Printed Circuit Design & Fab - February 2008 - (Page 2)

FEBRUARY 2008 • VOL. 25 • NO. 2 Optical interconnects enable higher frequencies and increase design options. Solid-state package and chip system courtesy of Stratos, a subsidiary of Emerson Connectivity Solutions. Connectorized encapsulated polymer waveguides courtesy of Optical InterLinks LLC, a Martra Company. FEATURES 20 IC/PCB CO-DESIGN Improving Circuit Design Using IC Package/PCB Co-Design Techniques Dynamic new co-design strategies will give the PCB designer the flexibility to re-map legacy package pinouts. by MARTIN HART POINT OF VIEW 4 24 MODELING OUR LINE Waste not, want not. SPICE Modeling from an EM Simulation Environment The use of full-wave electromagnetic modeling can simulate the behavior of a high-speed differential backplane channel and advance the system-level design process. by EUGENE MAYEVSKYI and FABRIZIO ZANELLA 28 DESIGN TOOLS Kathy Nargi-Toth 14 ROI A good capital plan juggles the requirements for infrastructure replacement and technology upgrades. Post Route Signal Integrity Design Rule Checking Design rule checkers can eliminate human error, lower costs and speed time-tomarket for highly constrained PCBs. by GUY DE BURGH and GENE GARAT 32 OPTICAL INTERCONNECT Peter Bigelow 16 OPTOELECTRONICS COMES OF AGE TIP JAR Understanding the information provided by the manufacturer allows the designer to be more proficient in the board layout process. Optical interconnects are expected to significantly increase computing power in products with ultra-high frequency data rates, increasing its usage over the next 5 years. by DR. BRUCE L. BOOTH and JACK FISHER 38 TRADE SHOWS Susy Webb 17 What Drives the Crowd? A great technical conference and location are most important, readers say. by MIKE BUETOW 40 LAMINATE MATERIALS INTERCONNECT STRATEGIES Successful design/characterization of PCB high-speed interfaces frequently demand analyses of timing margins and jitter. Advanced Glass Reinforcement Technology for Improved Signal Integrity New glass fabrics promise to resolve challenges in high tech PCB design and fabrication. by RUSSELL DUDEK, PATRICIA GOLDMAN and JOHN KUHN Dr. Abe Riazi 48 BGA BULLETIN Next generation ASIC and FPGA packages with 0.8-mm pitch and over 2,000 pins will require the use of HDI to accomplish BGA routing. DEPARTMENTS 6 8 Charles Pfeil MARKET WATCH AROUND THE WORLD 12 43 HAPPENINGS OFF THE SHELF 44 47 MARKETPLACE AD INDEX Circuits Assembly Online XRF Equipment as a RoHS Screening Tool A jointly funded industry/DTI collaborative project, led by the National Physical Laboratory, investigated the suitability of XRF techniques for determining the presence and levels of RoHS-restricted substances in typical electronics components. The 15-system study circuitsassembly.com found most – but not all – are viable. by MARTIN WICKHAM and DR. CHRISTOPHER HUNT Time to Decommoditize PWB Fabrication Pennies saved on the front end can cost big money in rework. by CHRYS SHEA POSTMASTER: Send address changes to PRINTED CIRCUIT DESIGN & FAB, P.O. Box 35646, Tulsa, OK 74153-0646 http://circuitsassembly.com

Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - February 2008

Printed Circuit Design & Fab - February 2008 Contents Our Line Market Watch Around the World Happenings ROI Tip Jar Interconnect Strategies IC/PCB Co-Design Modeling Design Tools Optical Interconnect Trade Shows Laminate Materials Off the Shelf Marketplace Ad Index BGA Bulletin

Printed Circuit Design & Fab - February 2008

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