Printed Circuit Design & Fab - February 2008 - (Page 19) INTERCONNECT STRATEGIES FIGURE 3. Eye diagram together with eye mask belonging to a high-speed serial link. FIGURE 4. Total jitter measured using an Agilent Infiniium Real-Time DSO. masks that ascertain compliance or non-compliance12. Many high-speed serial links incorporate 8b/10b encoding12 to guarantee minimum transition of data (to aid receiver recover clock) and apply scrambler to reduce EMI. Certain test equipment such as Agilent Infiniium DSO81204A (12 GHz 40 GSa/s) allow jitter measurements on ultra-fast serial signals and can display total jitter, random jitter, deterministic jitter, data-dependent jitter, as well as pattern and periodic jitter. An example is illustrated by FIGURE 4, which decomposes jitter into subcomponents to facilitate debugging. Figure 4 also displays histogram and bit error rate (BER) bathtub curves. Such displays are useful for quickly correlating15 multiple answers, detecting Intersysmbol interference (ISI), and knowing whether the device meets the standard. ISI can be caused by transmission line losses (which degrade signal rise time) and lead to degradation of the eye diagram13. BER is an important metric16 for quantifying the performance of high-speed serial architectures. The BER and jitter analyses/testing have become a necessity to assure performance requirements for highspeed serial links, particularly due to the increasing data speeds. PCD&F DR. ABE (ABBAS) RIAZI is a senior staff electronic scientist with ServerWorks (a Broadcom Company) in Santa Clara, CA. REFERENCES 1. Greg Edlund, ”Timing Analysis and Simulation for Signal Integrity Engineers” Prentice , Hall, 2007, P PP 13-14. .2, . 2. Jim Peterson, “Timing Numbers from ICX - What Do We Do With Them?” Mentor Graphics International User Conference May 2-5, 2006. 3. Abe Riazi, “ Timing Analysis Principles for Digital PCBs, Part 2” Printed Circuit Design , & Manufacture, June 2006, PP 20-21. . 4. Abe Riazi, “ Timing Analysis Principles for Digital PCBs, Part 3” Printed Circuit Design , & Manufacture, August 2006, PP 16-17. . 5. Tod Westerhoff, “Closing the loop between timing analysis and signal integrity“ , Cadence Online Seminar, August 28, 2000. 6. “DDR2 Design Guide For Two-DIMM Systems” Micron Technical Note, TN-47-01. 7. Tom Granberg, “Handbook of Digital Tech, niques for High-Speed Design“ Prentice Hall, 2004“ PP 583-586. . 8. Stephen H. Hall, Garrett W. Hall, James A. McCall, “High-Speed Digital Design, A Handbook of Interconnect Theory and Design Practices, “John Wiley and Sons Inc., 2000, PP 186-190. . 9. Bill Hargin, “Managing Signal Quality” Xcell , Journal, Second Quarter, 2005. 10. Abe Riazi, “Signal Quality Assessment” , Printed Circuit Design & Manufacture, June 2007. PP 16-17 . 11. Roy G. Leventhal and Lynne Green, “Semiconductor Modeling For Simulating Signal, Power, and Electromagnetic Integrity” , Springer, 2006, P 30. . 12. “The Basics of Serial Data Compliance and Validation Measurements”Tektronix. , 13. Eric Bogatin, Signal Integrity – Simplified, Prentice Hall, 2004, PP 333-335, PP . . 398-399. 14. Min Wang, Henri Maramis, Donald Telian, Kevin Chung “New Techniques for Designing and Analyzing Multi-GigaHertz Serial Links” DesignConn 2005. , 15. “Agilent 86100C Infiniium DCA-J, the fast, est way to the right answer” Agilent Technologies. 16. Mike P Li, and Dennis Petrich, “Charac. terization and Production Testing At 3.2-5.0 GB/s for PCI Express II and FB DIMM” 2006 , Wavecrest Corp. CHICAGO. SPRING. YOU. MAY 2008. Join us for PCB East 2008 May 11-16 in Tinley Park, IL. www.pcbeast.com ACKNOWLEDGEMENTS Special thanks to Richard Kuo for reviewing the manuscript and providing valuable comments. FEBRUARY 2008 PRINTED CIRCUIT DESIGN & FAB 19 http://www.pcbeast.com http://www.pcbeast.com
Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - February 2008 Printed Circuit Design & Fab - February 2008 Contents Our Line Market Watch Around the World Happenings ROI Tip Jar Interconnect Strategies IC/PCB Co-Design Modeling Design Tools Optical Interconnect Trade Shows Laminate Materials Off the Shelf Marketplace Ad Index BGA Bulletin Printed Circuit Design & Fab - February 2008 Printed Circuit Design & Fab - February 2008 - Printed Circuit Design & Fab - February 2008 (Page Cover1) Printed Circuit Design & Fab - February 2008 - Printed Circuit Design & Fab - February 2008 (Page Cover2) Printed Circuit Design & Fab - February 2008 - Printed Circuit Design & Fab - February 2008 (Page 1) Printed Circuit Design & Fab - February 2008 - Contents (Page 2) Printed Circuit Design & Fab - February 2008 - Contents (Page 3) Printed Circuit Design & Fab - February 2008 - Our Line (Page 4) Printed Circuit Design & Fab - February 2008 - Our Line (Page 5) Printed Circuit Design & Fab - February 2008 - Market Watch (Page 6) Printed Circuit Design & Fab - February 2008 - Market Watch (Page 7) Printed Circuit Design & Fab - February 2008 - Around the World (Page 8) Printed Circuit Design & Fab - February 2008 - Around the World (Page 9) Printed Circuit Design & Fab - February 2008 - Around the World (Page 10) Printed Circuit Design & Fab - February 2008 - Around the World (Page 11) Printed Circuit Design & Fab - February 2008 - Happenings (Page 12) Printed Circuit Design & Fab - February 2008 - Happenings (Page 13) Printed Circuit Design & Fab - February 2008 - ROI (Page 14) Printed Circuit Design & Fab - February 2008 - ROI (Page 15) Printed Circuit Design & Fab - February 2008 - Tip Jar (Page 16) Printed Circuit Design & Fab - February 2008 - Tip Jar (Page 16A) Printed Circuit Design & Fab - February 2008 - Tip Jar (Page 16B) Printed Circuit Design & Fab - February 2008 - Interconnect Strategies (Page 17) Printed Circuit Design & Fab - February 2008 - Interconnect Strategies (Page 18) Printed Circuit Design & Fab - February 2008 - Interconnect Strategies (Page 19) Printed Circuit Design & Fab - February 2008 - IC/PCB Co-Design (Page 20) Printed Circuit Design & Fab - February 2008 - IC/PCB Co-Design (Page 21) Printed Circuit Design & Fab - February 2008 - IC/PCB Co-Design (Page 22) Printed Circuit Design & Fab - February 2008 - IC/PCB Co-Design (Page 23) Printed Circuit Design & Fab - February 2008 - Modeling (Page 24) Printed Circuit Design & Fab - February 2008 - Modeling (Page 25) Printed Circuit Design & Fab - February 2008 - Modeling (Page 26) Printed Circuit Design & Fab - February 2008 - Modeling (Page 27) Printed Circuit Design & Fab - February 2008 - Design Tools (Page 28) Printed Circuit Design & Fab - February 2008 - Design Tools (Page 29) Printed Circuit Design & Fab - February 2008 - Design Tools (Page 30) Printed Circuit Design & Fab - February 2008 - Design Tools (Page 31) Printed Circuit Design & Fab - February 2008 - Optical Interconnect (Page 32) Printed Circuit Design & Fab - February 2008 - Optical Interconnect (Page 33) Printed Circuit Design & Fab - February 2008 - Optical Interconnect (Page 34) Printed Circuit Design & Fab - February 2008 - Optical Interconnect (Page 35) Printed Circuit Design & Fab - February 2008 - Optical Interconnect (Page 36) Printed Circuit Design & Fab - February 2008 - Optical Interconnect (Page 37) Printed Circuit Design & Fab - February 2008 - Trade Shows (Page 38) Printed Circuit Design & Fab - February 2008 - Trade Shows (Page 39) Printed Circuit Design & Fab - February 2008 - Laminate Materials (Page 40) Printed Circuit Design & Fab - February 2008 - Laminate Materials (Page 41) Printed Circuit Design & Fab - February 2008 - Laminate Materials (Page 42) Printed Circuit Design & Fab - February 2008 - Off the Shelf (Page 43) Printed Circuit Design & Fab - February 2008 - Marketplace (Page 44) Printed Circuit Design & Fab - February 2008 - Marketplace (Page 45) Printed Circuit Design & Fab - February 2008 - Marketplace (Page 46) Printed Circuit Design & Fab - February 2008 - Ad Index (Page 47) Printed Circuit Design & Fab - February 2008 - BGA Bulletin (Page 48) Printed Circuit Design & Fab - February 2008 - BGA Bulletin (Page Cover3) Printed Circuit Design & Fab - February 2008 - BGA Bulletin (Page Cover4)
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