Printed Circuit Design & Fab - February 2008 - (Page 13) VISIT VISIT US US AT AT DESIGNCON DESIGNCON BOOTH BOOTH #803 #803 GOING GREEN? GOING GREEN? More than performance friendly, we’re environmentally friendly too. We've decreased the need Morethose discrete capacitorsfriendly,associatedenvironmentally friendlytotoo. We've decreased the need for all than performance and the we’re material and energy needed manufacture and assemble them. for all those discrete capacitors and the associated material and energy needed to manufacture and assemble them. BENEFITS OF BURIED CAPACITANCE™ BENEFITS OF BURIED CAPACITANCE™and » Reduction in Discrete Capacitors FEATURES OF FARADFLEX® FEATURES OF FARADFLEX® » RoHS and WEEE Compliant » Associated in Discrete Concerns ofand Reduction Reliability Capacitors Solder Joints AssociatedPower Distribution System » Improved Reliability Concerns of Solder Joints » » » » Improved Power and/or increased Reduced PCB sizeDistribution System functionality Reduced PCB size and/or increased functionality Reduced Board thickness » RoHS and with Compliant » CompatibleWEEE Lead-Free Assembly » Compatible withthat is Compatible » Robust Product Lead-Free Assembly » with Standard PCB Processes Robust Product that is Compatible with Standard PCB Processesand Thinnest » Highest Capacitance Density » ProductsCapacitance Density and Thinnest Highest Available » Products Available (Hi-Pot) Tested 100% High Potential » 100% High Potential (Hi-Pot) Tested To start enjoying the benefits of Buried Capacitance technology using thestart enjoying the benefits of BuriedOak-Mitsui Technologies: using To FaradFlex line of products contact Capacitance technology (518) 686-4961 orofFaradFlex.Sales@oakmitsui.com. the FaradFlex line products contact Oak-Mitsui Technologies: (518) us at www.oakmitsui.com Visit 686-4961 or FaradFlex.Sales@oakmitsui.com. » Reduced Board thickness » Improved EMC/EMI » Improved EMC/EMI Visit us at www.oakmitsui.com ENHANCING SPEED AND PERFORMANCE, ONE LAYER AT A TIME. ENHANCING SPEED AND PERFORMANCE, ONE LAYER AT A TIME. http://www.oakmitsui.com http://www.oakmitsui.com
Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - February 2008 Printed Circuit Design & Fab - February 2008 Contents Our Line Market Watch Around the World Happenings ROI Tip Jar Interconnect Strategies IC/PCB Co-Design Modeling Design Tools Optical Interconnect Trade Shows Laminate Materials Off the Shelf Marketplace Ad Index BGA Bulletin Printed Circuit Design & Fab - February 2008 Printed Circuit Design & Fab - February 2008 - Printed Circuit Design & Fab - February 2008 (Page Cover1) Printed Circuit Design & Fab - February 2008 - Printed Circuit Design & Fab - February 2008 (Page Cover2) Printed Circuit Design & Fab - February 2008 - Printed Circuit Design & Fab - February 2008 (Page 1) Printed Circuit Design & Fab - February 2008 - Contents (Page 2) Printed Circuit Design & Fab - February 2008 - Contents (Page 3) Printed Circuit Design & Fab - February 2008 - Our Line (Page 4) Printed Circuit Design & Fab - February 2008 - Our Line (Page 5) Printed Circuit Design & Fab - February 2008 - Market Watch (Page 6) Printed Circuit Design & Fab - February 2008 - Market Watch (Page 7) Printed Circuit Design & Fab - February 2008 - Around the World (Page 8) Printed Circuit Design & Fab - February 2008 - Around the World (Page 9) Printed Circuit Design & Fab - February 2008 - Around the World (Page 10) Printed Circuit Design & Fab - February 2008 - Around the World (Page 11) Printed Circuit Design & Fab - February 2008 - Happenings (Page 12) Printed Circuit Design & Fab - February 2008 - Happenings (Page 13) Printed Circuit Design & Fab - February 2008 - ROI (Page 14) Printed Circuit Design & Fab - February 2008 - ROI (Page 15) Printed Circuit Design & Fab - February 2008 - Tip Jar (Page 16) Printed Circuit Design & Fab - February 2008 - Tip Jar (Page 16A) Printed Circuit Design & Fab - February 2008 - Tip Jar (Page 16B) Printed Circuit Design & Fab - February 2008 - Interconnect Strategies (Page 17) Printed Circuit Design & Fab - February 2008 - Interconnect Strategies (Page 18) Printed Circuit Design & Fab - February 2008 - Interconnect Strategies (Page 19) Printed Circuit Design & Fab - February 2008 - IC/PCB Co-Design (Page 20) Printed Circuit Design & Fab - February 2008 - IC/PCB Co-Design (Page 21) Printed Circuit Design & Fab - February 2008 - IC/PCB Co-Design (Page 22) Printed Circuit Design & Fab - February 2008 - IC/PCB Co-Design (Page 23) Printed Circuit Design & Fab - February 2008 - Modeling (Page 24) Printed Circuit Design & Fab - February 2008 - Modeling (Page 25) Printed Circuit Design & Fab - February 2008 - Modeling (Page 26) Printed Circuit Design & Fab - February 2008 - Modeling (Page 27) Printed Circuit Design & Fab - February 2008 - Design Tools (Page 28) Printed Circuit Design & Fab - February 2008 - Design Tools (Page 29) Printed Circuit Design & Fab - February 2008 - Design Tools (Page 30) Printed Circuit Design & Fab - February 2008 - Design Tools (Page 31) Printed Circuit Design & Fab - February 2008 - Optical Interconnect (Page 32) Printed Circuit Design & Fab - February 2008 - Optical Interconnect (Page 33) Printed Circuit Design & Fab - February 2008 - Optical Interconnect (Page 34) Printed Circuit Design & Fab - February 2008 - Optical Interconnect (Page 35) Printed Circuit Design & Fab - February 2008 - Optical Interconnect (Page 36) Printed Circuit Design & Fab - February 2008 - Optical Interconnect (Page 37) Printed Circuit Design & Fab - February 2008 - Trade Shows (Page 38) Printed Circuit Design & Fab - February 2008 - Trade Shows (Page 39) Printed Circuit Design & Fab - February 2008 - Laminate Materials (Page 40) Printed Circuit Design & Fab - February 2008 - Laminate Materials (Page 41) Printed Circuit Design & Fab - February 2008 - Laminate Materials (Page 42) Printed Circuit Design & Fab - February 2008 - Off the Shelf (Page 43) Printed Circuit Design & Fab - February 2008 - Marketplace (Page 44) Printed Circuit Design & Fab - February 2008 - Marketplace (Page 45) Printed Circuit Design & Fab - February 2008 - Marketplace (Page 46) Printed Circuit Design & Fab - February 2008 - Ad Index (Page 47) Printed Circuit Design & Fab - February 2008 - BGA Bulletin (Page 48) Printed Circuit Design & Fab - February 2008 - BGA Bulletin (Page Cover3) Printed Circuit Design & Fab - February 2008 - BGA Bulletin (Page Cover4)
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