Printed Circuit Design & Fab - February 2008 - (Page 29) FIGURE 5. Highlighted in white is a rule violation. FIGURE 4. Critical net list. review signal integrity design flow. FIGURE 1 shows a typical highspeed signal integrity design flow1. One of the important goals here is to generate design rules. The 2D field solver software is used to determine rules for board stack-up, impedance, trace width and spacing. Simulation predicts delay and crosstalk. There is a certain amount of overhead required for simulation, i.e., obtaining and verifying simulation models, careful setup and rigorous interpretation of the results by signal integrity engineers, etc. The tools in this flow can be used many times in the design of a PCB. The user needs to be well versed in signal integrity concepts, cause and effect, and interpretation of the analysis. In addition, the time to run this flow can be significantly long. In contrast, FIGURE 2 shows the design rule program flow – it is very simple, easy to configure, and with a very short learning (and re-learning) curve. The program has a short run time, and the user need not be a signal integrity expert. As companies may send PCB designs to other areas of the world for their fabrication, this flow would be used by a designer during the layout process and before a formal design review in order to avoid major rework. The following examples show how a design rule checker works. The database was created in Cadence Allegro, and the Design Rule Checker is IBM’s With 35 years of experience We make our own laminates in the U.S. • Material types in FR-4 Difunctional, Tetrafunctional and Multifunctional • Temperature ratings from 130˚C to 177˚C • Thickness ranges from .0025” to 3.000” • Coppers from 1/2 oz. to 6 oz. in stock • Black, Blue, Tan, Green, Orange & Natural • True Cryogenic G10 • Sheet sizes in 36”x48” • RoHS compliant, UL recognized and IPC approved Same Day Pricing and Lead Times Current, Inc. 30 Tyler St. Ext • East Haven, CT 06512 1-877-436-6542 • Fax 203-467-8435 www.currentcomposites.com Louis S. Owen, Director of Outside Sales 860-350-9607 • Fax 860-210-1748 FEBRUARY 2008 PRINTED CIRCUIT DESIGN & FAB 29 http://www.currentcomposites.com http://www.chemcut.com http://www.chemcut.com http://www.currentcomposites.com
Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - February 2008 Printed Circuit Design & Fab - February 2008 Contents Our Line Market Watch Around the World Happenings ROI Tip Jar Interconnect Strategies IC/PCB Co-Design Modeling Design Tools Optical Interconnect Trade Shows Laminate Materials Off the Shelf Marketplace Ad Index BGA Bulletin Printed Circuit Design & Fab - February 2008 Printed Circuit Design & Fab - February 2008 - Printed Circuit Design & Fab - February 2008 (Page Cover1) Printed Circuit Design & Fab - February 2008 - Printed Circuit Design & Fab - February 2008 (Page Cover2) Printed Circuit Design & Fab - February 2008 - Printed Circuit Design & Fab - February 2008 (Page 1) Printed Circuit Design & Fab - February 2008 - Contents (Page 2) Printed Circuit Design & Fab - February 2008 - Contents (Page 3) Printed Circuit Design & Fab - February 2008 - Our Line (Page 4) Printed Circuit Design & Fab - February 2008 - Our Line (Page 5) Printed Circuit Design & Fab - February 2008 - Market Watch (Page 6) Printed Circuit Design & Fab - February 2008 - Market Watch (Page 7) Printed Circuit Design & Fab - February 2008 - Around the World (Page 8) Printed Circuit Design & Fab - February 2008 - Around the World (Page 9) Printed Circuit Design & Fab - February 2008 - Around the World (Page 10) Printed Circuit Design & Fab - February 2008 - Around the World (Page 11) Printed Circuit Design & Fab - February 2008 - Happenings (Page 12) Printed Circuit Design & Fab - February 2008 - Happenings (Page 13) Printed Circuit Design & Fab - February 2008 - ROI (Page 14) Printed Circuit Design & Fab - February 2008 - ROI (Page 15) Printed Circuit Design & Fab - February 2008 - Tip Jar (Page 16) Printed Circuit Design & Fab - February 2008 - Tip Jar (Page 16A) Printed Circuit Design & Fab - February 2008 - Tip Jar (Page 16B) Printed Circuit Design & Fab - February 2008 - Interconnect Strategies (Page 17) Printed Circuit Design & Fab - February 2008 - Interconnect Strategies (Page 18) Printed Circuit Design & Fab - February 2008 - Interconnect Strategies (Page 19) Printed Circuit Design & Fab - February 2008 - IC/PCB Co-Design (Page 20) Printed Circuit Design & Fab - February 2008 - IC/PCB Co-Design (Page 21) Printed Circuit Design & Fab - February 2008 - IC/PCB Co-Design (Page 22) Printed Circuit Design & Fab - February 2008 - IC/PCB Co-Design (Page 23) Printed Circuit Design & Fab - February 2008 - Modeling (Page 24) Printed Circuit Design & Fab - February 2008 - Modeling (Page 25) Printed Circuit Design & Fab - February 2008 - Modeling (Page 26) Printed Circuit Design & Fab - February 2008 - Modeling (Page 27) Printed Circuit Design & Fab - February 2008 - Design Tools (Page 28) Printed Circuit Design & Fab - February 2008 - Design Tools (Page 29) Printed Circuit Design & Fab - February 2008 - Design Tools (Page 30) Printed Circuit Design & Fab - February 2008 - Design Tools (Page 31) Printed Circuit Design & Fab - February 2008 - Optical Interconnect (Page 32) Printed Circuit Design & Fab - February 2008 - Optical Interconnect (Page 33) Printed Circuit Design & Fab - February 2008 - Optical Interconnect (Page 34) Printed Circuit Design & Fab - February 2008 - Optical Interconnect (Page 35) Printed Circuit Design & Fab - February 2008 - Optical Interconnect (Page 36) Printed Circuit Design & Fab - February 2008 - Optical Interconnect (Page 37) Printed Circuit Design & Fab - February 2008 - Trade Shows (Page 38) Printed Circuit Design & Fab - February 2008 - Trade Shows (Page 39) Printed Circuit Design & Fab - February 2008 - Laminate Materials (Page 40) Printed Circuit Design & Fab - February 2008 - Laminate Materials (Page 41) Printed Circuit Design & Fab - February 2008 - Laminate Materials (Page 42) Printed Circuit Design & Fab - February 2008 - Off the Shelf (Page 43) Printed Circuit Design & Fab - February 2008 - Marketplace (Page 44) Printed Circuit Design & Fab - February 2008 - Marketplace (Page 45) Printed Circuit Design & Fab - February 2008 - Marketplace (Page 46) Printed Circuit Design & Fab - February 2008 - Ad Index (Page 47) Printed Circuit Design & Fab - February 2008 - BGA Bulletin (Page 48) Printed Circuit Design & Fab - February 2008 - BGA Bulletin (Page Cover3) Printed Circuit Design & Fab - February 2008 - BGA Bulletin (Page Cover4)
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