fab - February 2008 - Our Line (Page 4) Printed Circuit Design & Fab - February 2008 - Our Line (Page 5) Printed Circuit Design & Fab - February 2008 - Market Watch (Page 6) Printed Circuit Design & Fab - February 2008 - Market Watch (Page 7) Printed Circuit Design & Fab - February 2008 - Around the World (Page 8) Printed Circuit Design & Fab - February 2008 - Around the World (Page 9) Printed Circuit Design & Fab - February 2008 - Around the World (Page 10) Printed Circuit Design & Fab - February 2008 - Around the World (Page 11) Printed Circuit Design & Fab - February 2008 - Happenings (Page 12) Printed Circuit Design & Fab - February 2008 - Happenings (Page 13) Printed Circuit Design & Fab - February 2008 - ROI (Page 14) Printed Circuit Design & Fab - February 2008 - ROI (Page 15) Printed Circuit Design & Fab - February 2008 - Tip Jar (Page 16) Printed Circuit Design & Fab - February 2008 - Tip Jar (Page 16A) Printed Circuit Design & Fab - February 2008 - Tip Jar (Page 16B) Printed Circuit Design & Fab - February 2008 - Interconnect Strategies (Page 17) Printed Circuit Design & Fab - February 2008 - Interconnect Strategies (Page 18) Printed Circuit Design & Fab - February 2008 - Interconnect Strategies (Page 19) Printed Circuit Design & Fab - February 2008 - IC/PCB Co-Design (Page 20) Printed Circuit Design & Fab - February 2008 - IC/PCB Co-Design (Page 21) Printed Circuit Design & Fab - February 2008 - IC/PCB Co-Design (Page 22) Printed Circuit Design & Fab - February 2008 - IC/PCB Co-Design (Page 23) Printed Circuit Design & Fab - February 2008 - Modeling (Page 24) Printed Circuit Design & Fab - February 2008 - Modeling (Page 25) Printed Circuit Design & Fab - February 2008 - Modeling (Page 26) Printed Circuit Design & Fab - February 2008 - Modeling (Page 27) Printed Circuit Design & Fab - February 2008 - Design Tools (Page 28) Printed Circuit Design & Fab - February 2008 - Design Tools (Page 29) Printed Circuit Design & Fab - February 2008 - Design Tools (Page 30) Printed Circuit Design & Fab - February 2008 - Design Tools (Page 31) Printed Circuit Design & Fab - February 2008 - Optical Interconnect (Page 32) Printed Circuit Design & Fab - February 2008 - Optical Interconnect (Page 33) Printed Circuit Design & Fab - February 2008 - Optical Interconnect (Page 34) Printed Circuit Design & Fab - February 2008 - Optical Interconnect (Page 35) Printed Circuit Design & Fab - February 2008 - Optical Interconnect (Page 36) Printed Circuit Design & Fab - February 2008 - Optical Interconnect (Page 37) Printed Circuit Design & Fab - February 2008 - Trade Shows (Page 38) Printed Circuit Design & Fab - February 2008 - Trade Shows (Page 39) Printed Circuit Design & Fab - February 2008 - Laminate Materials (Page 40) Printed Circuit Design & Fab - February 2008 - Laminate Materials (Page 41) Printed Circuit Design & Fab - February 2008 - Laminate Materials (Page 42) Printed Circuit Design & Fab - February 2008 - Off the Shelf (Page 43) Printed Circuit Design & Fab - February 2008 - Marketplace (Page 44) Printed Circuit Design & Fab - February 2008 - Marketplace (Page 45) Printed Circuit Design & Fab - February 2008 - Marketplace (Page 46) Printed Circuit Design & Fab - February 2008 - Ad Index (Page 47) Printed Circuit Design & Fab - February 2008 - BGA Bulletin (Page 48) Printed Circuit Design & Fab - February 2008 - BGA Bulletin (Page Cover3) Printed Circuit Design & Fab - February 2008 - BGA Bulletin (Page Cover4)
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